Archive for March, 2013

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Smartphones and Cars Become One as the Telematics and M2M Ecosystem Accelerates Connected Cars, Consumers Crave

Tuesday, March 26th, 2013

Its full speed ahead for connected cars as more consumers crave and demand integration of smartphones and vehicle dashboards. A recent study capturing the opinions of 8,000 consumers across eight countries discovered that buyers “expect their new cars to have technology at least as good as they find in other devices in their life.” Car connectivity will also drive automotive infotainment and in-vehicle internet access. App-connected vehicles are projected to reach 20% of consumer cars in Western Europe and North America by 2017. Content providers and app developers are already developing new business models to take advantage of these emerging markets. Meanwhile, how will the success of connected cars play out for the actual suppliers of automotive telematics technology?

A new report from Juniper Research expects the success of smartphone tethering and in-vehicle apps will commoditize the market and exert downward pressure on the price of vehicle manufacturers own embedded telematics infotainment service. However, big data derived from telematics service provision is likely to emerge as an unexpected revenue driver for telematics companies and automotive manufacturers.

To understand this fast-moving market, “Connected Cars: Automotive Telematics & In-Vehicle Infotainment 2013-2017” is an essential guide providing expert analysis and strategic recommendations. From the evolution and monetization of vehicle tracking to in-vehicle infotainment, the new report analyses key trends across both consumer and commercial automotive telematics.

Learn more about this report and request a free sample at

Global Information also recommends “Global market review of connected vehicle technologies – forecasts to 2027“, a brand-new just-auto report that reviews the latest technological developments and market trends, including automotive connectivty apps, car sharing and car clubs use of telematics, eCall emergency assist, electric vehicles case studies, plus Car-to-X – the communication platform of the future.

The report includes exclusive executive interviews, major supplier data, market size forecasts for the top 14 markets out to 2026, and free updates for one 12 months.

Learn more about this report and request a free sample at

In the last 4 years, the number of OEMs offering telematics services in China has exploded, surpassing mature markets such as Europe and USA where telematics took 15 years to become a commonly offered feature. In parallel to this, the number of companies scrambling to support OEMs with their telematics plans has also expanded. But is this intense level of competition good or bad for the industry? “Connected Car: The Evolving China Telematics Value Chain Database” zooms in on the telematics market in China.

In China, competition within the telematics industry has grown at a much faster pace compared to other markets, as service providers, content providers and hardware suppliers all battle for a slice of the telematics pie. The problem is that the pie remains relatively small.

Learn more about this report and request a free sample at

Find more market research for the telematics industry
With nearly 30 years of market research experience, Global Information, Inc (GII) is the single best resource for companies entering new markets, expanding their business, and securing their positions in their respective industries. With tens of thousands of reports from over 400 publishers in nearly every vertical market, our market research and forecast data can give companies the edge they need to stay ahead of the competition and plan for every contingency.

The reports above are just a few examples from the hundreds of research reports we have available for the telematics market. For a free consultation on the market research you need, contact us today!

About Global Information, Inc.
Global Information (GII) ( is an information service company partnering with over 300 research companies around the world. Global Information has been in the business of distributing technical and market research for more than 25 years. Expanded from its original headquarters in Japan, Global Information now has offices in Korea, Taiwan, Singapore, Europe and the United States.

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Renesas Electronics Announces R-Car H2, Offering Highest CPU and Graphics Performance for the Automotive Infotainment Market

Monday, March 25th, 2013

R-Car H2 Offers a Complete Solution for the Next-Generation High-End Multimedia and Navigation Systems

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, and Renesas Mobile Corporation, a leading supplier of advanced cellular semiconductor solutions and platforms, today announced the availability of a new member of the R-Car Series of automotive Systems-on-Chip (SoCs). Capable of delivering more than 25,000 DMIPS, the R-Car H2 provides high performance and state-of-the-art 3D graphics capabilities for high-end multimedia and navigation automotive systems. The R-Car H2 is powered by the ARM® Cortex™A-15 quad-core configuration running an additional ARM® Cortex™A-7 quad-core – the industry’s first implementation of a Quad ARM® Cortex A15 and the big.LITTLE processing technique in an automotive SoC.

Powerful media hardware accelerators enable features like 4 x HD 1080p video en/decoding including Blu-Ray support at 60 frames per second, image/voice recognition and high-resolution 3D graphics with almost no CPU load. These implemented hardware modules also execute the display content improvements needed for human-machine interface (HMI)/navigation data in parallel to Movie/DVD handling.

The R-Car H2 also features the Imagination Technologies PowerVR Series6 G6400 Graphics Processing Unit (GPU). This is the first worldwide implementation of the GPU into an automotive SoC, which demonstrates the state-of-the-art 3D graphics capability of the R-Car series. The R-Car H2 offers one of the best graphic performance solutions in the automotive embedded market. This GPU is ready to not only support open technologies like OpenGL ES 2.0, but also the OpenGL ES 3.0 and OpenCL standards. Support of the Open graphics standards combined with the R-Car H2’s cutting-edge IP and other features makes it the perfect platform to develop next-generation infotainment systems.

