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Microchip Releases MOST150 Data Link Layer Specification

Friday, February 28th, 2014

Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that it has made available for license, on a royalty-bearing basis, its proprietary MOST150 Data Link Layer Specification. By making the key technologies available for the lower layers of MOST150, other semiconductor companies now have the opportunity to develop, manufacture and supply chips with a MOST150 interface.

The open MOST® standard for network communication is utilized in the infotainment and driver-assistance domain for automobiles and other applications that have been developed by and within the MOST Cooperation, a consortium of key automotive companies and suppliers. As is typical for standards-based technologies, there is complementary technology and intellectual property that is important for implementing standards-based products, though they are not part of the standard itself.

As committed and communicated by the MOST Cooperation on Oct. 1, 2007, the data link layer specifications of the respective MOST standard speed grades will be opened and licensed after reaching certain defined milestones. In the spirit of open technology innovation, Microchip has decided to release and license the MOST150 data link layer specification earlier than stipulated by that 2007 agreement, to encourage other semiconductor companies to participate in MOST150 development. Currently, there are more than 150 car models on the road with MOST technology, and the MOST Cooperation expects that there will be over 60 more car models with MOST150 starting mass production within the next three to five years.

The MOST150 data link layer specification is being published to MOST Cooperation members, who can license its use on a royalty-bearing basis and under RAND licensing terms (Reasonable And Non-Discriminatory), similar to other comparable networking standards, such as the Controller Area Network (CAN) bus.

“Microchip is committed to the MOST technology and products, as well as to the principles established by the MOST Cooperation to promote this technology and enable its adoption,” said Dan Termer, vice president of Microchip’s Automotive Information Systems Division. “We believe that the licensing of the MOST150 Data Link Layer Specification is a major step in that direction.”

About MOST Technology

MOST technology enables the networking of feature-rich, multimedia infotainment and driver-assistance systems in automobiles, by providing the means to distribute functions among the various control devices around the vehicle.

About the MOST Cooperation

The MOST Cooperation was founded in 1998 by BMW, DaimlerChrysler, Harman/Becker and OASIS SiliconSystems (acquired by SMSC in March 2005 which in turn was acquired by Microchip in August 2012) to establish and refine the MOST technology as a common standard to meet the needs of the automotive networks of today and tomorrow. For additional information, see http://www.microchip.com/get/DER6.

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About Microchip Technology
Microchip Technology Inc. (NASDAQ: MCHP) is a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at http://www.microchip.com/get/PRQN.

Contact Information

Microchip Technology Inc.

2355 W. Chandler Blvd.
Chandler, AZ, 85224
USA

tele: 480.792.7200
toll-free: 888.MCU.MCHP
fax: 480.792.7277
here2help@microchip.com
www.microchip.com

Featured Webcast

Thursday, February 27th, 2014

How to design, certify and deploy multicore based systems in safety-critical applications

This webinar examines software, methods and case studies of COTS software and hardware that will unlock the potential of multicore devices so that all cores can be used. Industry experts also describe ways to use multicore devices in mixed critical systems where different certification levels are desired.

Sponsored by:
SYSGO
Kontron

China Automotive Semiconductor Market Drives Up 11 Percent in 2013, Thanks to Safety and Navigation Features

Wednesday, February 26th, 2014

El Segundo, Calif. (Feb. 26, 2014)—The fast-growing semiconductor market for China’s automotive industry is set for double-digit expansion in revenue this year, propelled by an increasing desire among Chinese car buyers for added vehicle safety features and helpful infotainment applications like car navigation, according to a new report from IHS Technology (NYSE: IHS).

Chip consumption in 2014 by the country’s automotive industry will amount to $4.6 billion, up a solid 11 percent from $4.1 billion last year. This year’s projected revenue growth improves on the already strong 10 percent rise of the China automotive chip market in 2013, and three more years of similar notable increases will take place. By 2017, revenue will reach $6.2 billion, as shown in the attached figure.

“The replacement of midrange and high-end cars this year will drive the China chip market for automobiles,” said Alex Liu, analyst for China research at IHS. “In particular, demand will be great in vehicle safety and control applications like advanced driver assistance systems (ADAS), as well as in manufacturer-included or aftermarket infotainment navigation equipment.”

