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Novatel Wireless Signs Supply Agreement with DigiCore for Its Advanced MT 3060 OBD II Telematics Device

Monday, October 21st, 2013

Novatel Wireless, Inc. (Nasdaq:NVTL), a leading provider of intelligent wireless solutions, and DigiCore Holdings, Ltd. (JSE:DGC), a leading provider of advanced machine-to-machine (M2M) communication and telematics solutions, today announce that Novatel Wireless will be supplying DigiCore its cellular OBDII devices. Under the agreement, various versions of Novatel Wireless’ advanced MT 3060 OBDII platform will be available to DigiCore — one of the industry’s most advanced OBDII plug-and-play solutions for both the commercial and consumer telematics markets. The MT 3060 will be included by DigiCore in it is Ctrack® telematics solutions and services offering starting with vehicle usage and driver behavior monitoring as part of its end to end insurance telematics offerings.

Novatel Wireless will also license to DigiCore its N4A™ Device Manager software, and DigiCore has the option to license the N4A™ Communications and Management software platform.

“DigiCore is one of the leading fleet management and vehicle tracking companies, with key partnerships in insurance telematics,” says Peter Leparulo, CEO of Novatel Wireless. “We look forward to working together with DigiCore to integrate their Ctrack software platform and our OBDII devices to enable a host of telematics tracking and monitoring capabilities.”

“DigiCore is recognized as a world leading provider of machine-to-machine telematics solutions, our operations under the Ctrack brand span six continents, and we are one of the pioneers in the insurance telematics business,” added Deon du Rand, CTO at DigiCore, suppliers of Ctrack. “The MT 3060 is the most advanced OBDII platform we have seen to date, and combined with our onboard and front-end intellectual property, will provide a new level of value to our customers. As we have already proven with almost one billion driver behavioral kilometers analyzed, the use of telematics in the insurance market will be a growth driver for the industry, as our insurance customers move towards determining insurance premiums by taking into account aspects such as driving behavior, location and time of travel. We are pleased that Novatel Wireless will be a core part of our telematics offering,” Deon du Rand continued.

The MT 3060 platform is a plug-and-play, self-installing device that can be deployed in minutes by any driver. The device simply inserts into the OBDII port of a vehicle, without taking a vehicle out of service. The MT 3060 also boasts GPS capability and a highly sensitive 1000Hz 3-axis accelerometer that is optimized for sensing high impact driving behavior. The MT 3060 further optimizes performance by an innovative antenna design and disconnect alert feature using an on-board backup battery.

Novatel Wireless’ robust M2M software offerings can quickly build connectivity from Internet Protocol-enabled remote assets to existing enterprise applications. The N4A™ Communications and Management software platform provides a complete asset management user interface that focuses on managing configurations across multiple usage scenarios. N4A Device Manager is a robust environment for the management, configuration, self-care and support of Novatel Wireless M2M devices.

About DigiCore Holdings, Ltd.

With over 28 years of experience, DigiCore is recognized as a world-leading provider of advanced machine-to-machine (M2M) communication and telematics solutions; DigiCore adds value to a global base of Ctrack customers with mobile assets and workforces. DigiCore was founded in South Africa in 1985 and listed under the Electronics & Electrical sector on the Johannesburg stock exchange, JSE Limited, in December 1998 under the share code DGC. Today’s operations, under the Ctrack brand, span six continents, with over 1,000 employees and more than 750,000 systems sold. DigiCore has concluded a number of successful global acquisitions in recent years, and expanded the group’s strong international reach into new emerging markets, such as Asia, Africa Australia, and Latin America. A tradition of technologically superior products coupled with a proven track record in successfully rolling out and supporting mega projects worldwide, gives DigiCore a sustainable competitive advantage.

About Novatel Wireless

Novatel Wireless, Inc. is a leader in the design and development of intelligent wireless solutions based on 2G, 3G and 4G technologies. The company delivers specialized wireless solutions to carriers, distributors, retailers, OEMs and vertical markets worldwide. Product lines include MiFi® Intelligent Mobile Hotspots, Ovation™ USB modems, Expedite® embedded modules, Mobile Tracking Solutions, Asset Tracking Solutions, and Enabler smart M2M modules. These innovative products provide anywhere, anytime communications solutions for consumers and enterprises. Headquartered in San Diego, California, Novatel Wireless is listed on NASDAQ: NVTL. For more information please visit www.nvtl.com. (NVTLG)

This release may contain forward-looking statements, which are made pursuant to the safe harbor provisions of the United States Private Securities Litigation Reform Act of 1995, as amended to date. These forward-looking statements involve risks and uncertainties. A number of important factors could cause actual results to differ materially from those in the forward-looking statements contained herein. These factors include risks relating to technological changes, new product introductions, continued acceptance of Novatel Wireless’ products and dependence on intellectual property rights. These factors, as well as other factors that could cause actual results to differ materially, are discussed in more detail in Novatel Wireless’ filings with the United States Securities and Exchange Commission (available at www.sec.gov) and other regulatory agencies.