Renesas’ IMP-X4 core, implemented in R-Car H2 as an optional feature, provides real-time image processing that enables developers to support the emerging trend of augmented reality. In order to fully benefit from the IMP-X4 core, the R-Car H2 also supports up to four independent input camera channels, allowing easy implementations of 360º camera views and image recognition, just an example of the possible driver assistance functions. OpenCV support for IMP-X4 will also be offered. The R-Car H2 offers the highest level of integration of advanced safety concepts and infotainment features in the automotive market today.

The highly efficient bus architecture of the R-Car H2 includes dedicated CPU and IP caches, enabling Renesas to reduce the DDR3 memory bandwidth consumption. In order to ensure adequate memory bandwidth, the R-Car H2 is equipped with two independent DDR3-1600 32-bit interfaces. This allows for much more efficient access to different content simultaneously, compared to a single 64-bit DDR interface. The R-Car family aspires to provide users with the highest capable multitasking processing solution on the automotive market today.

In developing the R-Car series of SoCs, Renesas has leveraged the experiences with mobile products, where there is a strong focus on power consumption reductions. The applied technologies of these mobile products are transferred to Renesas’ automotive SoCs to provide unique and effective power optimization and handling.

The R-Car H2 integrates advanced automotive interfaces like Ethernet AVB, MOST-150 and CAN and mass storage interfaces like SATA, USB3.0/2.0, SDcard and PCI Express for system expansion. As a device option, the GPS baseband engine handles all modern navigation standards. Even here, the integration level of R-Car H2 doesn’t stop. A 24-bit DSP for codec, high-quality audio processing with hardware sample rate converters and audio mixing is part of the enormous function coverage. The Renesas R-Car family provides the highest level of advanced automotive peripherals in the market today. The Renesas Ethernet AVB solution achieves the fullest implementation of Ethernet AVB on the market, offering the Full Ethernet AVB specification and meeting the specification requirement demands of the automotive market.

With the R-Car H2, Renesas provides not only extremely powerful performance but also a robust ecosystem, including board support packages (BSPs), middleware, development environment and partner solutions, which enables quick prototyping and drastic reduction of high-end product development costs.

“1st generation R-Car series products are well accepted in the car infotainment market,” said Ryuji Omura, Executive Manager, Renesas Electronics Corporation. “To cover various customer demands, 2nd generation of R-Car, such as R-Car H2, is aimed at the further expansion of Eco-system with a number of our partners including embedded OS, middleware and Tool vendors.”

The R-Car H2’s multi-core architecture allows customers to implement real-time features, such as quick-boot, backup camera support, and media processing, parallel to the execution of advanced operating systems such as QNX® Neutrino® RTOS, Windows® Embedded Automotive or Linux. Renesas continuous close collaboration with industry-leading Operating System vendors means that the customers’ toolboxes are full with the features and development tools they need to rapidly create and bring to market differentiated high-performance products.

“Renesas and QNX Software Systems have had a long and successful relationship in helping automotive customers deliver state-of-the-art infotainment systems,” said John Wall, vice president, engineering services, QNX Software Systems. “The new R-Car H2 automotive SoC demonstrates why we value Renesas so highly as a partner — it reflects a deep understanding of customer requirements and addresses performance requirements of next-generation infotainment systems. We look forward to having the QNX CAR™ application platform supported by the R-Car H2.”

“The R-CAR H2 brings together a powerful multi-domain architecture to meet the demands of high-end next generation Automotive Infotainment Systems,” said Glenn Perry, General Manager of the Embedded Software Division at Mentor Graphics. “We look forward to working with Renesas, Automotive Tier One Suppliers and OEMs to deliver optimized Linux-based Infotainment Platforms for the application domain and a high performance solution for the real-time domain based on the widely adopted Nucleus RTOS.”

“The collaboration with Renesas offers Elektrobit (EB) customers a ready-to-use solution for future automotive HMI development, through one of the worldwide leading systems on chips (SoC) platforms for next-generation car infotainment systems. The integrated GPU (Graphic processing unit) is suitable for demanding 3D graphics applications; it offers one of the best graphical performances in the embedded market,” said Martin Schleicher, Vice President Infotainment Products, Elektrobit.

R-Car 2nd Generation Launch Partners

Altera Corporation       Micron Technology, Inc.
ArcherMind Technology Co.,Ltd       Microsoft Corporation
BSQUARE Corporation       Opera Software ASA
Cinemo GmbH       QNX Software Systems
Digital Theater Systems, Inc.       Spansion Inc.
Elektrobit Corporation       Tata Elxsi Limited
Integrated Silicon Solution, Inc.       Tensilica, Inc.
Jasmin Infotech Japan       Wind River Systems, Inc.
Lauterbach GmbH       SNOW(上海龍的信息系統有限公司)
Mentor Graphics Corporation       RisingTek(瑞宣科技股份有限公司)


Samples of the Renesas R-Car H2 SoC are available from today, equipped in a 831-pin FCBGA (flip chip ball grid array) package. Mass production is scheduled for mid-2014. (Availability is subject to change without notice.)

