The NESA/F9-Systems ThermalBlade offers the flexibility to verify the thermal characteristics of your AdvancedTCA chassis, logic cards and backplane designs. Emulating typical application component heights and features, airflow resistance and enclosure power dissipation can be evaluated and analyzed. A variety of power conditions can be selected and controlled independently to meet your design needs.

FEATURES & BENEFITS

• AdvancedTCA chassis compatible design.
• Provides a thermal load of up to 200 Watts per slot from a redundant ATCA –48 VDC backplane.
• Operates over the entire –36 to –72 VDC voltage range without damage to thermal board.
• User switchable variable thermal load choices of 1/3, 2/3 and full load are provided to test the power and thermal systems of an ATCA chassis.
• Mimics aerodynamics of a typical high performance board. Heat sinks can be added as appropriate.
• Provision for the specified 50 watt power connection to an AdvancedTCA RTMThermalBlade (available separately).
• On-card thermocouple temperature measurements at nine data points.
• All UL and IEC safety design features are incorporated, including fusing, thermal shutdown, and adequate copper weight.
• Designed with ATCA ESD and internationally mandated safety and thermal shutdown features.

AVAILABILITY

1-2 weeks ARO.

Contact Information

NESA/F9 Systems, Inc.

P.O. Box 807
Marshfield, MA, 02050
USA

tele: +1.781.837.9088
fax: +1.781.837.9088
esayre@nesa.com
www.F9-Systems.com