China continues to be a place of rising automobile production and shipments. Passenger cars, for instance, which make up three-fourths of all cars in the country, saw shipments climb 2 percent last year to 15.8 million units. The steady outflow of cars means there is a continuous demand for automotive semiconductors, especially for new microcontrollers and sensors that help drive car safety and vehicle comfort—two areas of increasing concern to China’s car buyers.

These findings are contained in the report, “Automotive Electronics Report – China – H2 2013,” from the Automotive & Transportation service of IHS.

Navigation a hot contest between OEM and aftermarket
Vehicle navigation is a key application of automotive semiconductors used for infotainment. Here original equipment manufacturers (OEM) of navigation equipment compete ferociously with the aftermarket for consumer dollars. But unlike other automotive applications such as power train and safety, the aftermarket segment for navigation has a sizable presence in China, providing car buyers the option to update or change the navigation systems in their cars after purchase.

Aftermarket shipments in China for car navigation systems last year reached 7.1 million units, up 20 percent from a year earlier. Key navigation-processor suppliers included CSR of Wales, MediaTek and MStar Semiconductor of Taiwan, Samsung of South Korea and Freescale Semiconductor from Texas.

OEM navigation shipments, in comparison, trailed at 2.4 million units, up 15 percent. But while the aftermarket is projected to slow down, OEM-related navigation will enjoy rapid growth in the years ahead as prices decline in branded systems. Moreover, next-generation technology such as telematics and internal smart connections are forging close ties with OEMs, which could provide the branded market highly needed leverage over the aftermarket.
Japan’s Renesas Electronics was the leading processor provider for OEM navigation with more than 40 percent shipment share, followed by other important players like Freescale Semiconductor and Dallas-based Texas Instruments; CSR, also prominent in the aftermarket; and Bosch of Germany. 

Security matters
Not just for high-end or luxury vehicles, ADAS systems are becoming increasingly common in China. Features such as adaptive cruise control, parking assist, forward-collision warning, lane-departure warning and blind-spot detection are fueling a vigorous market for automotive sensors that control such functions. The sensors used here include cameras, radar systems, ultrasound and LIDAR.

Parking assist is particularly popular in the Chinese market, owing to the serious space and parking problems in China’s megacities. Lower system prices have helped push growth for this market, with the total installed base by 2017 anticipated to reach some 18 million units.

Total processor revenue in China for ADAS and vehicle-related safety features amounted to $8.8 million last year, forecast to climb to $45.0 million by 2017.

For more information, please contact:
Jonathan Cassell
Senior Manager, Editorial
jonathan.cassell@ihs.com
Direct: + 1 408 654 1714
Mobile: + 408 921 3754
Or
IHS Media Relations
press@ihs.com
+1 303 305 8021
_________________________________________________________________________________

About IHS (www.ihs.com)
IHS (NYSE: IHS) is the leading source of information, insight and analytics in critical areas that shape today’s business landscape. Businesses and governments in more than 165 countries around the globe rely on the comprehensive content, expert independent analysis and flexible delivery methods of IHS to make high-impact decisions and develop strategies with speed and confidence. IHS has been in business since 1959 and became a publicly traded company on the New York Stock Exchange in 2005. Headquartered in Englewood, Colorado, USA, IHS is committed to sustainable, profitable growth and employs approximately 8,000 people in 31 countries around the world.
IHS is a registered trademark of IHS Inc. All other company and product names may be trademarks of their respective owners. Copyright © 2014 IHS Inc. All rights reserved.

LDRA Compliance Management System Details Steps for Realizing ISO 26262 Standard Compliance

Tuesday, February 25th, 2014

ISO 26262 compliance management tools guide automotive suppliers to the high-quality standards demanded by OEMs

lrda1

Nürnberg, Germany. February 25, 2014―LDRA, the leading provider of safety-critical software verification tools and software best practices, releases the LDRA Compliance Management System (LCMS) to provide companies with the proper infrastructure enabling ISO 26262 compliance. LCMS for ISO 26262 walks customers through the fully compliant plans, document and transition checklists, standards and other lifecycle documents, and problem reports to help customers manage software planning, development, verification, and regulatory activities of ISO 26262 Part 6, Product Development: Software Level (ISO 26262-6). LCMS for ISO 26262-6 details a process that ensures software functional safety at dramatically reduced project costs.