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723), the world’s number one supplier of microcontrollers, is a premier supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad-range of analog and power devices. Business operations began as Renesas Electronics in April 2010 through the integration of NEC Electronics Corporation (TSE:6723) and Renesas Technology Corp., with operations spanning research, development, design and manufacturing for a wide range of applications. Headquartered in Japan, Renesas Electronics has subsidiaries in 20 countries worldwide. More information can be found at

(Remarks) PowerVR SGX is a registered trademark of Imagination Technologies in the EU and other countries. ARM and Cortex are registered trademarks or trademarks of ARM Limited. QNX, QNX CAR, and Neutrino are trademarks of QNX Software Systems (QSS) Limited, which are registered trademarks and/or used in certain jurisdictions. QSS is not responsible for, and assumes no obligations or liability, and makes no representation, warranty, endorsement, or guarantee in relation to any aspect of any third-party products or services. Windows is a registered trademark of Microsoft Corporation. Linux is a registered trademark of Linus Torvalds. Other product and service names that appear in this press release are trademarks or registered trademarks of their respective owners.

Contact Information

Renesas Technology America, Inc.

450 Holger Way
San Jose, CA, 95134

tele: 408.382.7500

IAR Systems launches tools for developing powerful automotive applications based on Renesas’ RH850 core

Friday, March 22nd, 2013

IAR Embedded Workbench for Renesas RH850 is now available for immediate delivery

Today, IAR Systems® releases a suite of tools for developing embedded applications based on Renesas Electronics’ new RH850 core. IAR Embedded Workbench® for RH850 includes user-friendly features and powerful optimizations that enable developers to fully benefit from the high performance offered by the new RH850 core.

The RH850 microcontrollers are targeted for automotive applications and are the industry’s first with embedded 40nm flash technology. The series addresses functional safety and security requirements, while combining high performance and low power consumption. It offers features such as ultra-low power, high temperature tolerance, multi-core technology and compliance with the standardized automotive software architecture AUTOSAR (AUTomotive Open System ARchitecture).

IAR Embedded Workbench for RH850 provides a complete set of development tools, with build tools and the comprehensive C-SPY® Debugger incorporated in a user-friendly integrated development environment with a feature-rich text editor and source browser. Tapping into the success of IAR Systems’ well-proven tools for Renesas V850, IAR Embedded Workbench for RH850 brings architecture-specific adaptations and optimizations for the RH850 architecture. One of the focal points during development has been to maximize the code performance and the IAR C/C++ Compiler™ for RH850 generates very compact, extremely fast-performing code by applying several levels of generic and processor-specific optimizations.

The tools are well tested and comply with industry standards. They use the standard ELF/DWARF object format, and are compliant with Renesas ABI (Application Binary Interface), which gives users the possibility to incorporate libraries created with other Renesas ABI-compliant software tools. Integrated automatic checking of MISRA-C rules helps ensure the safety and reliability of the applications designed. The C-SPY Debugger supports Renesas E1/E20 emulators, as well as kernel-aware debugging with built-in plugins for a large number of real-time operating systems (RTOSes).

Thanks to its strong partnership with Renesas Electronics Corporation, IAR Systems is the only tool vendor that provides high-performance development tools for all Renesas architectures, in total more than 4000 devices. In a common user-friendly environment, IAR Systems’ customers can move freely within the entire line-up of Renesas microcontrollers.

Read more about IAR Embedded Workbench for RH850 and download free evaluation licenses from

Contact Information

IAR Systems Software, Inc.

Foster City, CA,

tele: 650-287-4250
fax: 650-287-4253

NXP Launches Industry’s First Automotive-Grade Isolated CAN Transceiver

Thursday, March 21st, 2013

Integrated galvanic isolation and CAN transceiver package benefits electric
and hybrid vehicle market

Building on its industry-leading position in In-Vehicle Networking, NXP Semiconductors N.V. (Nasdaq: NXPI) today introduced the TJA1052i, a high-speed Controller Area Network (CAN) transceiver with integrated galvanic isolation technology. The TJA1052i is the first ISO11898-2 compliant product of its kind to offer this level of integration at AEC-Q100 automotive grade quality.

The TJA1052i is an excellent choice for all types of CAN networks where high- and low-voltage networks co-exist – such as in electric and hybrid vehicles – and require galvanic isolation for safety reasons. Adding isolation to the CAN transceiver significantly simplifies the design effort to safely bridge between high and low voltage levels. The TJA1052i provides protection against electric shocks, overvoltage, ground offset and reverse current, while significantly improving signal integrity in noisy electromagnetic environments.

By integrating an existing market accepted CAN transceiver with a Galvanic Isolator in one package, this new solution ensures matching dynamic parameters, reduces board space, improves signal performance, and increases overall reliability and cost-effectiveness. Historically, automotive OEMs and Tier 1 suppliers have used expensive Opto Couplers to isolate the CAN transceiver, with performance in such a standalone solution tending to degrade over time.