(C) 2013 Novatel Wireless, Inc. All rights reserved. The Novatel Wireless name and logo and N4A are trademarks of Novatel Wireless, Inc. Other Company, product or service names mentioned herein are the trademarks of their respective owners.

Contact Information

Novatel Wireless, Inc.


http://www.nvtl.com/

Automotive Sector Keeps Magnetic Sensors Market Ticking; Revenue to Rise 6 Percent by Year-End

Thursday, October 17th, 2013

131017_automotive_1

Semiconductor magnetic sensors are on track to attain 7 percent revenue growth this year, thanks to widespread adoption in the automotive sector, according to a new report from IHS Inc. (NYSE: IHS).

Global market revenue for magnetic sensors will reach $1.73 billion at year-end, up from $1.62 billion in 2012. Next year will see revenue expand again by approximately 7 percent to reach $1.85 billion, with growth continuing during the following three years ranging from 4 to 8 percent. By 2017, industry takings will amount to some $2.20 billion, as shown in the attached figure. 

Magnetic sensors are used to track rotational speed and linear angles in machines and devices, or to detect and process magnetic fields to establish positioning.

“More than 5 billion magnetic sensors and switches were sold last year, with automotive accounting for 52 percent of revenue and the consumer and mobile sector making up another 37 percent,” said Richard Dixon, principal analyst for MEMS and sensors at IHS. “The rest was in industry, energy, medical and other smaller applications, such as the transport, aerospace and maritime sectors.”

Automotive drives main use

In the past the sensors enjoyed a remarkable run of growth, helped to some degree by their key role in vehicle safety systems required by mandates. For instance, electronic stability control (ESC) systems engineered to help prevent vehicle skidding were a potent driving force in consumption, given the use of relatively expensive steering-wheel-angle sensors and at least four wheel-speed sensors.

ESC mandates helped propel the sensors toward rapid growth during the last several years, especially as they were being enforced in the highly developed automotive markets of the United States, Canada, the European Union, Australia, South Korea and Japan.

Hall ICs still rule
Overall, Hall-type integrated-circuit (IC) sensors and switches remain the most prominent magnetic sensor device, making up a whopping 89 percent of market revenue in 2012. Applications for Hall sensors include wheel-speed sensing in anti-lock brake systems; acceleration pedals; electronic throttle valve position; crankshaft sensing; and exhaust gas recirculation. In addition, there are as many as 30 applications for simple switches in the body of the vehicle—Hall-effect sensors dominate in this low-cost switch category.

Given the saturation of Hall-type devices, however, growth is coming from other areas, including anisotropic magnetoresistance (AMR), giant magnetoresistance (GMR) and tunneling magnetoresistance (TMR), Dixon noted. The change in technology mix is driven more by consumer applications—such as in electronic compasses—than by the automotive segment, which remains conservative in its implementation of new sensors. TMR devices could eventually enter the automotive market because of better performance compared to AMR and Hall ICs, but this won’t occur before the 2017 time frame.

Magnetic sensors as a whole seek to capture a wide range of measurements. For instance, the sensors gauge field or compass dimension—the principal type of measurement—in mobile and consumer applications. Meanwhile, both switches and linear sensors are used in cameras and cellphone displays—switches for handling simple on-off functions; linear sensors for autofocus and image stabilization.

Other measurements dependent on magnetic sensors comprise speed and position sensing in industrial motor applications, as well as current sensing in motors used in hybrid electric vehicles.

AKM of Japan is top supplier

The Top 10 suppliers of magnetic sensors account for 87 percent of industry revenue. Leading the pack is Asahi Kasei Microsystems of Japan on the strength of Hall-based electronic compasses for mobile handsets and tablets. AKM is followed, in order, by No. 2 Massachusetts-based Allegro Microsystems; Infineon Technologies of Germany in third place; Micronas of Switzerland in fourth; and Belgium-based Melexis in fifth.

Other important suppliers are NXP of the Netherlands, Yamaha and Alps Electric, both from Japan; the American-Austrian manufacturer ams; and Diodes Inc. from Texas.

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Quickly and Reliably Charge Any Portable Device over USB in a Car with a Single IC

Thursday, October 17th, 2013

Maxim Integrated’s automotive DC-DC converter with cable drop compensation integrates a smart USB charge emulator to enable fast and reliable charging for portable devices (PDs).

Recognizing and then charging any portable device (PD) directly from a vehicle battery can now be done over USB with a single IC, the MAX16984 automotive DC-DC converter with USB charge emulator from Maxim Integrated Products, Inc. (NASDAQ: MXIM).

