Archive for January, 2013

Maxim Integrated Offers a Highly Integrated 8-Bit RGB Laser Driver for Automotive Projectors

Monday, January 21st, 2013

RGB laser driver for heads-up displays lowers power and cost, and shrinks size compared to LED-driven pico projectors.

Maxim Integrated Products, Inc. (NASDAQ: MXIM) has announced that it is now sampling the MAX3601, a highly integrated, 8-bit RGB laser driver for pico laser projectors in automobiles. It is a smaller size, brighter light, and lower cost solution than traditional technology, and it enables sharper, pixel-perfect heads-up displays (HUD) in automobiles.

This IC drives three RGB lasers to provide a brighter light without compromising the low power. The high intensity of the lasers project brighter, more vivid images onto the HUD to easily alert the driver while enhancing safety. In addition, its high integration means longer battery life, less heat build-up, and a smaller module size.

Key Advantages

  • Low cost: minimized PCB area with functional integration; three current-output laser drivers combined into one laser
  • Low power: with only 80mW bias current, the device achieves maximum light output with excellent power efficiency
  • Small size and easier design/manufacturing: three integrated lasers eliminate the need for additional optics
  • High efficiency: less than 1W total module power provides long battery life, low heat dissipation, and minimal thermal sinking

Industry Commentary

  • “The MAX3601 laser driver keeps drivers clean, conscious, and connected,” said Mike Roberts, Executive Business Manager at Maxim Integrated. “Clean as in green, conscious as in safe, and connected as in infotainment. Maxim’s new laser-based technology provides lower power and brighter, more visible alerts for safety and infotainment.”
  • “One of the key trends for automotive displays is higher resolution,” said Richard Robinson, Director of Automotive Analysis at Strategy Analytics. “Sharper imagery in heads-up displays is critical for clarity, safety, and driver assistance applications.”

Availability and Pricing

  • Available in 3mm x 3.5mm, 42-bump WLP and 5mm x 5mm, 40-pin TQFN packages.
  • TQFN package specified over the -40°C to +105°C temperature range.
  • Pricing starts at $3.94 (1000-up, FOB USA, TQFN package).

For more details, please click here.

About Maxim Integrated
At Maxim Integrated, we put analog together in a way that sets our customers apart. In Fiscal 2012, we reported revenues of $2.4 billion.

Contact Information

Maxim Integrated


http://www.maxim-ic.com/

NXP Ships 100 Million Units of Popular Automotive Tuner Family

Tuesday, January 15th, 2013

JVCKENWOOD buys 30 million units and receives NXP customer award

NXP Semiconductors N.V. (NASDAQ: NXPI) has announced that it has reached the milestone of shipping 100 million units of its TEF66xx automotive radio tuner family. 30 million of these units have been bought by leading car radio manufacturer JVC KENWOOD Corporation (“JVCKENWOOD”), the very first customer to start mass production with this product.

In recognition of JVCKENWOOD’s commitment to the TEF66xx tuner family, NXP has awarded the company a special Customer Award, presented at CES 2013 in Las Vegas.

The TEF66xx family – which includes the TEF660x, TEF661x and TEF662x series – is an analog low-IF AM/FM single tuner with optional integrated RDS support. Specially designed for automotive applications, the receiver fully meets the AEC-Q100 quality standard. The low-IF architecture enables the highly integrated solution to offer very high radio reception performance. On top of this, the TEF66xx tuner family offers an outstanding price/performance ratio, proving popular with customers around the world and making it the market leader in single-tuner aftermarket sales. As well as being easy to design with, customers also benefit from its low bill of materials and small PCB footprint.

“Having worked with NXP to define our expectations for a single tuner solution, we have become one of the most fervent supporters of the TEF66xx series – it is a high-performance product with excellent radio reception,” said Mr. Masato Kyoya, senior specialist, Car Electronics Business Group, JVCKENWOOD. “We very much appreciate the great engineering support of NXP. We are pleased to have been a loyal customer since our first purchase – and with our contribution of 30 million radios with NXP later, our relationship is still going strong!”

“We are proud to know that millions of people worldwide use our tuners daily in their cars and love the great reception quality,” said Torsten Lehmann, senior vice president and general manager of the car entertainment business, NXP Semiconductors. “Our leading position in the overall car radio market, and in particular with this IC family, emphasises our expertise in the area of highly integrated state-of-the-art RF tuners. The TEF66xx family is a great solution for customers looking for a high-performance, easy-to-apply product in a price-sensitive market.”