Compliance Mandated to Manage Liability

Although ISO 26262 is not government mandated, automotive OEMs have adopted the standard for their supply chain as a way to ensure quality and to manage risk and liabilities. For suppliers, this demand for standard compliance imposes a need for explicit processes and documentation that provides process and product visibility and enables process assessment by OEM Safety Assessors sent to audit suppliers. LCMS includes the detailed document templates outlined by the ISO 26262 standard and walks the LCMS customer through the required activities needed to gain approval for each stage of development.

LCMS’s comprehensive compliance management can become the process backbone underpinning compliance for automotive suppliers. LCMS comes complete with a document review management system, comprehensive review and analysis management system, and problem reporting management system with activity checklists.

Building on LDRA’s more than forty years of high-assurance software quality and certification experience, LCMS helps companies transition through the stages, automating the process to ensure that progress from one stage to another is seamless. While the compliance tools can work with any customer tool chain, customers who integrate LCMS for ISO 26262-6 with the LDRA tool suite are able to streamline their verification process, further reducing thousands of hours of documentation effort and up to 50 percent reduction of planning costs.

“To reduce cost while improving quality, today’s automobiles have become highly dependent on safety-critical electronics that involve a complex matrix of specifications, interrelationships, and proofs that the system fully functions as intended,” noted Ian Hennell, LDRA Operations Director. “LCMS provides a foundation for these high-assurance development environments, streamlining the processes and ensuring that companies can achieve standards compliance in less time and for less cost.”

To provide additional flexibility and security for customers, LDRA offers LCMS for ISO 26262-6 to operate in either cloud-based or locally hosted environments. LCMS Local is installed and secured behind an applicant’s firewall to address security-sensitive requirements while LCMS Cloud delivers a more economical option for companies with greater flexibility. Both options include a two-day quick start training.

Hands-on Demonstrations of LCMS for ISO 26262

The capabilities of the LCMS for ISO 26262-6 will be demonstrated at Embedded World in Nürnberg, Germany, February 25–27, 2014 in Hall 4-526. As well, an online video www.ldra.com/lcms-iso26262-demo highlights product features and walks project managers, developers, quality assurance managers through the step-by-step implementation of the ISO 26262 automotive compliance process.


About LDRA

For more than 40 years, LDRA has developed and driven the market for software that automates code analysis and software testing for safety-, mission-, security- and business-critical markets. Working with clients to achieve early error identification and full compliance with industry standards, LDRA traces requirements through static and dynamic analysis to unit testing and verification for a wide variety of hardware and software platforms. Boasting a worldwide presence, LDRA is headquartered in the United Kingdom with subsidiaries in the United States and India coupled with an extensive distributor network. For more information on the LDRA tool suite, please visit: www.ldra.com.

Contact Information

Program for the MOST® Forum 2014 Released

Monday, February 24th, 2014

Microchip Technology Will Outline MOST Vehicle Networking Strategy

The MOST® Cooperation – standardization organization for the leading automotive multimedia network technology Media Oriented Systems Transport (MOST) – is pleased to announce the conference program for the upcoming MOST Forum on 13 May 2014 in Stuttgart/Esslingen (Germany). Ganesh Moorthy, Chief Operating Officer for Microchip Technology, will inaugurate the conference with his keynote speech on Microchip’s MOST vehicle networking strategy as one of the key technology drivers behind MOST Technology. Microchip is deeply involved in further development of the leading automotive network technology. Besides next-generation gigabit speed capability, MOST functions will be defined in the broader context of automotive networking in general. The conference and accompanying exhibition will again provide a platform for exchange and networking for professionals from the automotive electronics industry and academia, including researchers, designers, engineers, system developers, purchaser, and managers as well as media representatives.

Conference Program: Roadmap from MOST150 Rollout and Advancements to Next Generation Networking

After opening the conference and welcoming the attendees, Henry Muyshondt, Executive Director of the MOST Cooperation, will guide the program. Following the keynote speech by Microchip Technology, presentations by AutoNetworks Technologies, TE Connectivity and Ultra Communications will introduce solutions and scenarios for the future MOST physical layer. Compliance and quality aspects will be introduced by K2L and Ruetz System Solutions. During the lunch and networking break all attendees and speakers are welcome to visit the exhibition area to learn about available MOST solutions and realizations in brand new vehicle models. The afternoon events will focus on MOST network and system architecture by the Research Center for Information Technology (FZI), Microchip Technology, MOST Cooperation and Quanta Storage. Following the afternoon discussion and exhibition break, Daimler and Microchip will round up this conference program with further presentations on aspects of network and systems architecture such as the launch of MOST150 in the new Mercedes-Benz S-Class vehicles and a look into the MOST future as the standard for in-car communication. 

