Hybricon Corporation is once again leading the electronic packaging industry as chair for the PICMG Rugged MicroTCA.2 team. The PICMG Rugged MicroTCA Subcommittee will address higher levels of environmental stresses as compared to the PICMG Rugged MicroTCA.1 efforts. Currently, Hybricon is the only electronic packaging organization which manufactures both a rugged forced air convection cooled ATR as well as a rugged forced air conduction cooled proof of concept ATR.

TECHNICAL SPECS

• Rugged MicroTCA Convection Cooled ATR:
  • Top Load 1 ATR Tall Long with shock mount MicroTCA card cage.

• Rugged MircoTCA Conduction Cooled ATR:
  • Design Concept targeting ANSI/VITA 47 Ruggedization Levels.
  • Conduction cooling allows the modules to be environmently isolated from the external environment (etc. humidity, dust, salt fog)