Contact Information

NXP Semiconductors


www.nxp.com/microcontrollers

Toshiba Launches Low ON-Resistance Power MOSFET for Automotive Applications

Tuesday, January 15th, 2013

Also achieves low leakage current and 175°C operation

Toshiba Corporation (TOKYO:6502) has launched a low ON-resistance power MOSFET as the latest addition to its TO-220SIS package series for automotive applications. The new product, “TK80A04K3L”, also achieves low leakage current and guarantees operation at 175°C. While it is primarily suited to automotive applications, it can also be used in motor drives and switching regulators.

130115_automotive_1

*Follow this link for more on this product.
http://www.semicon.toshiba.co.jp/eng/product/transistor/selection/topics/1267638_2470.html

About Toshiba

Toshiba is a world-leading diversified manufacturer, solutions provider and marketer of advanced electronic and electrical products and systems. Toshiba Group brings innovation and imagination to a wide range of businesses: digital products, including LCD TVs, notebook PCs, retail solutions and MFPs; electronic devices, including semiconductors, storage products and materials; industrial and social infrastructure systems, including power generation systems, smart community solutions, medical systems and escalators & elevators; and home appliances.

Toshiba was founded in 1875, and today operates a global network of more than 550 consolidated companies, with 202,000 employees worldwide and annual sales surpassing 6.1 trillion yen (US$74 billion). Visit Toshiba’s web site at www.toshiba.co.jp/index.htm

Contact Information

Toshiba America Electronic Components

2590 Orchard Parkway
San Jose, CA 95131, CA, 95131
USA

www.toshiba.com/taec

STMicroelectronics Introduces Next-Generation Technology for Smaller, Smarter Automotive Electronics

Tuesday, January 15th, 2013

Latest Intelligent High-Side Switches Set New Standards in Miniaturization and Precision, Leveraging Package Commonality for Flexibility and Scalability

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top supplier of automotive semiconductors, has revealed the latest generation of its pace-setting switch ICs for vehicle electronics such as lights and body modules. The new devices provide enhanced intelligent features, improve protection and reliability, and are up to 40% smaller than competing alternatives.

Pioneered by ST, intelligent high-side switches provide a more reliable and efficient replacement for conventional relays. For several generations, ST’s VIPower family has offered advantages such as a common package style for many devices in the range. This allows tier-one suppliers to build several module variants using the same basic hardware and software so car makers can address differing requirements in international markets and offer various model specifications and options cost-effectively. The common-package approach has become widely adopted among high-side switch vendors.

In the seventh generation of ST’s VIPower family, the M0-7 series announced today, 75% of family members are available in a 5 x 4mm package, which is 40% smaller than the smallest competing devices. This allows car electronics designers to save pc-board space and aim for smaller module sizes. Moreover, various internal design changes increase precision, enhance diagnostic feedback, and improve reliability. Specifically, performance improvements include greater protection against short circuits, more accurate voltage and temperature feedback, increased current-sense precision, and best-in-class electromagnetic emission (EMI) performance.

Samples of all family members are available now. The first device to enter production will be the dual-channel VND7020AJ-E, in Q2 2013, priced from $1.10 for orders over 1,000 pieces. The full range of package types available across the new family will include PowerSSO-16, PowerSSO-36, Octapak, and SO-8.

Major features of M0-7 series:

  • Precise load-current, voltage and temperature-monitor feedback
  • Integrated sense multiplexer
  • Power-limitation and over-temperature latch-off
  • Bulb / LED mode (quad channel)
  • Flexible fault-reset management
  • Reverse-polarity protection
  • Full on- and off-state diagnostics capability
  • Ultra-low quiescent current

Background to Automotive High-Side Switches
The intelligent high-side switch has an important role in the development of advanced automotive electronics. It combines a power MOSFET as the main electronically controlled switch, with logic, control and sensing circuitry in a single package. It is connected between a microprocessor and loads such as lights, motors, heaters or valves, allowing the microprocessor to control the loads in response to inputs such as dashboard switches or sensors, as well as information from the intelligent circuitry in the high-side switch. The sensors may be ambient-light sensors, rain sensors, cabin-temperature sensors, wheel-speed sensors or others depending on the type of subsystem.