In the exhibition area, various companies will present their innovative MOST solutions and applications. Amongst the exhibitors will be the MOST Cooperation. Further exhibits will be by AUDI AG, Daimler AG, Hamamatsu Photonics, K2L, Microchip Technology, Ruetz System Solutions, Tektronix, Teledyne LeCroy, Telemotive, TTTech Automotive, Vector and others. Several partners will again provide their knowledge and expertise to the MOST Forum. These include industry partner ZVEI (Electrical and Electronic Manufacturers’ Association, www.zvei.org) and media partners Auto Electronics (www.autoelectronics.com), Automotive IQ (www.automotive-iq.com/electrics-electronics/), Automotive Industries (www.ai-online.com), EE Times Europe (www.eetimes.eu), Elektronik automotive (www.elektroniknet.de), and ElektronikPraxis (www.elektronikpraxis.de).

Image Preview: http://www.alvacon.com/en/news/most-forum-20140224-2014-program/

MOST Forum Program: Roadmap from MOST150 Rollout and Advancements to Next Generation Networking
Copyright: www.mostcooperation.com
Download: http://www.alvacon.com/media/images/MOST-Forum-2014-Program-.jpg

Conference Program

09.30
Registration and Reception Coffee, Exhibition Opens

10.00
Opening and Welcoming Speech
Moderation: Henry Muyshondt, MOST Cooperation

Keynote
10.05
MOST Vehicle Networking Strategy
Ganesh Moorthy, COO of Microchip Technology

MOST Physical Layer
10.30
AGF Physical Layer Solution for Five Gigabit Communication Networks Hayato Yuki, AutoNetworks Technologies, Ltd. (Sumitomo Electric group)

10.45
Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments Chuck Tabbert, Ultra Communications

11.00
Glass Fiber Connectivity for Future Optical Automotive Networks
Markus Dittmann / Andreas Engel / Aberto Alamo-Alonso, TE Connectivity         

MOST Compliance and Quality
11.15
Building Blocks for a Successful Verification Process of a Tier1 ECU
Dr. Terezia Toth, Ruetz System Solutions             

11.35
Test and Simulation: The Nerve Center of the MOST Technology Development Process Matthias Karcher, K2L

11.55
Exhibitor Presentations

12.15
Lunch / Networking / Exhibition

MOST Network and System Architecture
14.15
UPnP Enables Universal Control of In-vehicle MOST Devices       
Prof. Dr. Oliver Bringmann / Sebastian Reiter / Prof. Dr. Wolfgang Rosenstiel / Dr. Alexander Viehl, FZI  

14.35
New Data Types for MOST Function Blocks
Renato Machelett, MOST Cooperation 

14.55
MOST Approach for Video Camera Systems in ADAS
Dr. Bernd Sostawa, Microchip Technology           

15.15
Development of a MOST150 Around View Monitor on a Mainstream Automotive Infotainment Processor
Wen-Jing Lin, Quanta Storage   

15.35
Coffee Break / Networking / Exhibition

16.40
Insights into the Launch of MOST150 in the New Mercedes-Benz S-Class Dr. Jan Bauer, Daimler

17.05
MOST – the Standard for In-Car Communication Rainer Klos, Microchip Technology

17.30
Conclusion and End of Conference, Exhibition Closes

About MOST Technology
MOST (Media Oriented Systems Transport) is a multimedia networking technology optimized for use in cars and other applications. It enables the transport of high Quality of Service audio and video together with packet data and real-time control over a single transmission medium. MOST can use plastic optical fibers (POF), coax based electrical physical layer, and shielded and unshielded twisted pair (STP/UTP) copper wires that meet automotive environmental requirements. Today, MOST is used in over 150 car models as the communication backbone for their information and entertainment equipment.