Previously, PDs like smartphones and tablets could not charge reliably from OEM stock USB ports in vehicles. Long embedded USB cables cause a voltage drop and reduce charging current, resulting in a PD to not properly charge. Low-cost portable USB car chargers introduce RF interference. Now, the MAX16984 brings intelligent USB charging into an automobile and solves these problems. This single-chip solution integrates all the functions of the traditional three-chip solution. The MAX16984 combines a low EMI 5V automotive-grade DC-DC converter capable of driving up to 2.5A with dynamic voltage adjustment, which is essential for charging contemporary PDs over long automotive embedded cables; a USB Battery Charging Specification v1.2-compliant charge emulator, which conducts the necessary handshake between the PD and upstream host instructing the PD to increase its charge current; and integrated ESD diodes and USB over voltage protection switches, which provide robust industry-leading fault protection. The result is the fastest and most reliable PD charging with the smallest solution size. The MAX16984 is ideal for automotive radios and navigation modules, embedded telematics and connectivity modules, and USB-dedicated charging ports.

Key Advantages

  • High integration: the MAX16984 combines the functions of the standard three-chip solution: a 5V automotive-grade DC-DC converter capable of driving up to 2.5A, a USB BC1.2 charge adapter emulator, and USB protection switches for automotive USB host applications.
  • Higher performance: the MAX16984 operates from a voltage up to 28V and is protected from load dump transients up to 42V; integrated output adjustment eliminates cable voltage drop.
  • Reduced power: the MAX16984’s automotive USB function communicates with a connected PD and switches to low-power mode when not in use, thus reducing power consumption.
  • Safe charging: the MAX16984 is the only USB protection IC with integrated ESD diodes, which prevent damage to the vehicle’s radio or peripheral components.

Industry Commentary

  • “The highly integrated, small MAX16984 allows industry-leading USB charging directly from a low-cost radio, hub, or dedicated charge port,” said Ben Landen, Automotive Business Manager at Maxim Integrated. “The space and cost savings enable scalable designs into full vehicle fleets, across all sizes and classes, and help leverage consumer products into the automotive environment.”
  • “Smartphones and tablets are today’s rear-seat entertainment,” said Richard Robinson, Director of Automotive Analysis at Strategy Analytics. “The increasing requirement for automotive infotainment will boost the supporting semiconductor market to over $7.0 billion in 2018.”

Availability and Pricing

  • Available in 5mm x 5mm, 28-pin TQFN and QFND packages.
  • The MAX16984 is AEC-Q100 qualified and specified over the -40-degree Celsius to +125-degree Celsius automotive temperature range.
  • Contact factory for pricing.

Please visit the automotive solutions page for more information.

Hi-res images for the MAX16984 end application and MAX16984 block diagram are available.

About Maxim Integrated
At Maxim Integrated, our designs make the world more integrated. And with analog integration, the possibilities are endless. In Fiscal 2013, we reported revenues of $2.4 billion.

Follow Maxim Integrated on Twitter and Facebook.

Contact Information

Maxim Integrated


http://www.maxim-ic.com/

Cadence Offers Industry’s First IP Core Solution Supporting DTS Neural Surround

Thursday, October 10th, 2013

Tensilica HiFi Audio/Voice DSP Brings Home Theater Experience to Cars and A/V Receivers

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that it is the first IP core supplier to offer DTS® Neural Surround® Support. Partnered with the Cadence Tensilica HiFi Audio/Voice DSPs, DTS Neural Surround brings a home theater-like experience to automobiles and A/V receivers, significantly enhancing the sound quality of upmixing from compressed media types like MP3.

"Cadence continues to expand its leadership position with the Tensilica HiFi Audio/Voice DSP by bringing new, highly optimized and innovative audio solutions like DTS Neural Surround for next generation car audio processors and investing in extensive testing to ensure product robustness and quality," stated Geir Skaaden, senior vice president of products and platforms, DTS. "We’ve had a long history of working with the HiFi architecture, which offers a range of products spanning from ultra-low power to high-end performance applications."

"We’ve seen a growing demand from our customers and OEMs to support DTS decoders and audio solutions including the latest DTS Neural Surround for an enhanced surround sound experience in home and automotive entertainment," stated Jack Guedj, Cadence’s corporate vice president, IP Group. "Many recent sports and music broadcasts, including Rolling Stones concerts and the 2013 Super Bowl, were broadcast in DTS Neural Surround to ensure that fans received the highest level quality audio."

For content, DTS Neural Surround technology uses advanced techniques to encode up to 7.1 channels of audio to stereo while maintaining the surround queues from the discrete digital multi-channel track. The two-channel audio can then be broadcast in stereo or converted back up to 7.1 channels on the consumer end product enabled with Neural Surround, providing an experience as close to the original discrete multi-channel audio as is available today.