By integrating sensing, control and logic circuitry, the intelligent high-side switch is able to operate reliably with different types of loads, such as highly inductive loads like motors, or resistive loads like heaters. Moreover, these intelligent features allow the switch to perform many functions without intervention from the microprocessor, which helps engineers simplify software and utilize processor resources efficiently. Built-in protection against conditions such as over-voltage, over-temperature and open or short circuits helps prevent damage to subsystems, modules or wiring, and allows the switch to restart when safe.

Since it is specially designed to operate on the high side of the load, connected directly to the battery voltage, the high-side switch allows the negative terminal of the load to be connected directly to the vehicle chassis. This cuts significant cost and weight from the vehicle by reducing wiring and connectors.

About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people’s life. By getting more from technology to get more from life, ST stands for life.augmented.

In 2011, the Company’s net revenues were $9.73 billion. Further information on ST can be found at www.st.com.

ST Automotive Switches: http://hugin.info/152740/R/1670492/542857.pdf
ST Automotive Switches_IMAGE: http://hugin.info/152740/R/1670492/542858.jpg

Contact Information

STMicroelectronics

39, Chemin du Champ des Filles
C. P. 21 CH 1228 Plan-Les-Ouates
GENEVA ,
Switzerland

toll-free: +41 22 929 29 29
fax: +41 22 929 29 88

Microchip Boosts 32-bit MCU Performance by 25% on Low-Cost, Small Package PIC32 MX1/MX2 Series

Sunday, January 13th, 2013

Featured-Packed 32-bit Microcontrollers Include I2S for Audio Applications; Plus Capacitive Touch and USB OTG

Microchip Technology Inc., a leading provider of microcontroller, mixed signal, analog and Flash-IP solutions, today announced a 25% performance boost on its 32-bit PIC32MX1/MX2 microcontrollers (MCUs).  By increasing their speed to 50 MHz or 83 DMIPS, Microchip is taking the PIC32 MX1/MX2 MCUs’ performance to a new level, in combination with its feature-packed peripherals and 4-channel DMA.

The PIC32MX1/MX2 series includes Microchip’s smallest 32-bit MCUs, with sizes down to 5 mm x 5 mm and a 0.5 mm pitch, as well as the lowest-cost PIC32 MCUs.  These devices include up to 128K Flash and 32K RAM, and integrate peripherals for touch-sensing, audio-processing and advanced-control applications.  Specifically, integrated peripherals include a hardware module for adding mTouch™ capacitive-touch buttons or advanced sensors, an 8-bit Parallel Master Port (PMP) interface for graphics or external memory, a 10-bit 1-Msps 13-channel Analog-to-Digital Converter (ADC), and serial communications peripherals.  The MX2 series adds USB On-the-Go (OTG) capabilities.

The PIC32MX1 and MX2 MCUs are targeted for low-cost applications in the consumer and automotive markets, such as consumer music-player docks, noise-cancelling headsets, clock radios, and entertainment-system sound bars, as well as touch screens with buttons and sliders, graphic displays and USB device/host applications.  In the medical and industrial markets, applications include industrial-grade noise-cancelling headsets and medical/industrial displays with touch-sensing capabilities.

“The improved performance that we’re adding to these recently introduced, low-cost PIC32MX1/MX2 MCUs enables designers to overcome speed bottlenecks,” said Sumit Mitra, vice president of Microchip’s MCU32 Division.  “Additionally, designers can develop a broad range of products for the consumer, industrial, medical and other markets that require the combination of audio, touch-sensing and embedded-control capabilities, as well as USB communication, all with one MCU.”

Development Support

The PIC32MX1/MX2 series is supported by Microchip’s free MPLAB® X Integrated Development Environment (IDE), MPLAB XC32 Compiler for PIC32 (part # : SW006015, $895), MPLAB ICD 3 In-Circuit Debugger (part # DV164035, $189.99) and MPLAB REAL ICE™ In-Circuit Emulation System (part # DV244005, $ 499.98).

Pricing & Availability
The PIC32MX1and PIC32MX2 MCUs are available now in 28-pin SOIC, SPDIP and SSOP packages; a 36-pin VTLA package; and 44-pin QFN, TQFP and VTLA packages.  The series is available today for both sampling and volume production, starting at $1.74 each in 10,000-unit quantities.

For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s Web site at http://www.microchip.com/get/049F.  To purchase products mentioned in this press release, go to microchipDIRECT or contact one of Microchip’s authorized distribution partners.

