Archive for May, 2014

Neusoft Collaborates with Freescale and Green Hills Software to Deliver Development Ecosystem for ADAS Vision Applications

Thursday, May 29th, 2014

Neusoft Corporation® develops a comprehensive Advanced Driver Assistance Systems (ADAS) ecosystem together with Freescale® Semiconductor and Green Hills Software®. The aim is to significantly accelerate and simplify the creation of next-generation automotive vision applications.

ADAS vision applications are increasingly linked with vehicle braking and steering systems. Therefore, developers and system designers require turnkey solutions that address stringent protocols for automotive safety, and are compliant with the ISO26262 functional safety standard. The purpose-built new ecosystem meets these challenges by streamlining the time-consuming process of developing and porting complex algorithms as well as certification. Further benefits are an accelerated time to market as significant cost reduction.

The solution combines the professional expertise of three specialists: Neusoft provides the sophisticated silicon-aware software for its ADAS vision applications. The image recognition processors work with the APEX – IP technology Image Cognition Processing (ICP) from Freescale and the necessary development libraries and toolkits of CogniVue®. Green Hills Software provides the development and runtime environment with the safety certified INTEGRITY® operating system and MULTI®tool chain.The result is an off-the-shelf ADAS vision solution built on an ISO 26262 ASIL assessed software foundation. Specific applications include e.g. pedestrian detection, traffic sign recognition and collision avoidance.

“We are proud to be part of this promising ecosystem and to contribute with our real-time object recognition technology that is the result of more than ten years of research and development,” said Guodong Jian, Vice President of Neusoft and Co-President of Neusoft Automotives. “OEMs have long been waiting for more flexibility and improved time-to-market, which will be the foundation for wider adoption of ADAS technology.”

“Pairing sophisticated object recognition and identification technologies is a key step to bridging first-generation ADAS products toward the autonomous vehicles of tomorrow,” said Ray Cornyn, Vice President of Product Management and Global Marketing for Freescale’s Automotive MCU business. “The expanding role that vision ADAS technology plays in decision making and real-time object identification tasks positions companies focused on safety-oriented vision systems – such as Freescale – for future success.”

“Green Hills applauds Freescale’s foresight in bringing this partnership together to develop a comprehensive, well constructedADAS vision application platform designed to address performance, functional safety concerns and core algorithm availability essential for any next generation ADAS system,” said Dan Mender, Vice President of Business Development for Green Hills Software. “By working with Green Hills, Freescaleand Neusofthelp its customers achieve significant reductions in time-to-market and development costs by utilizing proven, mature ISO 26262 functional safety assessed products, in addition to its comprehensive safety design and certification services.”


About Neusoft Automotives
Neusoft Automotives is a merger of all Neusoft Corporation automotive activities with the largest software company in China. Thedivisiondevelopsautomotive software as well as digital map databases.At its locations in China, Germany, the USA, Japan and Romania, Neusoft Automotives combines about 2,000 employees with more than 20 years of automotive experience. In Hamburg, Germany, Neusoft Automotives is representedby Neusoft Technology Solutions GmbH, a leading development centerof embedded software, software design and software architecture for automotive infotainment systems focusing on navigation.

Contact Information

Neusoft Automotives


http://www.neusoft.com/

MEMS & Sensors for Mobile Phones & Tablets from Yole Développement

Wednesday, May 28th, 2014

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“The MEMS & sensors market for mobile phones and tablets application is growing fast”, announces Yole Développement. The company releases today its technology and market analysis, MEMS & Sensors for Mobile Phones & Tablets.

Under this report, Dr Eric Mounier, Senior Technology & Market Analyst, and Frédéric Breussin, Business Unit, MEMS & Sensors, present a global overview this market, including key market data and dynamics. They analyze the major technology trends for each device and detail the business opportunities.

“The MEMS & Sensors market for mobiles phones & tablets will expand from $ 2.85B in 2013 to more than $ 6B in 2019; shipments will increase from 5.8 B units to more than 17.5B units during the same period”, details Dr Eric Mounier. This market is clearly growing, and price is decreasing. What’s the best plan for entering this market and building success? Yole Développement gives its vision of the industry with its new analysis.

-> To read the complete story, please click: Mobile phones & Tablets

Contact Information

Yole Développement


http://www.yole.fr/

Spansion Launches New Family of Automotive Microcontrollers

Thursday, May 22nd, 2014

Traveo™ family of MCUs is based on ARM® Cortex®-R5 core and delivers advanced HMI, security and networking for automotive applications

Spansion Inc. (NYSE: CODE), a global leader in embedded systems, today announced a new family of microcontrollers targeted at automotive applications. The Spansion® Traveo™ microcontrollers are based on the ARM® Cortex®-R5 core and will deliver high performance, enhanced human-machine interfaces, high-security and advanced networking protocols tailored for a broad range of automotive applications such as electrification, body electronics, battery management, automotive cluster displays, HVAC and ADAS.