Cadence’s Tensilica HiFi Audio/Voice DSP is the most widely used licensable audio/voice DSP family, with support for over 100 proven audio/voice software packages. More than 55 companies have licensed the HiFi DSP family, and over 200 million HiFi DSP cores have been shipped in their smartphones, tablets, computers, digital televisions, home entertainment systems and other devices. See more at http://www.tensilica.com/products/audio.

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2013 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, Tensilica and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

Contact Information

Cadence Design Systems, Inc.

2655 Seely Avenue
San Jose, CA, 95134
USA

tele: 408.943.1234
fax: 408.943.0513
www.cadence.com

Automotive Energy Recuperation

Monday, October 7th, 2013

The increasing number of electrical components in a modern car are too much for batteries alone, so future vehicles will feature a form of built-in energy recuperation such as ultracapacitor technology.

Today’s vehicles are no longer designed just with the intension of getting passengers from point A to B. Engineers and designers understand consumers want practical applications such as power steering, central locking and fuel economy along with being connected to their devices and having uninterrupted access to data and content. This creates a wide range of high-power applications and factors that engineers must account for, as each require low-cost and long operating-life energy-storage systems in order to achieve optimal performance.

The automotive market understands that all the electrical components in a modern car are too much for batteries alone to sustain the long lifecycle needed and they are simply not equipped to respond in time during peak points of demand. This is why all future vehicles will feature a form of energy recuperation built in. This recovery will occur through various energy-storage systems (ESS), which is a component—or network of components—that contain a blend of energy-storage technologies used to collect the energy necessary for various functions.

An ESS is an application of ultracapacitor technology, sometimes referred to as supercapacitors. Either on their own or when combined with other types of energy-storage devices, such as batteries or fuel cells, ultracapacitors meet the requirements of user power demand. Regardless of the combination, ultracapacitors expand the vehicles charge and discharge capabilities into shorter response times, extend the life of other, lower-power elements and open up new options for energy-storage applications.

With government legislation driving higher energy demands, automotive engineers will begin designing vehicles with an electric “Turbo Boost” accessory to allow for smaller engines to be used. Ultracapacitors will provide acceleration and assist the traditional turbocharging process as needed. Automotive manufacturers are concluding that using ultracapacitor technology may result in lighter-weight vehicles with lower costs for consumers due to better fuel efficiency. This combination will go a long way in helping engineers meet the challenges presented by the corporate average fuel economy (CAFE) standards, which call for automakers to lower vehicle emissions and improve fuel efficiency.

The benefits of energy recuperation extend beyond engine productivity. Hybrid capacitors, a mixture of an ultracapacitor and a lithium-ion battery, support the high-cycle, wide temperature range and high-power demands of applications like automotive subsystems. Take memory back-up for example. When a vehicle’s battery is disconnected, the computer system loses power. With a hybrid capacitor, the system will retain its power and its information. It’s this type of reliability and consistency engineers are looking for. Nowhere is this more crucial than when it comes to driver and passenger safety. Many of the safety features in automobiles today require a high amount of power. As such, engineers must be able to ensure that the power supply feeding these applications can be delivered at a moment’s notice.

The market for ultracapacitor is expected to grow rapidly, particularly in Japan and Europe. By 2020, ultracapacitors are expected to be a $7 billion field, which represents a 56 percent compound annual growth rate. The high growth means cost of materials, manufacturing and overall pricing will fall significantly, making ultracapacitors an even more attractive energy-storage solution.

As vehicles and consumers become smarter, automotive engineers need to keep pace. All of the components, devices and connectivity embedded into our cars are for nothing if the energy needed to power them at the time of demand is lacking or non-existent. Energy recuperation via ultracapacitors offers the most reliable and greatest return on investment of any ESS available today. The key issue is to understand how to balance the energy and power demands from the ultracapacitor and the battery to support not only the vehicle itself, but the desirable features we all demand.


hall_chad

Chad Hall is co-founder and VP of marketing and product management for Ioxus, Inc. Find Chad on Twitter @PowerHall_UCAPS and @Ioxus.

Smart Antennas Drive Evolution in M2M and Automotive Applications

Monday, October 7th, 2013

Smart antennas provide the capability to co-locate the antenna and black-box functionality for better performance and lower cost.

The power of machine-to-machine (M2M) technology is driving towards a more connected world. All kinds of machines are getting connected to the Internet of Things to deliver the promise of enhanced productivity and to bolster the performance of businesses.

The evolving realms of technology are revolutionizing many industries. The automotive industry is trending towards intelligent cars that are fully connected in order to achieve vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication for improved safety. Fleet management companies are utilizing M2M systems to monitor operational performance and service efficiency using real-time fleet tracking. Smart technology is enabling improved supply chain systems in industries such as vending and service.