The TJA1052i is well-suited for the growing market of hybrid and full electric vehicles (H/EVs), where high and low voltage levels co-exist. H/EVs are equipped with multiple battery modules – typically controlled via CAN by the Battery Management System – which together can supply up to 500 Volts and also power other high-voltage applications such as Inverter, Start/Stop, DC/DC Converter, Charger  and Air Conditioning systems. These systems need to communicate with other Electronic Control Units (ECUs) via the CAN Bus, and are typically operated from the 12V board net.  

Isolated CAN products are also needed in industrial applications where ECUs controlling high voltage applications and other ECUs need to be connected to each other via the CAN bus. Application examples for the TJA1052i in non-automotive areas are industrial equipment, energy storage systems, building automation and H/EV charging stations.

“The TJA1052i is another great example of NXP’s strategy to both connect the car and improve energy efficiency – even under challenging conditions,” said Toni Versluijs, vice president and general manager, in-vehicle networking business, NXP Semiconductors. “Our third-generation automotive CAN transceivers are already approved and used by multiple OEMs. By integrating galvanic isolation into the TJA1052i, we are first in the industry to deliver an automotive-grade solution that saves both space and money, while making it easier for our customers to build and connect their ECUs.”

The TJA1052i is ramping up in production with immediate effect.


About NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted unaudited revenue of $4.36 billion in 2012. Additional information can be found by visiting

Contact Information

NXP Semiconductors

TI speeds and simplifies design of automotive emergency call systems with new reference design

Wednesday, March 20th, 2013

Texas Instruments Incorporated (TI) (NASDAQ: TXN) has introduced a complete reference design that provides designers all the analog and embedded processing integrated circuits (ICs) required for automotive emergency call (eCall) systems. Vehicles equipped with eCall systems will automatically place calls to an emergency service center in the event of an accident. Customers can accelerate the design of their eCall systems by taking advantage of this reference solution comprised of AEC-Q100 qualified analog ICs from TI.

Featuring the TPA3111D1-Q1 high efficiency mono Class D audio amplifier and the TPS43330-Q1, single-boost, dual synchronous buck controller with ultra low quiescent current, TI’s automotive eCall reference design offers a robust, low-cost solution that is scalable for other automotive applications, such as telematics, stolen vehicle tracking and HEV/EV sound generation. It also incorporates the TLV70033-Q1 voltage regulator with low quiescent current and the MSP430F2232 16-bit ultra-low power microcontroller. For more information, to order samples or to download the reference design, visit

Key features and benefits of TI’s automotive eCall reference design:

  • Loud and clear audio quality: The TPA3111D1-Q1 delivers 10-W output power at 8 Ohm with greater than 90 percent efficiency, and offers enhanced EMI suppression to improve sound immunity. This ensures loud and clear audio quality; which is imperative in an eCall system where external conditions can sometimes overwhelm the emergency call.
  • Emergency operation: The TPS43330-Q1 pre-boost circuit supports automotive start/stop and boosts back-up battery supply voltage, allowing operation down to 2 V at the input. Combined with the Class D amplifier’s wide supply voltage range of 8 V to 26 V, the components in this reference design can be powered by a single-cell LiFePO4 battery, in case the car battery connection is severed in an accident.
  • System protection: The components offered in this system provide over-voltage and load dump protection against input transients of up to 40 V. The Class D amplifier also supports power cycling and speaker open-load detection during initial power-up. These features ensure robust operation in harsh automotive environments and simplify failure analysis.

Tools and support:
Learn more about TI’s automotive eCall and telematics solution by watching the demonstration video at For more information, to order samples or to download the reference design, visit

Availability, packaging and pricing
TI’s automotive eCall reference design schematics and supporting software are available for immediate download from The featured components are also available for immediate order.

The TPA3111D1-Q1 is available in a 28-pin HTSSOP package, and is priced at US$0.90 in 1,000-unit quantities. The TPA3111D1-Q1 evaluation module (EVM) is available for immediate orders and priced at US$149.00. Order samples, the EVM and download the simulation model at

The TPS43330-Q1 is available in a 38-pin HTSSOP package and is priced at US$3.00 in 1,000-unit quantities. The TPS43330-Q1 evaluation module (EVM) is available for immediate orders and priced at US$99.00. Order samples, the EVM and download the simulation model at

The TLV70033-Q1 is available in a 5-pin SOT package and is priced at US$0.15 in 1,000-unit quantities. Order samples, the EVM and download the simulation model at

The commercial grade MSP430F2232 is available in a 40-pin VQFN package or a 38-pin TSSOP package and is available upon request at

Texas Instruments drives automotive innovation
TI’s state-of-the-art semiconductor products allow manufacturers and system suppliers to deliver world-class features to the automotive market. Our extensive automotive portfolio includes analog power management, interface and signal chain solutions, along with DLP® displays, ADAS and infotainment processors, Hercules™ TMS570 safety microcontrollers and wireless connectivity solutions. TI offers SafeTI™ parts designed to facilitate OEMs’ compliance with the requirements of ISO 26262, as well as parts specifically designated as compliant with the AEC-Q100 and TS16949 standards, all with excellent product documentation. Click here to learn more.