About MOST Cooperation
The MOST Cooperation (MOSTCO) is the organization through which MOST Technology is standardized and refined so that it continues to stay abreast of the latest industry requirements. Today it consists of 16 international carmakers and more than 60 key component suppliers. They have joined together to work with the MOST Technology and to contribute to its innovation. The MOST Cooperation is prepared to embrace efforts to further develop and standardize the technology for other industries and to establish the corresponding work structures. The MOST Cooperation was founded in 1998 to standardize MOST Technology as a global standard for multimedia networking. Audi, BMW, Daimler, HARMAN and Microchip Technology are its core partners and constitute its Steering Committee. For more information see http://www.mostcooperation.com.

Contact Information

Fast 16-bit 5Msps Dual SAR ADC Offers Flexible Differential Inputs with Wide Common Mode Range

Monday, February 24th, 2014

Linear Technology Corporation introduces the LTC2323-16, a dual 16-bit 5Msps simultaneous sampling, successive approximation register (SAR) ADC with flexible differential inputs. The LTC2323-16 supports a wide input common mode range and simplifies system-level design by relaxing the signal conditioning requirements to drive the ADC with a wide range of analog signals up to Nyquist frequencies.

The LTC2323-16 leads a family of 16-, 14- and 12-bit SAR ADCs, featuring sample rates of 5Msps and 2Msps while achieving 81dB SNR at 16 bits, 80dB SNR at 14 bits and 73dB SNR at 12 bits. The 14- and 12-bit versions feature sign plus magnitude transfer functions, making them ideally suited for control loop applications. The LTC2323 family integrates a precision bandgap reference with low drift and guaranteed 20ppm/°C maximum temperature coefficient into a small 20mm² QFN-28 package. The devices can be powered from a 3.3V or 5V supply and consume just 55mW with a 3.3V supply and 80mW with a 5V supply. The high speed SPI-compatible CMOS or LVDS serial interface is ideal for highly integrated high speed systems.

The LTC2323-16 is available today in commercial, industrial and automotive (-40°C to 125°C) temperature grades. Pricing begins at $13.95 each in 1,000-piece quantities. The DC1996A evaluation board for the LTC2323 SAR ADC family is available at www.linear.com/demo or via a local Linear Technology sales office. For more information, visit www.linear.com/product/LTC2323-16.

Summary of Features: LTC2323-16

  • 5Msps Throughput Rate
  • ±4LSB INL (Typ)
  • Guaranteed 16-Bit, No Missing Codes
  • 8VP-P Flexible Differential Inputs with Wide Input Common Mode Range
  • 81dB SNR (Typ) at fIN = 2.2MHz
  • -85dB THD (Typ) at fIN = 2.2MHz
  • Guaranteed Operation to 125°C
  • Single 3.3V or 5V Supply
  • Low Drift (20ppm/&deC Max) 2.048V or 4.096V Internal Reference
  • 1.8V to 2.5V I/O Voltages
  • CMOS or LVDS SPI-Compatible Serial I/O
  • Power Dissipation 40mW/Ch (Typ)
  • Small 28-Lead (4mm x 5mm) QFN Package
 

Dual, 16-Bit, 5Msps, Simultaneous Sampling, 
Differential Input SAR ADC 

LTC2323-16

Click Photo for High-Res Image

About Linear Technology

Linear Technology Corporation, a member of the S&P 500, has been designing, manufacturing and marketing a broad line of high performance analog integrated circuits for major companies worldwide for over three decades. The Company’s products provide an essential bridge between our analog world and the digital electronics in communications, networking, industrial, automotive, computer, medical, instrumentation, consumer, and military and aerospace systems. Linear Technology produces power management, data conversion, signal conditioning, RF and interface ICs, µModule® subsystems, and wireless sensor network products. For more information, visit www.linear.com.

, T, LTC, LTM, Linear Technology, the Linear logo and µModule are registered trademarks of Linear Technology Corp. All other trademarks are the property of their respective owners.

Contact Information

Linear Technology

1630 McCarthy Blvd.
Milpitas, CA, 95035
USA

tele: 408-432-1900
http://www.linear.com

60V Multiphase Synchronous Boost Controller Delivers High Currents with 97% Efficiency

Wednesday, February 19th, 2014

Linear Technology Corporation announces the LTC3784, a high power two phase single output synchronous step-up DC/DC controller that replaces rectifying boost diodes with high efficiency N-channel MOSFETs. This device can produce a 24V output at 10A from a 12V input at up to 97% efficiency without any heat sink. The LTC3784 operates from an input voltage ranging from 4.5V to 60V during start-up, maintains operation down to 2.3VIN after start-up and can regulate an output voltage as high as 60V.