Reliable non-stop connectivity requires that these systems support a wide array of wireless capability. This means machines are getting packed with Bluetooth, Bluetooth Low Energy (BLE) and Wi-Fi for personal or local network connection; Cellular protocols such as 2G, 3G, 4G and LTE for wide-area network connection; and global navigation satellite systems (GNSS) such as GPS, Galileo, Glonass and Beidou to support location-based services. This demand for added capability pushes toward higher system-level sophistication which can create challenges.

Challenges of Traditional M2M Systems

Traditionally, embedded M2M systems come with a black box containing connectivity features, control circuitry, power supply circuitry, wireless radios and other functions. The black box then connects to the bus system and/or a power source within the machine to allow the M2M system to run. Many connected machines in the field are metallic (examples include vehicles, vending machines, generators and containers). On these metallic structures, the antenna for the M2M system must be installed on the outside of the machine to maximize the system performance. As such, the antennas for the M2M system are in a different physical location than the black box and are connected to the black box via RF cables (as seen in Figure 1).

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Figure 1: Vending machine in a traditional M2M system

Even though this architecture is used on many M2M systems, it poses several potential system concerns. First, RF cables inherently have loss; the longer the cable, the more antenna gain lost between the black box and the antenna negatively affecting system performance. Second, there are two cost implications. Running multiple RF cables increases the total cost of the system, especially if the distance between the black box and the antenna is large. Additionally, as more technology gets added to the M2M system, more cables need to be run, which also adds cost and complexity. Finally, with more cables and more connectors within the system there are increased installation costs and higher risk of intermittent connection failures. For example, in heavy equipment and automobiles that are prone to vibration, there could be higher instances of connector or cable damage resulting in loss of data.

Smart Antennas Maximize Efficiency, Minimize Cost

One way to reduce system cost and improve efficiency in embedded M2M applications is to re-think the architecture of an embedded M2M system. Instead of depending on the black box to perform all of the critical tasks of the system, a system designer could pull the wireless portion of the design in to the antenna. This concept can be referred to as a smart antenna design.

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Figure 2: Smart antenna architecture for vehicle

Smart antennas provide an option to co-locate the antenna and some of the black box device functionality (mainly radios) into the antenna package. A single digital cable can then be run from the smart antenna to the depopulated black box. See Figure 2 for an example of how a smart antenna could be architected to work in a vehicle environment.

The embedded M2M system then becomes more efficient as the loss of data between the antenna and the black box is minimized with a digital cable versus multiple coaxial cables. Digital signals can utilize error-correction software and are more resistant to electromagnetic noise and signal attenuation than analog signals. Additionally, cellular systems are evolving quickly and other wireless standards continue to get updated. Customers not only want to upgrade their systems from 2G to 3G and 4G but also want to add the most cutting-edge wireless functionality (i.e., BLE and Wi-Fi Direct). When the technology evolves, it drives hardware and software changes. These hardware and software changes then need to be re-validated and re-certified. By moving the wireless functionality into the antenna, the core black box no longer needs to evolve as quickly as the wireless market pushes. The smart antenna can truly act as the data pipe and the black box can focus on its key functionality.

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Figure 3: Example of smart antenna for vending machine

Finding the Right Fit

While a number of market players provide smart antenna solutions, not all of them are successfully able to address all of the challenges. Getting the design right is the first step.

Because the smart antenna packages additional components into the antenna, the size of the smart antenna may be larger than a regular antenna. Space and styling constraints on certain equipment will not allow larger smart antenna packages than typical antenna sizes. For instance, the styling of a vehicle is very important to vehicle OEMs. It is critical that the smart antenna is created with the customer’s or system integrator’s guidelines in mind.

Depending upon where the smart antenna is located on the subject equipment, there could be more stringent environmental challenges. Electronics that were once hidden inside of the equipment are now located outside of the equipment in the antenna package This may create additional challenges with temperature, humidity, water ingress or a variety of other environmental factors.

Moving the radios from the black box into the antenna could pose firmware challenges. Typically the black box has been seen as the brain of the system with the antenna being the afterthought. When moving some of the electronics away from the black box to the antenna, it is critical to understand how information will be passed from the smart antenna to the black box. No longer is there just an RF signal coming from the antenna. Depending on the complexity of the smart antenna design, there could be RF data, location data and machine bus information passing over a digital line. In this case, there will be some firmware required within the smart antenna. If these issues are not addressed correctly during the system design phase, persuading system integrators to adopt smart antenna architecture will be a challenge.