Find out more about TI’s automotive and transportation portfolio by visiting the links below:

About Texas Instruments 
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors.  By employing the world’s brightest minds, TI creates innovations that shape the future of technology.  TI is helping more than 100,000 customers transform the future, today.  Learn more at

TI E2E is a trademark of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.

SOURCE Texas Instruments Incorporated

Contact Information

Texas Instruments

12500 TI Boulevard
Dallas, TX, 75243
United States

tele: 972-644-5580

New Freescale Microcontrollers Help Streamline Automotive Body Electronics Networks and Reduce Vehicle Weight

Monday, March 18th, 2013

Latest Qorivva and S12 MagniV devices integrate connectivity, functional safety, security and network management capability, trimming number of required ECUs and associated heavy copper wiring

The automotive industry is changing rapidly to address complex challenges, including higher bandwidth networks, improving data security, implementing functional safety and reducing overall energy consumption. Freescale Semiconductor (NYSE: FSL) is expanding its Qorivva and S12 MagniV vehicle body network microcontroller (MCU) portfolios to address these challenges and bring a new level of integration and function to automotive body applications.

As the number of electronic control units in a vehicle grows, the amount of connectivity needed also increases. The average vehicle includes several miles of copper wire – weighing up to 150 lbs. or more – for in-vehicle networking. Integrating more functionality within the vehicle’s main ECUs and increasing the intelligence of its satellite nodes (i.e. modules in doors or electric motors) can help reduce the number of ECUs and the amount of associated wiring required, eliminating weight in the vehicle wiring harness and helping improve vehicle fuel economy.

Along with the demand for greener cars, there is a major push for compliance with the ISO 26262 functional safety standard for automotive body modules, given the critical nature of the functions they enable such as exterior lighting and wind shield wipers. And as wireless communication to and from the vehicle becomes more prevalent, there is a growing need for security measures within automotive microcontrollers – to safeguard the intellectual property they contain and also prevent unauthorized and potentially dangerous access to the vehicle network.

Freescale’s new Qorivva MPC5748G and S12 MagniV S12ZVL/S12ZVC MCUs are complementary technologies with the Qorivva central controller acting as the networking gatekeeper with centralized data security, intelligent power management and ASIL support for functional safety, and the S12 MagniV satellite nodes having integrated power supplies and communications transceivers embedded onto smart mixed-signal MCUs. The level of hyper-integration these devices provide can help simplify vehicle network design, yielding reduced weight, increased manufacturing efficiency and reduced board sizes up to 30 percent.

“Vehicles are transforming into smart consumer devices where all connections lead to the outside world,” said Ray Cornyn, vice president of Automotive Microcontroller Products at Freescale. “By bringing increased intelligence to the central communications controller in the vehicle, Freescale understands the importance of not only securing in-vehicle networks, but also reducing electrical and mechanical energy consumption. Our latest MCU offerings will enable OEMs to reduce up to 20 pounds of copper wiring and board components, reducing vehicle weight and in turn further improving fuel economy.”

Qorivva MPC5748G MCU

The Qorivva MPC5748G MCU is a single-chip solution for next-generation central body control and gateway applications. It combines an exceptional level of integration with innovative low-power management modes, support for functional safety and robust security features.

The MPC5748G MCU provides one of the most diverse sets of networking communications peripherals on the market, with support for Ethernet with Audio Video Bridging (AVB), FlexRay™, Media Local Bus (MLB), USB, CAN FD (Flexible Data Rate) and up to 18 LIN controllers. High performance through a multicore architecture and memory options up to 6 MB of flash and 768 KB of RAM help ensure efficient transfer of data and eliminate communication bottlenecks.

Central body control modules spend significant portions of time in a low-power monitoring state. The MPC5748G features a low-power unit (LPU) mode that allows for increased functionality in a lower-power state, cutting peak current consumption for cyclic wakeup use cases by nearly 30 percent compared to previous-generation devices. In addition, inclusion of analog comparators that operate out of STANDBY mode and pretended networking help support next-generation power budget requirements.

The MPC5748G is a Freescale SafeAssure functional safety solution, defined and developed from the ground up to address the ISO 26262 standard. Built-in safety functions such as self testing and end-to-end error correction coding (ECC), comprehensive auto safety software including AUTOSAR OS and MCAL drivers and extensive safety documentation help target the use of the device for ASIL B.

The MPC5748G offers a hardware security module (HSM) for data protection and ensures secure communication and flash updates through AES cryptographic algorithms, secure memory and secure boot capabilities.