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About Microchip Technology
Microchip Technology Inc. (NASDAQ: MCHP) is a leading provider of microcontroller, analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at http://www.microchip.com/get/ANEG.

Contact Information

Microchip Technology Inc.

2355 W. Chandler Blvd.
Chandler, AZ, 85224
USA

tele: 480.792.7200
toll-free: 888.MCU.MCHP
fax: 480.792.7277
here2help@microchip.com
www.microchip.com

ON Semiconductor’s New Video Signal Processor ICs Reduce Power Consumption and Enhance Picture Quality for Small LCD Panels

Thursday, January 10th, 2013

Energy efficient devices ideal for small LCD screen applications such as vehicle reversing

ON Semiconductor (Nasdaq: ONNN), driving innovation in energy efficiency, has released two new highly integrated image signal processor ICs ideal for use in applications such as vehicle reversing cameras, in-vehicle navigation systems and various consumer video monitoring security systems where small LCD screens are utilized. The LC749000PT for automotive applications and the LC749000AT for consumer products, support important end application energy savings and utilize advanced signal technology to improve the picture quality of digitally compressed images.

Capable of supporting installations with screen resolutions up to Wide Video Graphics Array (WVGA), the LC749000PT and LC749000AT integrate an analog to digital converter (ADC) which receives direct analog picture signal inputs from a camera. The built-in picture decoding circuit is able to decode analog picture signals in both NTSC and PAL formats. The size of the decoded picture signal is then adjusted according to the resolution of the connected LCD panel by a de-interlacer / scaler to enhance the picture quality. The 24bit RGB output or 18bit RGB output with dithering function is then transferred to the application LCD panel by a built-in programmable timing controller.

ON Semiconductor’s new image signal processor ICs incorporate features designed to optimize the displayed image. These include a scaler which scales video output to the correct display resolution automatically and a calibration function which makes rough gradients smooth. Meanwhile, a built-in dynamic gamma feature helps to improve low light visibility and display contrast in video and camera applications used in variable light conditions. Programmable gamma allows fast, easy and convenient calibration of LCD panels.

Both new devices feature a built-in onscreen display (OSD) function which allows text characters to be superimposed on the picture data. These devices also have a built-in OSD switch that achieves more advanced graphical overlays by employing an additional graphics IC. Meanwhile, pulse width modulation (PWM) supports adaptive LED backlight control functionality that can help yield valuable application power savings of approximately 35 percent. The LC749000PT and LC749000AT are controlled by an external microcontroller via an I2C or serial peripheral interface (SPI). Hardware-driven picture processing minimizes the burden on the software of the microcontroller and in vehicle camera applications. External fast EEPROM booting ensures that the LCD panel is operational immediately after the vehicle engine is switched on – an important feature for rear back-up cameras and many other non-automotive applications.

“Vehicle reversing cameras and many other small screen LCD applications – for both automotive and non-automotive electronics – are becoming increasingly popular,” said Hideya Ohashi, general manager of ON Semiconductor’s SANYO product division.” With this demand, come increasingly stringent performance requirements regarding image clarity in order to maximize the application benefits including safety. In addition, there is the challenge of reducing power consumption, especially in automotive systems to minimize the power burden on the battery. ON Semiconductor’s new image signal processor ICs meet both sets of demands and are supporting the faster adoption of this important area of technology.”

Packaging and Pricing
The LC749000PT and LC749000AT are offered in a lead-free and halogen-free TQFP 120-pin package and budgetary priced at $8.00 USD per unit in quantities of 1,000 units.

About ON Semiconductor
ON Semiconductor (Nasdaq: ONNN) is driving innovation in energy efficient electronics, empowering design engineers to reduce global energy use. The company offers a comprehensive portfolio of energy efficient power and signal management, logic, discrete and custom solutions to help customers solve their unique design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power supply applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit http://www.onsemi.com.

ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its Web site in this news release, such information on the Web site is not to be incorporated herein.

Contact Information

ON Semiconductor


http://www.onsemi.com/

Bsquare Announces New Board Support Package for Texas Instruments Jacinto 4 / DM8148

Tuesday, January 8th, 2013

BSQUARE Corporation (NASDAQ: BSQR), a leading enabler of smart connected systems, today announced availability of the new Bsquare Board Support Package for the Texas Instruments Jacinto 4 / DM8148. The new Board Support Package (BSP) enables streamlined development on these Texas Instruments (TI) development platforms, which are ideally suited for human machine interfaces in automotive and industrial applications.