Although challenges exist, the adoption of smart antenna technology in to the embedded M2M system space could lead to more efficient systems for companies looking to maximize performance while controlling initial capital expense and long term system evolution costs.


furr_jason

Jason Furr is global sales manager for Laird, where he focuses on generating new business in the growing telematics & M2M markets. Jason holds a bachelor’s degree in business from The University of Michigan-Dearborn and an MBA from Michigan State University.




dharmarajan_vidhya

Vidhya Dharmarajan is a technical writer for Laird, where she is responsible for creating, refining and maintaining product documents and writing white papers, market research and competitor analysis for the Telematics business group. Vidhya holds a master’s degree in VLSI Design from San Jose State University in California.

eSOL’s eT-Kernel Real-Time OS Platform Supports Renesas’ Second Generation R-Car SoCs for In-Vehicle Infotainment Systems

Monday, October 7th, 2013

Enables Blending of AMP and SMP on the ARM Cortex-A15 MPCore Multi-Core Processors to Ensure Flexibility and High System Reliability

eSOL, a leading developer of real-time embedded software solutions, today announced that the eT-Kernel Real-Time OS Platform now supports Renesas Electronics Corporation’s R-Car series of Systems-on-Chip (SoCs) with the ARM(R) Cortex(TM)-A15 MPCore(TM) multi-core
processor.

The eT-Kernel Platform has been selected for a wide range of applications across automotive, factory automation (FA), industrial, and consumer products. The eT-Kernel Platform, with proven real-time capability and reliability, and Renesas’ R-Car series are ideal for high-end automotive infotainment systems. This combination enables manufacturers to ensure quality while equipping vehicles with advanced features such as Advanced
Driver Assistance Systems (ADAS), high-level multimedia processing, and sophisticated user interfaces.

Renesas’ second generation R-Car series, based on the ARM Cortex-A15 MPCore multi-core processor, includes the R-Car H2 and the newly-announced R-Car M2 SoCs. The new R-Car H2 and R-Car M2 integrate the PowerVR(TM) high-performance graphics core, an optional image recognition engine, and automotive I/O interfaces on a single chip, making them best suited for high-end car information systems with high-definition displays, instrument clusters, and rear seat monitors. Since the new R-Car series is highly compatible with the first generation R-Car H1/M1/E1 SoCs, current customers and developers are able to easily reuse software assets to reduce development costs.

The eT-Kernel Platform fully supports the ARM Cortex-A15 MPCore quad-core processor on the R-Car H2. Since the R-Car H2 and the R-Car M2 share common peripheral controllers, the eT-Kernel Platform can be easily ported on the R-Car M2. The eT-Kernel platform, designed for the second generation R-Car SoCs, integrates the eT-Kernel Multi-Core Edition real-time OS, the eBinder IDE, plus middleware components including a file system, TCP/IP protocol stacks, USB host and device stacks, and graphics tools?all supported by professional services.

Thanks to eSOL’s support of both the POSIX and T-Kernel open standards, developers can reuse software assets for Linux, uITRON, and T-Kernel OSes. eSOL’s unique Blended SchedulingR technology, implemented on the eT-Kernel Multi-Core Edition, enables flexible system design by allowing symmetric-multiprocessing (SMP), which maximizes the superior performance of the ARM Cortex-A15 MPCore, and asymmetric-multiprocessing (AMP) subsystems, which ensure real-time determinism, to coexist in a single system. The eT-Kernel Temporal Partitioning and the eT-Kernel Multi-Core Edition Memory Partitioning ensure high system reliability. The eBinder IDE, tightly integrated with the eT-Kernel Multi-Core Edition, provides tools for
multiprogramming, debugging, system analysis, and more, which facilitates the efficient development of high-quality, complex multi-core systems.

Besides the R-Car series, the eT-Kernel Platform already supports various Renesas MPU and SoCs including the RZ/A series, the R-Mobile series, the SuperH family, and the VR series. As a leading and long-time member of the Renesas Partner Program, eSOL is committed to support future Renesas CPUs. Developers can make maximum use of the ARM cores’ performance and features with the eT-Kernel Platform, which supports the entire ARM Cortex-A series, including the Cortex-A15 and Cortex-A9.

"Renesas welcomes eSOL’s eT-Kernel Multi-Core Edition real-time OS support for our second-generation R-Car series of SoCs," said Tatsuya Nishihara, Vice President, Chief of Automotive Solutions Business Division, Renesas Electronics Corporation. "The eT-Kernel Platform has supported many of Renesas MPU and SoCs and it is well known as a reliable real-time OS-based platform among our customers, which is why it has been adopted in so many automotive infotainment systems. eSOL, as one of our important OS partners, plays a major role in providing comprehensive and significant OS solutions to system manufacturers of Renesas SoC-based systems."