When configured for Burst Mode® operation, the LTC3784’s 28µA quiescent current makes it ideal for “Always-on” automotive applications to extend battery run-time during standby mode while keeping the output voltage in regulation. The powerful 1.2 Ohm onboard N-channel MOSFET gate drivers are capable of slewing large MOSFETs quickly. The device’s current mode architecture, clock output and phase modulation enable easy paralleling of multiple devices for up to 12-phase operation for very high power applications. The LTC3784 has a phase-lockable switching frequency from 75kHz to 850kHz or a selectable fixed frequency from 50kHz to 900kHz. In addition, this device features adjustable cycle-by-cycle current limit and can use a sense resistor or the voltage drop across the inductor (DCR) for current sensing. In keep alive applications where the input voltage may exceed the regulated output voltage, the LTC3784 allows the synchronous MOSFET to be kept on continuously so that the output voltage follows the input voltage with minimal power loss. Furthermore, the LTC3784 has adjustable soft-start, a power good output and maintains ±1% reference voltage accuracy over an operating junction temperature range of -55°C to 150°C (MP grade).

The LTC3784 is available in SSOP-28 and 4mm x 5mm QFN-28 packages. The LTC3784E and LTC3784I versions operate from a -40°C to 125°C junction temperature. The LTC3784H grade is guaranteed to operate from a -40°C to 150°C operating junction temperature. The LTC3784MP is guaranteed to operate over a -55°C to 150°C operating junction temperature range. The 1,000-piece price starts at $2.47 each. For more information, visit www.linear.com/product/LTC3784.

Summary of Features: LTC3784

  • Wide VIN Range from 4.5V to 60V, Maintains Operation down to 2.3V after Start-Up
  • Up to 60V VOUT Operation
  • Low 28µA Quiescent Current Regulating VOUT at no load
  • Powerful 1.2 Ohm Gate Drivers
  • Up to 97% Efficiency
  • 100% Duty Cycle Capability for Synchronous MOSFET
  • Phase-Lockable Frequency from 75kHz to 850kHz
  • Programmable Fixed Frequency from 50kHz to 900kHz
  • RSENSE or Inductor DCR Current Sensing
  • Current Mode Control
  • ±1% Reference Voltage Accuracy over -55°C to +150°C
  • Programmable Soft-Start
  • Phase Modulation for up to 12 Phases
  • Power Good Output
  • Extended & Industrial Grades: -40°C to 125°C Operating Junction Temp
  • Automotive Temp Grade: -40°C to 150°C Operating Junction Temp
  • Military Temp Grade: -55°C to 150°C Operating Junction Temp
 

60V Multiphase Synchronous
Step-Up DC/DC Controller 

LTC3784

Click Photo for High-Res Image

About Linear Technology

Linear Technology Corporation, a member of the S&P 500, has been designing, manufacturing and marketing a broad line of high performance analog integrated circuits for major companies worldwide for over three decades. The Company’s products provide an essential bridge between our analog world and the digital electronics in communications, networking, industrial, automotive, computer, medical, instrumentation, consumer, and military and aerospace systems. Linear Technology produces power management, data conversion, signal conditioning, RF and interface ICs, µModule® subsystems, and wireless sensor network products. For more information, visit www.linear.com.

, LT, LTC, LTM, Linear Technology, the Linear logo, Burst Mode and µModule are registered trademarks of Linear Technology Corp. All other trademarks are the property of their respective owners.

Contact Information

Linear Technology

1630 McCarthy Blvd.
Milpitas, CA, 95035
USA

tele: 408-432-1900
http://www.linear.com

High Temperature Shielded Power Inductors Offer Current Ratings to 98.8 Amps

Friday, February 14th, 2014

 Coilcraft’s XAL1010 Series of high-temperature, shielded power inductors combines excellent current handling and exceptionally low DC resistance in a rugged, molded package.

XAL1010The XAL1010 is available with thirteen inductance values from 0.22 to 15 µH, current ratings to 98.8 Amps and DCR as low as 0.45 mOhms. The popular, cube-shaped package measures just 10.0 x 11.3 x 10.0mm. For applications with limited height restrictions, Coilcraft also offers the lower-profile XAL1060 Series.