S12 MagniV S12ZVL/S12ZVC MCUs

Increasing the intelligence of CAN termination nodes or LIN nodes using the highly integrated S12 MagniV S12ZVL/S12ZVC MCUs will help automotive OEMs optimize their total body networking systems. The S12ZVL/S12ZVC devices allow designers to achieve the smallest possible CAN termination nodes (using S12ZVC) or LIN nodes (using S12ZVL) and help reduce printed circuit board sizes by as much as 30 percent. Car systems can connect high-voltage signals and power supplies directly to the S12 MagniV MCU, helping save additional discrete components, increasing system quality and reducing system design and manufacturing complexity.

The S12 MagniV portfolio enables body electronics platform design scalability across multiple applications, with CAN and LIN connectivity options, flash memory from 8 KB to 192 KB and a range of package options between 32 and 64 pins.

The S12 MagniV S12ZVL/S12ZVC MCUs are the first devices from the Freescale 16-bit automotive MCU portfolio included in Freescale’s SafeAssure functional safety program. They have been defined and developed from the ground up to address the ISO 26262 standard.


Limited samples of the Qorivva MPC5748G and the S12 MagniV S12ZVL are expected to be available in the second quarter of this year and general market availability through distribution is anticipated in the second half of 2014. Limited samples of the S12 MagniV S12ZVC are expected to be available in the third quarter of this year and general market availability through distribution at the end of 2014. Contact a Freescale sales representative for more information.

For more detailed information about these products, please visit Qorivva MPC5748G, S12 MagniV S12ZVL and S12 MagniV S12ZVC.

Tweet this: @Freescale Qorivva and S12 MagniV MCUs help streamline automotive body electronics networks and reduce vehicle weight

Freescale SafeAssure program: Functional Safety. Simplified.

The Freescale SafeAssure functional safety program is designed to help system manufacturers more easily achieve system compliance with functional safety standards: International Standards Organization (ISO) 26262 and International Electrotechnical Commission (IEC) 61508. The program highlights Freescale solutions – hardware and software – that are optimally designed to support functional safety implementations and come with a rich set of enablement collateral. For more information, visit

About Freescale Semiconductor

Freescale Semiconductor (NYSE:FSL) is a global leader in embedded processing solutions, providing industry leading products that are advancing the automotive, consumer, industrial and networking markets. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – our technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of our key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices. The company is based in Austin, Texas, and has design, research and development, manufacturing and sales operations around the world.

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. SafeAssure, Qorivva and S12 MagniV are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2013 Freescale Semiconductor, Inc.

TI introduces first automotive-grade, multi-phase synchronous boost controller with up to 100-V output voltage

Monday, March 18th, 2013

Three new controllers with wide input voltage range enable compact
design and scalable output power

Texas Instruments Incorporated (TI) (NASDAQ: TXN) has introduced three wide-input voltage synchronous boost controllers with high efficiency and high power density. The LM5122Q multi-phase boost controller features the industry’s widest input and output voltage range. The low quiescent-current TPS43060 and TPS43061 boost controllers feature 1-MHz operation and a small QFN package.

TI’s new synchronous boost controllers increase efficiency by up to 10-percent over non-synchronous boost controllers by replacing the freewheeling diode with a synchronous switch. Lossless inductor DCR current sensing further improves efficiency and reduces heat dissipation to save board space and lower bill of materials cost. Each boost controller features thermal shutdown, frequency synchronization, hiccup-mode current limit and an adjustable line under-voltage lockout.

The LM5122Q is an AEC-Q100-qualified synchronous boost controller with a 3-V to 65-V input and up to 100-V output voltage range. The controller can be configured easily for interleaved multi-phase operation, which is required for high power applications like start-stop voltage stabilizers and high power audio amplifiers. A powerful 3-A gate drive circuit supports voltages up to 16-V, enabling flexibility to tune the step-up DC/DC for efficiency and size.

TI will demonstrate the LM5122Q in its booth #109 at the Applied Power Electronics Conference and Expo (APEC) in Long Beach, Calif., Mar. 18-20.

The TPS43060 and TPS43061 are low quiescent-current synchronous boost controllers with an input voltage range from 4.5 V to 38 V and an output voltage range of up to 60 V. The TPS43060 provides a 7.5-V gate drive, which drives a broad range of low-cost MOSFETs. The TPS43061 provides a 5.5-V gate drive, optimized for low Qg MOSFETs, such as TI’s CSD86330Q3D synchronous buck NexFET™ Power Block, which saves up to 50-mm2 of board area. Applications include tablet and notebook USB charging adapters, and industrial test and measurement equipment.

The synchronous boost controllers join TI’s family of step-up power products that include the TPS55340, a 40-V boost converter with an integrated 60-milliohm MOSFET. For more information on all of TI’s DC/DC switching regulators, visit

Key features and benefits of the LM5122Q boost controllers:

  • 100-V output range and 65-V input range simplifies high-voltage design.
  • High power density is easily achieved with interleaved multi-phase operation.
  • Bypass feature enables pass-through of input to output when boost functionality is not required.
  • User-selectable diode emulation enables improved efficiency at light load conditions.

