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LTE vs LTE Advanced: What you need to know about carrier aggregation
Where Does FAT Fail? - Exploring Compromises in this Ubiquitous File System Format.
Developing Secure Embedded Software: Quality Doesn’t Equal Security
Using an Embedded Vision Processor to Build and Efficient Object Recognition System
Ethernet in the Connected World
Parasoft Embedded Testing Starter Kit
Migrating Consumer Electronics to the Automotive World
Innovations in Automotive Wireless
09/12/17 How various wireless communication protocols are shaping the automobile’s future. Though...
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Ethernet Portfolio Expansion: No Signs of Stopping
09/12/17 The role of optics in Ethernet is undeniable. At OFC 2017 the Ethernet Alliance hosted a multivendor...
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Silvaco - SOC Soln's Acquisition Reflect Systems Trend in IP
09/08/17 With completion of the Silvaco acquisition of SOC Solutions, Electronic System Design sat down with the principals from each company to talk about the future....
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The Ascent of the Core Infrastructure Initiative
09/07/17 How a bug created a superfund for cash-strapped open source projects It’s not an uncommon...
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Silvaco - SOC Soln's Acquisition Reflect Systems Trend in IP
08/31/17 With completion of the Silvaco acquisition of SOC Solutions, Electronic System Design sat down with the principals from each company to talk about the future....
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Round Table: Why the Glove Compartment Has an Ethernet Roadmap
08/22/17 OEMs targeting the automotive space can look forward to more time spent on such areas of differentiation...
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Custom Cars for Everyone with 3D Printing?
08/21/17 Why mass-scale personalization of cars is not right around the corner Ultimately, as humans,...
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Power to the People—Delivering on the Promise of PoE
08/15/17 Why finding products certified against IEEE 802.3 PoE standards has become easier. The Ethernet...
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New Products
MIPI® Alliance to Host DevCon Event in the Heart of Taiwan’s High-Tech Sector: Hsinchu City 09/20/17
ESC Silicon Valley 2017 Announces Full Conference Schedule, Keynote Speakers 09/14/17
Mercury Systems Announces Safety-Certifiable, Multi-Core Software Renderer 09/14/17
ROHM's New Power Supply IC Featuring the Industry’s Highest Step-Down Ratio: 60V Input →2.5V Output (at 2MHz) 09/13/17
Renesas Electronics and Codeplay Collaborate on OpenCL™ and SYCL™ for ADAS Solutions 09/12/17
Nextchip License CEVA Imaging and Vision Platform for ADAS Vision System 09/12/17
Renesas Electronics High-Performance Automotive Chips Adopted by Nissan for its New LEAF Automated-Parking System 09/07/17
Synopsys Experts, Customers and Partners to Present the Latest Trends and Technologies in Embedded Processor Solutions 09/06/17
Featured Blogs
Chris A. Ciufo on All Things Embedded
Does Secure Erase Actually Work?
Chris A. Ciufo, Editor, Embedded Systems Engineering In this Part 2 of 2, I examine the subject of using...
Iconic Embedded
Who is Taking Cybersecurity Seriously, and why You Should be Worried
By Alan Grau, Icon Labs On a daily basis, I have the opportunity to interact with a wide range of companies...
5G and automotive provide applications focus for DVCon Europe / (Tech Deseign Forums Blog)
The massive complexity of 5G and automotive systems and the need for advanced verification techniques set the scene for DVCon Europe this year....
Comment on Buck-boost regulator benefits automotive conducted immunity / (TI E2E Community)
Hi there Thanks for your help. Sorry to bother you. I am new to the design. So could you please guide me with the questions I've read in one of the forum the transient spikes might go up to 200V. But the automotive transient profile shows up to 150V. Can I still able to use the LM5175-Q1 in my application? Can I use...
How to Get to a Trillion Devices in the Internet of Things in 2035 / (Frank Schirrmeister Blog)
Next month at Arm TechCon, one of the key discussion topics with be the internet of things (IoT), especially after Masayoshi Son, Arm's "parent" Softbank’s CEO, took the stage last year and boldly predicted that “more important, in the next 20 years, we will see 1 trillion internet of things devices.”...
Cadence IP Is Great for Automotive / (Denali Memory Blog)
If you’re designing chips for in-vehicle infotainment, in-cabin electronics, vision systems, digital noise reduction, and advanced driver assistance systems (ADAS), look at Cadence for the key IP to speed your design effort. We just announced that we have collaborated with a major foundry to produce an IP portfolio...
Recommended Technology Papers
LTE vs LTE Advanced: What you need to know about carrier aggregation
The latest enhancement to LTE, known as LTE-Advanced or LTE-A, is an extensive set of new features that improve performance and increase reliability. Of these many features, carrier aggregation is perhaps the most important, because it simplifies traffic management while improving practical data rates and enhancing network capacity.
Where Does FAT Fail? - Exploring Compromises in this Ubiquitous File System Format.
As an early option for data organization, the FAT file system attained a certain ubiquity. This paper examines characteristics of the FAT file system that leave it vulnerable to corruption, and some ways vendors (including Microsoft) are trying to make it more reliable. Can reliability be achieved without sacrificing interoperability? Is the performance cost worth the benefit?
Developing Secure Embedded Software: Quality Doesn’t Equal Security
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Using an Embedded Vision Processor to Build and Efficient Object Recognition System
The advent of high-performance mobile computing platforms is driving rapid progress in computer vision capabilities. Machine vision is becoming embedded in highly integrated SoCs and
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ProVIDE Technology
Supported Architectures: Eclipse, Visual Studios, USB, PCIe, NVMe Compatible Operating Systems: Windows 10 (x86 and x64), Windows 8.1 (x86 and x64), Windows Server 2012 (x64), Windows
Teledyne LeCroy USB Type-C and Power Delivery Analysis and Test Tools
Supported Architectures: USB 3.1, 3.0 and 2.0 with data rates up to 10 Gb/s. Are you ready for USB Type-C? As today’s infotainment systems migrate to the next generation USB supporting
Automotive & Connected Car Datasheet Directory
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by Teledyne LeCroy
Supported Architectures: USB 3.1, 3.0 and 2.0 with data rates up to 10 Gb/s. Are you ready for USB Type-C? As today’s infotainment systems migrate to the next generation...
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by Teledyne LeCroy
Supported Architectures: Eclipse, Visual Studios, USB, PCIe, NVMe Compatible Operating Systems: Windows 10 (x86 and x64), Windows 8.1 (x86 and x64), Windows Server 2012 (x64),...
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