Both versions are AEC-Q200 Grade 1 qualified (-40°C to +125°C), making them suitable for harsh automotive environments. Their soft saturation characteristics also make them ideal for VRM/VRD applications. They feature RoHS compliant tin-silver (96.5/3.5) over copper terminations and offer a maximum reflow temperature of 260°C. COTS Plus tin-silver-copper and tin-lead terminations are also available.

As with all Coilcraft parts, free evaluation samples and complete technical specifications for the XAL1010 are available online at http://www.coilcraft.com/xal1010.cfm.

Parts are available from stock and can be ordered on-line at buy.coilcraft.com or by calling a local Coilcraft sales office.

For more information, contact Len Crane, +1-847-639-6400, lcrane@coilcraft.com

About Coilcraft

Headquartered outside of Chicago in Cary, Illinois, Coilcraft is a leading global supplier of magnetic components including high performance RF chip inductors, power magnetics and filters. In addition to a large selection of standard components, Coilcraft also designs and builds custom magnetics to fit a customer’s exact electrical requirements.

Engineers and buyers consider Coilcraft a preferred supplier because of its reputation for quality, reliable delivery, engineering support and the superior performance of our products. In independent surveys, engineers consistently rank Coilcraft the number one magnetics company they would recommend to a friend.

Contact Information

Coilcraft CPS

Daimler Introduces MOST150 in the New Mercedes-Benz S-Class

Thursday, February 13th, 2014

MOST150 Implementation

The MOST® Cooperation – standardization organization for the leading automotive multimedia network technology Media Oriented Systems Transport (MOST) – is delighted to announce that Daimler implemented MOST150 in its new Mercedes-Benz S-Class vehicles. "MOST150 has successfully accomplished series development for the next Mercedes-Benz infotainment generation, with fully-qualified series production parts available for all key components," stated Peter Haeussermann, Head of Telematics Electrics/Electronics at Daimler AG. "MOST150 has recently been first implemented in the brand-new generation of the S-Class. After that, the technology will be rolled out onto all other Mercedes-Benz car lines, step by step."

Smooth Migration to New Functions
The development of this newest MOST generation has been accompanied by a cost/benefit analysis that led to several innovations on one hand and to a high level of backward compatibility on the other. Existing applications can easily be reused in the new network by simply modifying their network interfaces. Therefore, it offers a smooth adaption with the majority of features being continued. Daimler will reuse and adopt many components out of their proven system architectures, as for example, main parts of topologies, network management and application structures. As a result, the focus will be on the development of new functions.

Automotive IP Network and Internet Application
Peter Haeussermann added, "At Daimler, we expect that the prevalence of internet applications in the automotive environment will grow significantly. Consequently, future infotainment platforms have to meet these new requirements." MOST150 makes a crucial contribution to this by providing the MOST Ethernet protocol. With this new communication channel, both high-performance IP networks and internet applications can easily be implemented. The Ethernet channel can transmit unmodified Ethernet frames (according to IEEE 802.3) with more than 100 Mbit/s depending on the network configuration. This permits software stacks and applications from the consumer and IT domain to be seamlessly migrated into the car. TCP/IP stacks or protocol entities utilizing TCP/IP can communicate via MOST without any modification. Thus, the new generation of MOST provides the automotive-ready physical layer for Ethernet in the car.

Images

Archivnummer: 13C698_012

Daimler implemented MOST150 in the new Mercedes-Benz S-Class

Copyright: Daimler AG

Download: http://www.alvacon.com/media/images/MOST150-Daimler-S-Class-front-.jpg

 

 

MOST150-Daimler-S-Class-rear-seat-infotainment-

MOST150 has successfully accomplished series development for the next Mercedes-Benz infotainment generation

Copyright: Daimler AG

Download: http://www.alvacon.com/media/images/MOST150-Daimler-S-Class-rear-seat-infotainment-.jpg

 

About MOST Technology
MOST (Media Oriented Systems Transport) is a multimedia networking technology optimized for use in cars and other applications. It enables the transport of high Quality of Service audio and video together with packet data and real-time control over a single transmission medium. MOST can use plastic optical fibers (POF), coax based electrical physical layer, and shielded and unshielded twisted pair (STP/UTP) copper wires that meet automotive environmental requirements. Today, MOST is used in over 150 car models as the communication backbone for their information and entertainment equipment.