"Automotive infotainment systems inevitably demand more and more real-time performance to provide important driver assistance information using sophisticated graphics displays," said Hiroaki Kamikura, General Manager of the Embedded Products Division, eSOL. "eSOL is committed to strongly support R-Car-based software developers. Developers can incorporate its proven real-time capability and reliability into their own systems. The eT-Kernel Platform has been used in a variety of applications including car navigation systems, satellite systems, and consumer products"

About eSOL
eSOL is a leading embedded software developer that enables customers to accelerate   the development of applications based on high-end embedded processors, including multi-core. eSOL’s advanced, scalable, and multi-profiled real-time operating systems are tightly integrated with development tools and middleware components to create flexible development platforms used by OEMs and ODMs worldwide in competitive vertical markets such as automotive, consumer electronics, industrial and medical equipment, and aerospace. Founded in 1975, eSOL is based in Tokyo, Japan.
For more information, please visit http://www.esol.com/

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eSOL Co., Ltd.

1-32-2 Honcho
Harmony Tower
Nakano-ku, Tokyo, 164-8721
Japan

tele: +81 3.5302.1360
fax: +81 3.5302.1361
ep-info@esol.co.jp
www.esol.co.jp

Innovative Start/Stop-Compatible Amplifier for Clearer Sound in Cleaner Cars

Monday, October 7th, 2013

STMicroelectronics’ TDA7802 is the first automotive start/stop-compatible audio power amplifier to combine the performance and cost benefits of a digital input with the simplicity and enhanced efficiency of analog class SB-I amplification.

The TDA7802 extends ST’s family of ‘green power’ products specially designed to support advanced technologies for cleaner cars, such as start/stop (micro-hybrid), which reduces emissions by cutting the engine instead of idling. The TDA7802 operates seamlessly even when its supply voltage drops as the engine restarts. Its digital input connects directly to a digital sound processor, saving digital/analog converter and low-pass filter components. This approach reduces application size and cost, while ensuring clearer sound and improving coexistence with other equipment such as mobile phones.

The class SB-I (SB-Improved) analog amplifier can reach 50% lower heat dissipation than a class AB analog amplifier, allowing smaller heatsinks or extra functionality in the head unit within the same thermal budget. The outstanding thermal performance makes the TDA7802 an easy and valuable alternative when a class D solution cannot be used.

The TDA7802 delivers 4x50W into 4Ω speakers and will drive loads as low as 1Ω. It has outstanding noise performance, achieving SNR of 115dB, and over 110dB dynamic range. Built-in diagnostics protect against short-circuit failures or speaker disconnection.

The TDA7802 is available immediately in PowerSO36 or Flexiwatt27 through-hole/surface-mount packages, from $7.00 for orders over 1000 units.

For further information please visit www.st.com/tda7802

Contact Information

STMicroelectronics

39, Chemin du Champ des Filles
C. P. 21 CH 1228 Plan-Les-Ouates
GENEVA ,
Switzerland

toll-free: +41 22 929 29 29
fax: +41 22 929 29 88

Bsquare to Demonstrate Connected Car Expertise at Telematics Japan 2013 and GENIVI All Members Meeting

Monday, October 7th, 2013

New Tizen-Based HMI Demo and Executive Presentations Highlight Participation

BSQUARE Corporation (NASDAQ: BSQR), a leading enabler of smart, connected systems, will showcase connected car solutions and deliver executive presentations at two key automotive industry events in October. These include Telematics Japan 2013, October 8-10 in Tokyo and the GENIVI Alliance All Members Meeting, October 8-11 in San Diego, CA.

At Telematics Japan 2013, on October 9 Mark Whiteside, Bsquare SVP of Professional Services, will present a session entitled “Not Too Early, Not Too Late: Selecting Technology for Automotive HMI” that will discuss considerations for manufacturers when designing In-Vehicle-Infotainment (IVI) systems, where to focus their efforts, and how technologies like HTML5 can help manufacturers focus their attention on development that will provide meaningful differentiation for their systems rather than spend significant development resources developing the underlying technologies to support IVI systems.

At the GENIVI Alliance All Members Meeting on October 10 Mike Stipe, Bsquare SVP of Worldwide Sales and Marketing, will present “The Implications of the Ultimate Connected Car” which communicates the Bsquare vision for the Ultimate Connected Car and its implications on IVI and Telematics system design as well as the ecosystem as a whole.

At both events, Bsquare will unveil a brand-new Tizen-based HTML5 Human Machine Interface (HMI) demo that ties into a GENIVI Alliance automotive data simulator. Bsquare will also be demonstrating is powerful TestQuest automated testing solution and its ability to help automotive OEMs and suppliers to increase system quality while reducing project length and cost.

These efforts demonstrate Bsquare’s increased emphasis on the automotive industry and connected car technologies. Bsquare is participating at over 10 automotive industry events globally in 2013. Bsquare also continues to dedicate resources to the automotive industry and increase technical participation in key industry groups such as the W3C and the GENIVI Alliance.

