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The R-Car E2 SoC Delivers Scalability, Higher Integration and Increased Performance Optimized for Entry-Level Systems Renesas Electronics Corporation (TSE: 6723), a premier provider
I’m taking a class on academic writing this semester. It’s been quite the experience. For...
Will soft (hardware) and software IP dominate the IoT market? Experts from IPExtreme, Atmel, GarySmithEDA,...
USB, HDMI, or analog signals degrade to mush over long signal traces or cables; check out these “before...
Targeting secure cloud servers, storage servers, compute servers, and data-plane applications, the ThunderX...
Introduction / (Consumerization: BYOD)
Synopsys combines cell-aware, slack-based test to find transient defects, adds eFlash support / (Tech Deseign Forums Blog)
Two approaches to greater reliability revealed in Synopsys ATPG and DesignWare updates...
Blog Post: JESD204B: Understanding subclasses (part 1) / (TI E2E Community)
In this blog, I’ll look at a key feature of the JESD204B standard that defines a method to achieve deterministic latency for each link and subsequently multi-device synchronization. Some applications, such as synchronous sampling, multi-channel phase arrays and gain control loops, are sensitive to latency,...
Canonical's latest Linux, Ubuntu 14.10, saves the biggest improvements for its cloud and server versions....
Best practices, standards and a diverse ecosystem are essential for embedded developers to mitigate threats such as stack overflows and software backdoors.
Acting on “inside information” can yield a competitive advantage, but for hunting down signal processing anomalies, exploring root causes could take more than just “inside-the-chip” tools.
Integrated solutions ease the challenge of bringing together sensors and transmitters.
AMD adds “Hierofalcon” ARM to its x86-based embedded and server line-up. It’s been over a year since first announced, but AMD demoed its 8-core, ARM Cortex A57-based “Hierofalcon”
The health benefits in our future might just rest on how hale, hardy (and cost-effective) developers, including start-ups, can make their implantable medical device proof-of-concepts—and that warrants a close look at ASSP chips for help with size, power and development time hurdles.
The board would have used an FPGA approach to speed processing and I/O. Then it became possible to leverage Intel® architecture and next generation network and IA advances to meet IT, cloud and call center demands.
System integrators determined to get to market faster while bringing their customers the advantages of remote software management, the flexibility to deploy multiple screens and media players over many locations and real-time updates and synchronization have options not available until now.
The Intel® Atom™ processor E6xx series helps strike the right chords for a 3U CompactPCI SBC designed to the highest safety integration level (SIL) for functional railway safety—and tuned to the safety-critical needs of markets like industrial automation and medical engineering, too.
The next generation of Digital Security Surveillance systems is looking to innovative SDK approaches as developers seek to expand DSS performance without a higher TCO price tag.
New processors to tackle applications ranging from superservers to connected IoT solutions took center stage at this year’s Intel Developer Forum. Intel rolled out its next-generation of Xeon processors with up to 18 cores—the E5-2600 v3 family —as well as its Core M series of dual-core low-power (sub 4.5 W) processors.
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4th Generation Intel® Core™ Processor-Based Modular-Designed Embedded Systems Wide Voltage, Custom I/O Module
DFI Inc. 4th Generation Intel® Core™ Processor-Based Modular-Designed Embedded Systems Wide Voltage, Custom I/O Module [company]
GOT3177T-834 - 17” SXGA TFT Flat Front Bezel Touch Panel Computer with Intel® Celeron processor J1900
The GOT3177T-834 is one of the most advanced fanless, noiseless, touch panel computers available today. This all-in-one panel PC is powered by the quad-core Intel® Celeron® processor
The Artesyn SharpStreamer PCIE-7207 high-density video accelerator enables service provider networks to offer video transcoding services quickly and dynamically. As an add-on card,
The Artesyn ATCA-7480 blade is based on two members of the Intel® Xeon® processor E5-2600 v3 product family with up to 28 processing cores per blade. Data paths to main memory and
The ADLMES-8200 is a highly innovative embedded enclosure design. Its highly configurable modularity makes it possible to expand or reduce a system without replacing the entire enclosure.
The ADLE3800PC is based on Intel’s first System-on-Chip (SoC) Intel® Atom™ processor E3800 product family, which is built using Intel’s 22nm 3D Tri-gate process. It offers vastly
A mobile Wi-Fi Software Suite that utilizes the TI WiLink™ 6.0, WiLink 7.0 and WiLink 8.0 series mobile Wi-Fi chipsets (TI WL127x / WL128x/WL18xx) to create a truly portable Mobile