About MOST Cooperation
The MOST Cooperation (MOSTCO) is the organization through which MOST Technology is standardized and refined so that it continues to stay abreast of the latest industry requirements. Today it consists of 16 international carmakers and more than 60 key component suppliers. They have joined together to work with the MOST Technology and to contribute to its innovation. The MOST Cooperation is prepared to embrace efforts to further develop and standardize the technology for other industries and to establish the corresponding work structures. The MOST Cooperation was founded in 1998 to standardize MOST Technology as a global standard for multimedia networking. Audi, BMW, Daimler, HARMAN and Microchip Technology are its core partners and constitute its Steering Committee. For more information see http://www.mostcooperation.com.

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Laird’s New Tlam OptoTEC Series Moves Heat in a Different Direction

Tuesday, February 11th, 2014

New thermoelectric series to Launch at Photonics West 2014, booth #5435 on
February 4-6 at the Moscone Center in San Francisco

Laird, a global technology company, has announced a new series of miniature thermoelectric modules (TEMs) built using Laird Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards. The Tlam OptoTEC® series is designed for applications where temperature stabilization of sensitive optical components in photonics, telecom, medical and consumer markets is critical. The use of the circuit board improves the heat pumping capabilities of the device while providing excellent heat spreading, improved reliability and lower cost in high volume when compared to traditional heat removal systems.

Tlam is used in applications where the components in the circuit produce a lot of heat, such as high powered LEDs, power supplies or motor drives. Tlam circuit boards feature a thin layer of thermally conductive dielectric material sandwiched between a top layer of standard copper foil and a thick metal backing plate for structural strength and improved heat spreading. Traditional ceramic-based circuit boards have very poor thermal conductivity, so any heat produced by the circuit must radiate from the top of the circuit board. With Tlam, the heat is transported off the bottom of the circuit board where the metal backing plate quickly carries heat laterally away from hot components, reducing their temperature and extending their lifetime. The combination of the Tlam circuit board with the thermoelectric offers a completely new way to design thermal rejection systems and can reduce the complexity of moving heat away from sensitive devices.

The Tlam OptoTEC series includes seven new modules that can create a temperature differential (ΔT) of up to 67°C and pump from 1.5 to 9.0 watts of heat at an ambient temperature of 25°C. At 85°C, the series can create a ΔT of 77°C and pump 1.6 to 9.9 watts of heat. The modules have passed Telcordia GR-468-CORE Issue 2 reliability qualification testing and are easily customizable to accommodate alternate sizes, heat pumping capacities, unique circuit patterns and pre-tinning requirements. A white paper, application note and datasheets for the Tlam OptoTEC series are available for downloading at here.

“Laird is the only company in the world that makes both TEMs and thermally conductive circuit boards,” says Andrew Dereka, product manager at Laird. “We are uniquely positioned to offer innovations based on this combination of thermal management technologies to our customers.”

The Tlam OptoTEC series modules are available with an 8 to 10 week delivery lead time. Pricing is available upon request.

In addition to the Tlam OptoTEC series, Laird will display a wide range of thermoelectric modules and thermoelectric assemblies for thermal management of photonics and optoelectronics at Photonics West, which takes place on February 4-6 at the Moscone Center in San Francisco, California. Laird will exhibit at booth #5435.

Laird provides the knowledge, innovation and resources to ensure exceptional thermal performance and customer satisfaction for thermoelectrics and liquid cooling solutions for laser systems.

About Laird
Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics.  Laird operates through two divisions, Wireless Systems and Performance Materials.  Wireless Systems solutions include antenna systems, embedded wireless modules, telematics products and wireless automation and control solutions.  Performance Materials solutions include electromagnetic interference shielding, thermal management and signal integrity products.  As a leader in the design, supply and support of innovative technology, our products allow people, organisations, machines and applications to connect effectively, helping to build a world where smart technology transforms the way of life. Custom products are supplied to major sectors of the electronics industry including the handset, telecommunications, IT, automotive, public safety, consumer, medical, rail, mining and industrial markets.  Providing value and differentiation to our customers through innovation, reliable fulfilment and speed, Laird PLC is listed and headquartered in London, and employs over 9,000 people in more than 58 facilities located in 18 countries.

Trademarks
© 2014 All rights reserved. Laird, Laird Technologies and the respective logos are trademarks owned by Laird Technologies, Inc. and/or Laird PLC, either directly or indirectly through one or more subsidiaries. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.

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Laird Technologies


http://www.lairdtech.com/

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