The Bsquare BSP includes a complete set of drivers for the Jacinto 4 plus drivers for peripherals included on the Mistral® TMDXEVM8148 development board. The BSP provides key features to developers working with this board that allow them to take full advantage of the Windows® Embedded Compact 7 operating system:

  • Windows Embedded Compact 7 OAL with support for ARM Cortex-A8
  • Support for up to 3GB of physical RAM in Windows Embedded Compact 7
  • eMMC 4.4 device driver support
  • Full TI SYSLINK integration for on-chip inter-processor communication
  • Multimedia middleware with hardware accelerator support
  • Enabled for dual-display support
  • SwiftBoot-enabled for minimum system boot time

This BSP may be customized to support unique hardware requirements and software implementations. Bsquare complements its BSP with end-to-end development, integration, testing, support and training services that accelerate time-to-market for new embedded solutions.

“The combination of Windows Embedded Compact 7 and our new BSP enables customers to bring devices to market more quickly, increase development team productivity and optimize device performance,” said John Traynor, senior vice president of products for Bsquare. “This new BSP can be combined with other Bsquare products and services to create innovative automotive and industrial solutions.”

Bsquare will launch the new BSP at CES 2013, which is being held in Las Vegas, NV, January 8-10. To see a product demo of the new BSP at CES, request a meeting with Bsquare: http://www.bsquare.com/Pages/Campaign%20Pages/CES-2013.aspx

For more information about the new Bsquare Board Support Package for the Texas Instruments Jacinto 4 visit: http://www.bsquare.com/products/board-support-packages

About BSQUARE Corporation
Bsquare, a global leader in embedded solutions, applies experience and expertise on leading platforms to create new connections with customers, new business models and to enable new ways of working and communicating. Bsquare serves customers by forging connections among the partners, people, tools, and technology needed to create smart connected systems. For more information, visit www.bsquare.com.

BSQUARE is a registered trademark of BSQUARE Corporation. All other product and company names herein may be trademarks of their respective owners.

Contact Information

BSQUARE

110 - 110th Avenue NE
Suite 200
Bellevue, WA, 98004
USA

tele: 425.519.5900
fax: 425.519.5999
sales@bsquare.com
www.bsquare.com

Automotive infotainment re-defined: TI’s “Jacinto 6” automotive OMAP™ processor paves the way for an unparalleled in-vehicle experience

Monday, January 7th, 2013

New DRA74x processor (code named “Jacinto 6”) heightens performance and integrates OMAP architecture for tomorrow’s in-vehicle displays, 3D navigation and high-definition multimedia

Texas Instruments Incorporated (TI) (NASDAQ: TXN) has introduced an automotive OMAP™ processor built to bring unprecedented in-vehicle entertainment and telematics functionality to automobiles. Codenamed “Jacinto 6,” the new DRA74x processor builds upon TI’s proven OMAP 5 architecture to enable optimized automotive solutions, adding audio, analytics and radio accelerators, along with automobile interfaces and peripherals. Integrating automotive interfaces with the processor architecture can decrease an automotive infotainment customer’s electronic bill of materials (BOM) by up to 25% or more, while delivering best-in-class performance capabilities. For more details, visit the Jacinto 6 web page.

“Today’s consumers expect always-on connectedness, with information and entertainment at their fingertips in every environment – at work, at home, at play and on the road,” said Curt Moore, general manager of automotive for TI’s OMAP product line. “Jacinto 6 links people, their vehicles and the world around them via rich user interfaces, 3D navigation, real-time, high-definition, (HD) video and other interactive capabilities. With TI infotainment processors designed into more than a dozen automobile manufacturers delivering feature-rich infotainment systems, TI is excited to work with our customers to drive automotive infotainment performance to the next level with Jacinto 6.”

DRA74x automotive OMAP processor
With the OMAP 5 architecture at its foundation – including dual ARM® Cortex™-A15 cores, dual Cortex-M4 cores and multi-Imagination Technologies’ POWERVR™ SGX544-MPx graphics cores – the latest DRA74x (“Jacinto 6”) processor increases ARM CPU performance up to five times and graphics (GPU) performance close to seven times as compared to the previous “Jacinto 5” offering. It also adds the following elements to the OMAP 5 processor foundation, to address specific automotive-infotainment needs:  