Key features and benefits of the TPS43060 and TPS43061 boost controllers:

  • 500-uA quiescent current supports battery-powered applications.
  • Up to 1-MHz operation allows small inductor and ceramic capacitors, which reduces overall solution size.
  • -40 degrees C to 150 degrees C operating junction temperature for robust performance in hotter environments.

Availability, packaging and pricing

The TPS43060 and TPS43061 are available in volume now from TI and its authorized distributors. Offered in a 16-pin QFN PowerPad™ package that measures 3 mm by 3 mm by 0.75 mm, the TPS43060 and TPS43061 are priced at $1.40 in 1,000-unit quantities.

Samples and production quantities of the LM5122Q are expected to be available in the second quarter. Offered in a 20-pin TSSOP package that measures 6.5-mm by 4.4-mm by 0.9-mm, the LM5122Q is priced at US$2.10 in 1,000-unit quantities.

Find out more about TI’s power products:

About Texas Instruments

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors.  By employing the world’s brightest minds, TI creates innovations that shape the future of technology.  TI is helping more than 100,000 customers transform the future, today.  Learn more at


WEBENCH is a registered trademark and NexFET, PowerPad, TI E2E and PowerLab are trademarks of Texas Instruments. All other trademarks belong to their respective owners.

Contact Information

Texas Instruments

12500 TI Boulevard
Dallas, TX, 75243
United States

tele: 972-644-5580

NXP Successfully Test Drives Digital Radio Mondiale in India

Thursday, March 14th, 2013

As India rolls out DRM, NXP is first to complete live in-car demo, supporting all major digital terrestrial radio standards on a single automotive co-processor

NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest supplier of car infotainment semiconductors, today announced that it has successfully completed live reception of all three major terrestrial digital radio standards – DRM (Digital Radio Mondiale™), DAB and HD Radio – in a car. The live public demo, which took place at the Broadcast Engineering Society (BES EXPO 2013) event in New Delhi, India, ahead of the country’s national roll-out of DRM, was achieved using NXP’s innovative software-defined multi-standard co-processor for automotive terrestrial digital radio reception.

NXP’s R&D center in Bangalore, India played a key role in integrating DRM decoder functionality into the company’s automotive terrestrial digital radio solution to create a truly multi-standard chipset that can be used in markets all around the world. It enables manufacturers to achieve significant economies of scale by having just one global hardware platform for the three main terrestrial digital radio standards.

Following a series of comprehensive field trials to ensure the solution met the requirements of the Indian market, NXP’s demonstration of live DRM reception in a car at BES confirmed the company’s leadership in the automotive digital radio market. The demo was conducted in cooperation with All India Radio (AIR), the national broadcaster of India and operator of one of the largest radio networks in the world. At the event, NXP’s DRM demo car generated huge interest and was visited by a number of delegates from government organizations and the automotive industry.

DRM is an innovative digital radio standard currently being implemented in emerging markets such as India, providing FM-comparable or better audio quality on the AM radio band. AM covers over 98% of the population in India, while only 37% of listeners can currently receive the FM signal. DRM significantly improves audio quality at a low cost, while providing additional data services such as traffic updates, natural disaster warnings and news.

Ruxandra Obreja, chairman of the DRM Consortium, welcomed this latest development: “The automotive industry in India, and in the rest of the world, is one of the biggest drivers of the transition from analog to digital radio. NXP’s live demonstration of a DRM car receiver at the BES event in January was a giant step in this transition. The work and tests which have been carried out since then by local agencies highlight that DRM in India is a reality and that the auto industry is at the forefront of the Indian digital radio roll-out.”

Ashok Chandak, senior director, global sales and marketing for India, NXP Semiconductors, commented: “It’s incredibly exciting to have participated in this live DRM demonstration in India, showing that it’s possible to achieve high-quality digital radio performance even in AM bands. With this demo, we have become the first semiconductor company to demonstrate digital audio across all three global standards from the same car radio co-processor – a real milestone for NXP. Already, several automotive and car radio manufacturers have shown strong interest in using our DRM solution for future deployment. We’re also proud that our R&D center in India has played such a pivotal role in developing this technology. Many millions of people in India who haven’t had a chance to receive and experience FM radio quality before will soon be able to enjoy DRM, so it’s great to be playing a role in making this happen.”


About Digital Radio Mondiale

Digital Radio MondialeTM (DRM) is the universal, openly standardized digital broadcasting system for all broadcasting frequencies below and above 30 MHz, including LW, MW, SW, band I, II (FM band) and band III. DRM provides digital sound quality and the ease-of-use that comes from digital radio, combined with a wealth of enhanced features: Surround Sound, Journaline text information, Slideshow, EPG, and data services. Additional information can be found by visiting

About NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted unaudited revenue of $4.36 billion in 2012. Additional information can be found by visiting

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NXP Semiconductors

Yanfeng Visteon Automotive Electronics Selects E2open to Transform Global Supply Collaboration Program

Thursday, March 14th, 2013

Leader in Chinese Automotive Industry Automates Supply Chain with Collaborative Execution

Yanfeng Visteon Automotive Electronics, a joint-venture of Yanfeng Visteon Automotive Trim Systems and Visteon Corporation (NYSE:VC), has selected E2open (NASDAQ: EOPN), a leading provider of cloud-based solutions for collaborative execution across global trading networks, to transform its supply chain collaboration program. Utilizing E2open’s cloud-based collaborative execution platform, Yanfeng Visteon will improve its global supply chain operations with automated information exchange, a consolidated view of global spend, and real-time insight into supplier commitments and issue resolutions across their network of more than 600 suppliers.