Bsquare empowers automotive OEMs, Tier 1 and Tier 2 suppliers to quickly deliver innovative, high quality connected automotive systems:

  • Extensive embedded development experience and expertise
  • Automotive system integration
  • Technology products and development tools
  • Quality Management and test services

About Bsquare
Bsquare, a global leader in embedded solutions, applies experience and expertise on leading platforms to create new connections with customers, new business models and to enable new ways of working and communicating. Bsquare serves customers by forging connections among the partners, people, tools, and technology needed to create smart connected devices. For more information, visit www.bsquare.com.

BSQUARE is a registered trademark of BSQUARE Corporation. All other product and company names herein may be trademarks of their respective owners.

Contact Information

BSQUARE

110 - 110th Avenue NE
Suite 200
Bellevue, WA, 98004
USA

tele: 425.519.5900
fax: 425.519.5999
sales@bsquare.com
www.bsquare.com

MontaVista Announces New Proof-of-Concept Program to Deliver Low-Cost Option for Rapid Prototyping of Automotive Projects

Saturday, October 5th, 2013

MontaVista Releases its 3.0 Automotive Technology Platform and is First Company to be Declared Compliant to the New GENIVI 3.0 Specification

MontaVista® Software LLC. today announced the launch of its Automotive Technology Platform PoC Program (ATP PoC), a new low cost program designed to enable Tier-1s and OEMs in the Automotive IVI market to rapidly engage in Proof-of-Concept (PoC) or demonstration projects on a limited budget. In conjunction with this new program, MontaVista announced the release of its new Automotive Technology Platform (ATP) 3.0, the first platform declared compliant to the new GENIVI Compliance specification version 3.0 by the GENIVI Alliance.

MontaVista’s ATP PoC program bundles an evaluation copy of MV ATP with engineering services and support to enable rapid prototyping at the startup phase of a new project. This allows customers to rapidly create a prototype or demo without having to make a large investment while ensuring the solution solves specific design problems or meets specific performance criteria. The ATP PoC bundle includes MV ATP for a specific hardware reference platform, access to the development tools for a 1-year timeframe, a block of engineering services hours and limited support. With this program, Tier-1s and OEMs are able to prototype their target environment, evaluate new features or do some performance testing and hardware evaluation. Upon successful completion of the PoC, the program can be upgraded to a fully supported MV ATP with professional services to bring the project to production.

With the release of MontaVista Automotive Technology Platform (ATP) 3.0, MontaVista continues to keep pace with the growth and refinement of the GENIVI Compliance specifications as it adds new components and refines definitions of many modules. This new specification shows the ongoing process of delivering significant improvements and updates on a consistent basis by the GENIVI Alliance. Along with the compliance 3.0 update, MontaVista Automotive Technology Platform 3.0 delivers more flexibility and robustness with the enhancements to its virtualization capabilities and userland components.

"With the release of this new PoC program designed around the Automotive Industries requirements and the new release of ATP 3.0, MontaVista continues to lead the way in supporting Tier-1s and OEMs in the development of their Open Source Linux projects. We saw a need in the market place to provide a platform for rapidly testing new concepts and features, or evaluating the performance of new hardware platforms,” said Dan Cauchy, Vice President and General Manager, Automotive Business Unit for MontaVista Software and Board Member of GENIVI Alliance. “The MontaVista PoC program lowers the cost of entry and level of complexity in starting a Linux based project and provides an excellent starting point for hardened, production quality IVI projects.”

MontaVista ATP enables automotive manufactures and tier-1 suppliers to build powerful in-vehicle-infotainment (IVI) systems while significantly accelerating time-to-market and lowering development costs of innovative new features.

Some of the key components of MontaVista Automotive Technology Platform are:

  • Linux-based, GENIVI Compliant platform with fast boot/start up, high performance, power management and security options built in
  • MontaVista Linux Containers providing isolated virtualized container environments
  • Comprehensive networking and internet support
  • Multimedia capabilities for audio and video requirements
  • Integration for consumer devices via Bluetooth or APIs
  • Vendor specific UI customization
  • Fully integrated tool set for application development

General availability of MontaVista ATP 3.0 is expected to begin November 2012.

About MontaVista Software

MontaVista Software, LLC, a wholly owned subsidiary of Cavium, Inc. (NASDAQ: CAVM), is a leader in embedded Linux commercialization. For over 10 years, MontaVista has been helping embedded developers get the most out of open source by adding commercial quality, integration, hardware enablement, expert support, and the resources of the MontaVista development community. Because MontaVista customers enjoy faster time to market, more competitive device functionality, and lower total cost, more devices have been deployed with MontaVista than with any other Linux. To learn more, please visit www.mvista.com

Linux is a registered trademark of Linus Torvalds in the United States and other countries. MontaVista is a registered trademark of MontaVista Software, Inc. All other names mentioned are trademarks, registered trademarks or service marks of their respective owners.

Contact Information

MontaVista

2315 North 1st, 4th Floor
San Jose, CA, 95131
USA

tele: (408) 943-4500
sales@mvista.com
www.mvista.com

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