  • AEC Q100 qualification and wide-temperature support.
  • Automotive interfaces: 2x CAN, MOST Media Local Bus (MLB), PCIe, Ethernet AVB, 3.3V I/Os.
  • Optional 680 MHz floating-point VLIW DSP for integration of software defined radio, advanced audio and speech processing.
  • Multiple high-definition camera and video input ports to enable next-generation surround-view camera and consumer devices.
  • Robust software ecosystem, including support for QNX, open-source Linux, and Android.
  • Pre-integration of TI’s WiLink™ 8Q wireless automotive connectivity solutions

Infotainment leaders echo support for TI’s Automotive OMAP (“Jacinto”) processor family   
With an ecosystem of leading automotive partners, TI is proud to work with industry leaders to engineer the future of in-vehicle capabilities. Many of those ecosystem players leverage TI’s “Jacinto” processors and applaud the launch of the latest Jacinto 6 offering:  

The automotive infotainment market has shifted dramatically in the past five years, as cars transform into portable command centers,” said Jugal Vijayvargiya, senior vice president of Delphi and president of Delphi Electronics & Safety. “Delphi delivers real-world solutions to drive this shift, with innovative implementations of connectivity technologies, speech recognition, audio streaming and more. We are proud to work with key partners like TI in the process, and look forward to “Jacinto 6″ enhancing tomorrow’s in-vehicle infotainment experiences.”

“With an estimated 25 million vehicles on the road today featuring HARMAN’s audio and infotainment, our team works closely with partners such as TI to redefine the automotive infotainment experience,” said Michael Mauser, executive vice president and co-president, infotainment and lifestyle divisions, HARMAN. “As the latest in the line of TI’s reliable, scalable OMAP processors, “Jacinto 6″ helps us deliver on the promise to bring consumers seamless, feature-rich infotainment capabilities for a safer, more enjoyable ride wherever they may travel.”

“At Panasonic Automotive Systems Company of America, we seek out technology partners such as TI that share our same passion for crafting more exciting, informative driving experiences,” said David Taylor, director, research and advanced development, Panasonic Automotive Systems of America. “The launch of “Jacinto 6” is a major step forward for automotive manufacturers hoping to integrate next-generation infotainment capabilities in upcoming vehicles, and we look forward to seeing how “Jacinto 6″ transforms the way passengers and drivers experience navigation, multimedia and other interactive capabilities on the road.”

“For more than 10 years, TI and QNX have worked closely to enable innovative, connected automotive solutions, which have changed the way people interact with in-vehicle and carry-in electronics,” said Linda Campbell, director of strategic alliances, QNX Software Systems. “Jacinto 6 brings new levels of performance, power, and optimization, enabling us to bring game-changing innovations to model year 2014 vehicles and beyond. We look forward to continued successes with TI and to working together to bring best-in-class, Jacinto-processor-based features to cars across the globe.”

Availability
The DRA74x “Jacinto 6” processor will sample in mid-2013 and is expected to be available for production by the second half of 2014. As with other OMAP processors, the DRA74x is intended for high-volume automotive manufacturers and is not available through distributors.

Texas Instruments drives automotive innovation
TI’s state-of-the-art semiconductor products allow manufacturers and system suppliers to deliver world-class features to the automotive market.  Our extensive automotive portfolio includes analog power management, interface and signal chain solutions, along with DLP® displays, ADAS and infotainment processors, Hercules™ TMS570 safety microcontrollers and wireless connectivity solutions. Complete with excellent product documentation, TI offers parts that are compliant with the AEC-Q100 and TS16949 standards, along with SafeTI™ products, which also comply with ISO 26262 requirements. Click here to learn more.

More information

About Innovation at TI
For more than 80 years, TI has been at the forefront of technical innovation, enabling customers to differentiate products with higher integration, faster speeds and lower power. Today, we are engineering the future with advances in energy harvesting, power management, cloud computing, safety and security, health technology, and more. Learn more about how TI’s Analog and Embedded Processing products are improving how we live, work and play, today and well into the future, athttp://www.ti.com/innovation.

About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.

Trademarks
OMAP, Hercules and TI E2E are trademarks of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.

