Archive for December, 2012

Mentor Graphics Advances their Industry-Unique LED Solution to Meet Future Auto-Lighting Needs

Tuesday, December 18th, 2012

Mentor Graphics Corporation (NASDAQ: MENT) has announced significant advances in their T3Ster®+TeraLED® measurement and characterization hardware, as well as in FloEFD™ software simulation products, to meet the needs of lighting developers using arrays of LEDs in headlights, taillights and other transportation industry applications. These advances enable developers to efficiently manage the heat and condensation developed by these arrays thus improving product reliability and life. In addition, with T3Ster and TeraLED hardware’s ability to measure both thermal and optical characteristics of single LEDs and full arrays, proper light quality and color can be achieved.

Mentor is the only industry supplier to provide a complete physical measurement, characterization and thermal simulation solution of LEDs and LED SSL arrays.

Now the FloEFD product has been extended with a dedicated LED module which enables thermal simulation of the most advanced LED products along with the capability of predicting their “hot lumens” i.e. their total emitted luminous flux at their operating temperatures. This capability is provided through an LED model library whose elements are characterized directly from physical tests by the Mentor® T3Ster+TeraLED combined thermal and radiometric/photometric LED testing solution. In addition, the FloEFD LED models support radiation absorption in semi-transparent solids, such as the head or taillight lens.

“LEDs shipped to use in headlamps are forecast to grow significantly from 10 million units in 2012 to 78 million units in 2018,” stated Jamie Fox, lighting and LEDs research manager for IMS Research (now part of IHS). “The quality, lifetime and reliability requirements in the automotive sector are very high, higher than most other LED sectors.”

“The use of LEDs in the transportation industry is expanding rapidly, led by Europe but now also prevalent in the US and Asia,” stated Erich Buergel, general manager of the Mentor Graphics Mechanical Analysis Division. “We have serviced this industry for several years now but larger, hotter and more complex shaped arrays are driving us to enhance our FloEFD, T3Ster, and TeraLED products to stay ahead of our users’ needs. These enhancements will ensure that the industry is able to advance while maintaining high product reliability and achieving faster times to market.”

LED arrays are becoming larger and to accommodate these larger arrays, Mentor is now providing a 50 cm diameter sphere, in addition to their 30 cm, on their TeraLED product to measure optical performance. A 50 cm sphere is large enough to hold LEDs used in headlights and taillights producing up to 7500 lumens, with cooling for up to 50W of heat dissipation. This combination assures that the industry will be able to develop their most aggressive LED array designs and meet the needs of the automotive industry.

For more information on the Mentor Graphics® FloEFD and T3Ster/TeraLED products and to link to educational webinars and whitepapers from the Mentor Mechanical Analysis Division, visit the company website at http://go.mentor.com/autolight.

(Mentor Graphics, Mentor, T3Ster and TeraLED are registered trademarks and FloEFD is a trademark of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.)

About Mentor Graphics

Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year of about $1,015 million. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com.

Contact Information

Mentor Graphics – Veloce Emulation Platform

8005 SW Boeckman Rd.
Wilsonville, OR, 97070
USA

tele: 1-503-685-8000
toll-free: 1-800-547-3000
sales_info@mentor.com
mentor.com

TI technology fuels best-in-class audio and car control in Audi’s next-generation vehicles

Tuesday, December 11th, 2012

TI’s “Jacinto 5” processor brings stunning digital audio, feature-rich vehicle interfaces and more to Audi’s next-generation infotainment platform

Texas Instruments Incorporated (TI) (NASDAQ: TXN) has confirmed that Audi’s MIB High system, the next-generation infotainment platform for Audi vehicles, is the first automotive system to incorporate TI’s “Jacinto 5” automotive infotainment processor. Jacinto 5 plays an important role in the new architecture of Audi’s high infotainment systems, which consist of a multimedia applications unit (“MMX”) and a highly integrated radio and car control unit (“RCC”). Among other features, the processor enables feature-rich vehicle interfaces, and vivid digital radio and audio within the RCC unit in Audi’s MIB High system, which debuted in the 2012 Audi A3.

TI’s Jacinto 5 automotive infotainment processor is an automotive-qualified, heterogeneous multicore processor providing power, flexibility and real-time signal processing. The Jacinto 5 includes an integrated ARM® Cortex™-A8 core that manages middleware, drivers and applications stacks, along with a digital signal processor (DSP) that powers audio, radio and automotive low-level tasks. The processor also integrates a rich collection of automotive peripherals and connectivity options. This highly integrated system-on-chip enables a cost-effective design for mid- to high-level infotainment systems and can scale to add the functionality of an external applications processor.

TI collaborated with Audi and other industry leaders to support Audi’s goal of providing best-in-class infotainment features to customers, while ensuring a long lifecycle for the vehicle interfaces. This long span, made possible by the MIB High system’s unique modular approach, allows developers to retain the stable vehicle processor within the RCC unit, and provides the flexibility to incorporate future consumer-demanded features to the MMX unit.

“TI and Audi’s collaboration has produced a truly paramount automotive infotainment system,” said Matthew Watson, product line manager, audio and infotainment, TI. “Our scalable Jacinto 5 processing architecture enables Audi to equip consumers with leading-edge capabilities, without an on-going R&D investment for stable automotive features. The rich multimedia, high integration and extended lifecycle of the MIB High System will keep drivers and passengers entertained, informed and connected for the long run.”

“When designing the MIB High system, it was clear that we would need a highly integrated, robust and adaptable processor for the RCC unit,” said Dr. Peter Steiner, head of infotainment development AUDI AG. “TI’s Jacinto 5 processor surpasses those needs, and ensures that drivers and passengers receive the best of automotive infotainment in our latest vehicles.”

TI’s innovation and leadership in automotive applications
TI offers a full suite of reliable, state-of-the-art semiconductor products that allow manufacturers and system suppliers to deliver world-class features to the automotive market. In addition to our extensive catalog of analog power management, interface and signal chain solutions, TI offers Hercules™ TMS570 safety microcontrollers, automotive-grade processors and wireless connectivity solutions, all with product documentation and qualification to strict AEC-Q100 and ISO/TS 16949 standards. Whether improving system efficiency and safety or designing a vehicle that is more informative or fun, TI helps customers achieve their quality, reliability and cost goals and succeed in today’s competitive automotive marketplace. Find out more today.

For more information

About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at www.ti.com.

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Hercules and E2E are trademarks of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.

SOURCE Texas Instruments Incorporated

Contact Information

Texas Instruments

12500 TI Boulevard
Dallas, TX, 75243
United States

tele: 972-644-5580
support@ti.com
www.ti.com