“Yanfeng Visteon Automotive Electronics is pleased to partner with E2open as part of our effort to build a world-class supply chain program,” said Hanson Zhang, Purchasing & Supply Head at Yanfeng Visteon Automotive Electronics. “E2open’s cloud-based solution will enable us to establish a collaborative platform for our suppliers and trading partners, improve risk management, and offer better service levels to our global customers. This will make Yanfeng Visteon Automotive Electronics a benchmark of supply chain excellence in the Chinese domestic automotive industry.”

Yanfeng Visteon Automotive Electronics is the premier supplier of audio and meter devices in the Chinese domestic automotive industry, designing and producing a variety of electronics control solutions, including navigation, audio entertainment systems, centralized electronic control modules, and power control modules. The company has six manufacturing plants across China and operates the largest electronics technology research and development center in Asia.

“E2open’s highly-integrated, cloud-based supply chain platform will enable us to reduce IT complexity and increase IT agility,” said Roy Wang, Information Technology Head at Yanfeng Visteon Automotive Electronics. “Our goal is to develop our core competency based on world-class information system capabilities to improve supply chain efficiency while reducing operational costs.”

“With the continued expansion of the Chinese automotive industry, it is critical that Yanfeng Visteon Automotive Electronics’ growing supplier base is able to communicate efficiently to address potential disruptions and sustain excellent service levels,” said Mark Woodward, President and CEO, E2open. “Our strategic partnership with Yanfeng Visteon Automotive Electronics is an exciting opportunity for E2open as we continue to grow our presence in the Asia Pacific marketplace.”

More than 34,000 trading partners, with over 105,000 unique registered users, currently participate in the E2open Business Network, which allows participants to access and share data and execute business processes in a secure, real-time manner. For more information on E2open, visit the company’s website or follow the company on Twitter and Facebook.

About E2open

E2open is a leading provider of cloud-based, on-demand software solutions enabling enterprises to procure, manufacture, sell, and distribute products more efficiently through collaborative execution across global trading networks. Brand owners use E2open solutions to gain visibility into and control over their trading networks through the real-time information, integrated business processes, and advanced analytics that E2open provides. E2open customers include Celestica, Cisco, Dell, Embraer, HGST, IBM, L’Oréal, LSI, Motorola Solutions, Seagate, and Vodafone. E2open is headquartered in Foster City, California with operations worldwide. For more information, visit

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Connected Automotive Infotainment System Shipments to Exceed 62 Million by 2018 as Feature Set Explodes, According to ABI Research

Wednesday, March 13th, 2013

Shipments of connected automotive infotainment systems will grow from 9 million in 2013 to more than 62 million in 2018 with connected navigation, multimedia streaming, social media, and in-car Wi-Fi hotspots becoming key features.

ABI Research VP and practice director Dominique Bonte comments, “Open platforms continue their march forward. While both the GENIVI consortium (open source common automotive infotainment reference platform) and the Car Connectivity Consortium (MirrorLink screen replication technology) somewhat struggle to find momentum, the car industry is now turning its attention to HTML5 and Android with both Renault (R-Link) and Volvo (Sensus Connected Touch platform based on Parrot’s Asteroid Smart) embracing (heavily) modified versions of the Android operating system.”

In a similar vein, automotive applications and/or stores have become standard components of any connected automotive infotainment platform with the automotive industry finally realizing the ability to download aftermarket services and apps is a powerful way to keep systems up-to-date and relevant during the vehicle lifecycle.

On the connectivity side, 4G seems to finally have been accepted as the connectivity technology of the future, following GM’s announcement to adopt AT&T’s 4G technology to power next generation infotainment platforms offering navigation, in-car hotpots, and multimedia services. Clearly, carriers across the globe are keen to play a key role in the connected car and more generally the Internet of Everything revolution.

ABI Research’s new “Connected Car” Market Data provides detailed forecasts of connected automotive infotainment solutions including hardware shipments and service revenue for the United States, Canada, Western Europe, Eastern Europe, Latin America, Asia-Pacific, and Africa & the Middle East. It is part of the Automotive Infotainment ( and Automotive Technologies Research Services (

ABI Research provides in-depth analysis and quantitative forecasting of trends in global connectivity and other emerging technologies. From offices in North America, Europe and Asia, ABI Research’s worldwide team of experts advises thousands of decision makers through 70+ research and advisory services. Est. 1990. For more information visit, or call +1.516.624.2500.

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