TXN-P

SOURCE Texas Instruments

Contact Information

Texas Instruments

12500 TI Boulevard
Dallas, TX, 75243
United States

tele: 972-644-5580
support@ti.com
www.ti.com

Beyond hands-free: TI brings high-performance wireless connectivity to automotive infotainment with new WiLink™ 8Q family

Monday, January 7th, 2013

Wi-Fi®, Bluetooth®, Bluetooth low energy, NFC and GNSS combo-connectivity automotive solutions for multimedia streaming, hands free calling and A2DP stereo with easy pairing

Wireless connectivity is becoming a key feature in automobiles for sharing and viewing content from smartphones and tablets to in-car systems, easy pairing of devices, navigation and replacement of expensive cables for in-car communication. To answer this need, today Texas Instruments Incorporated (TI) (Nasdaq: TXN) introduced the WiLink™ 8Q family of wireless automotive connectivity solutions. With its multi-radio technology, the WiLink 8Q family reaches new levels of cross platform scalability and delivers advanced features including in-car multimedia streaming video in-parallel with Bluetooth hands-free calling and advanced audio distribution profile (A2DP) stereo sound. Additionally, with near field communications (NFC) for easy Wi-Fi and Bluetooth pairing, WiLink 8Q solutions enable an easy connection between a smartphone or tablet and the automobile, providing a seamless user experience. Read more about the WiLink 8Q family experience on the new TI Behind the Wheel blog here.

The WiLink 8Q family is designed for Wi-Fi CERTIFIED Miracast™ operation. With an integrated power amplifier (PA) and complete software reuse across all family members, WiLink 8Q solutions provide a full range of products for wireless automotive infotainment including:

  • Combo-connectivity system-on-chips (SoCs) with Wi-Fi and Bluetooth support
  • More integrated combo-connectivity SoCs with Wi-Fi, Bluetooth, Bluetooth low energy and NFC
  • Super-combo SoCs with Wi-Fi, Bluetooth, Bluetooth low energy, NFC, and Global Navigation Satellite System (GNSS) support

“Delivering the familiar experience consumers have with smartphones and the tablets into the automobile to share information and content from drivers’ and passengers’ devices is driving the need for strong wireless connectivity solutions. Wi-Fi, Bluetooth, NFC and GNSS have to work together seamlessly as integrated parts of the entire system,” said Mattias Lange, automotive connectivity product line manager, Wireless Connectivity Solutions, TI. “The WiLink 8Q family takes our expertise in wireless connectivity and automotive applications to the next level with support of four different RF technologies on one SoC – a truly integrated approach to automotive infotainment.”

WiLink 8Q family: Leveraging TI’s portfolio

With the industry’s most complete portfolio of wireless connectivity solutions, the WiLink 8Q family leverages TI’s history of delivering high performance, scalable solutions across multiple end-equipments and includes leading Bluetooth and Wi-Fi coexistence technology. TI’s second generation automotive combo connectivity offering, the WiLink 8Q family works with a variety of infotainment processors and is a perfect companion device for TI’s automotive OMAP™ processors, DRA65x “Jacinto 5” and the newly announced DRA74x processor, code named “Jacinto 6.” The DRA74x infotainment processors heighten performance for tomorrow’s in-vehicle displays, 3D navigation and high-definition multimedia. Additionally, TI has a robust software offering for WiLink 8Q connectivity solutions that supports key automotive operating systems such as QNX, Linux and Android. 

TI’s wireless automotive connectivity solutions will be demonstrated at CES 2013 in the TI Village, North Hall of the Las Vegas Convention Center.

Availability

Initial members of the WiLink 8Q family are expected to sample in 2Q 2013 and are expected to be in production in 1Q 2014. WiLink 8Q solutions are intended for high-volume automotive manufacturers and are not available through distributors.

Texas Instruments drives automotive innovation

TI’s state-of-the-art semiconductor products allow manufacturers and system suppliers to deliver world-class features to the automotive market. Our extensive automotive portfolio includes analog power management, interface and signal chain solutions, along with DLP® displays, ADAS and infotainment processors, Hercules™ TMS570 safety microcontrollers and wireless connectivity solutions. Complete with excellent product documentation, TI offers parts that are compliant with the AEC-Q100 and TS16949 standards, along with SafeTI™ products, which also comply with ISO 26262 requirements. Click here to learn more.

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About Innovation at TI

For more than 80 years, TI has been at the forefront of technical innovation, enabling customers to differentiate products with higher integration, faster speeds and lower power. Today, we are engineering the future with advances in energy harvesting, power management, cloud computing, safety and security, health technology, and more. Learn more about how TI’s Analog and Embedded Processing products are improving how we live, work and play, today and well into the future, at www.ti.com/innovation.

About Texas Instruments

Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.

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WiLink, OMAP and E2E are trademarks of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.

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