Combined with Spansion’s deep expertise in building automotive systems, this new family will enable scalable and efficient designs of high performing and secure automotive applications that will improve drivers’ safety and user experience with the latest technology advancements in cars.

“The Spansion Traveo family strengthens our position as a leading provider of MCU products for automotive and industrial applications,” said Takeshi Fuse, senior vice president and general manager of Spansion’s Automotive MCU Business Unit. “The family of MCUs will offer application-tailored system solutions to ease both hardware and software design and integration, delivering advanced security and performance.”

The first product of the Spansion Traveo family, the MB9D560 series, features dual ARM Cortex-R5 cores with 2MB of embedded flash and operates at 200 MHz. The Spansion Traveo microcontrollers expand Spansion’s portfolio for vehicle electrification utilized in hybrid vehicles (HEV) and electrical vehicles (EV). The dual-core structure on a single chip has two interface circuits for resolver sensors for motor control, and two unique hardware IP for motor control operations. Each core has a built-in floating point unit (FPU) and operates at 1.66DMIPS/MHz, with each motor running independently but monitoring the operation of each other. The system’s reliability is achieved with a memory protection unit, error correction code (ECC), parity error detection and correction functions.

Industry Support

“The ARM architecture addresses the automotive market’s specific low power and performance needs,” said Richard York, vice president of product marketing, CPU group, ARM. “Spansion’s new portfolio of Traveo microcontrollers is a great example of fast, real-time and deterministic microcontrollers that will broaden the adoption of our architecture into new applications inside the vehicle, and transform the motoring experience.”

“At a time when system designers are demanding ever higher levels of MCU performance and power efficiency, this new MCU family based on ARM Cortex-R5 based is an important addition to Spansion’s automotive capabilities while also delivering a cost benefit through the integration of multiple functions onto a single chip,” said Chris Webber, vice president for the Global Automotive Practice, Strategy Analytics.

Spansion Resources:


About Spansion

Spansion (NYSE: CODE) is a global leader in Flash memory-based embedded systems solutions. Spansion’s Flash memory, microcontrollers, analog and mixed-signal products drive the development of faster, intelligent, secure and energy efficient electronics. Spansion is at the heart of electronics systems, connecting, controlling, storing and powering everything from automotive electronics and industrial systems to the highly interactive and immersive consumer devices that are enriching people’s daily lives. For more information, visit http://www.spansion.com

Spansion®, the Spansion logo, MirrorBit®, Traveo(tm) and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. ARM and Cortex are registered trademarks of ARM Limited. Other names used are for informational purposes only and may be trademarks of their respective owners.

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Motor Driver from Microchip is Automotive AEC-Q100 Qualified, Highly Integrated and Compact; Provides High Performance and High Current

Wednesday, May 14th, 2014


Cost-Effective MCP8063 is World’s First 1.5 Ampere, Three-Phase Brushless DC, Sinusoidal Motor Driver in a 4×4 mm Package With the AEC-Q100 Quality Certification

MCP8063_1CHANDLER, Ariz., April 8, 2014 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the MCP8063—a highly integrated, cost-effective, automotive AEC-Q100-qualified motor driver that delivers superior performance in a small, 8-pin, 4×4 mm DFN package. It is also the world’s first to combine all of those features with 1.5A peak phase current for the 180-degree sinusoidal drive of a variety of three-phase brushless DC motor and fan applications. This integration reduces cost and PCB area, and the high sinusoidal-drive performance provides high efficiency, low acoustic noise and low mechanical vibration for energy savings and quiet operation. Additionally, the MCP8063 includes safety features such as thermal shutdown, over-current limiting and lock-up protection.

The designers of a broad range of motor applications in markets such as the automotive, IT, industrial and home-appliance sectors are faced with increasing regulatory and consumer demands for continued reductions in cost, space, noise and power consumption; with better performance and safety. The integrated features of the MCP8063 motor driver solve these problems cost effectively, while providing a wide operating temperature range of -40 to +125 degrees Celsius. Additionally, it supports the sensorless driving of BLDC motors, which eliminates the cost and space of a Hall sensor.

MCP8063_2“Customers requested a compact, high-performance motor driver with high current and a wide temperature range, while adhering to the AEC-Q100 quality standard,” said Bryan J. Liddiard, marketing vice president of Microchip’s Analog and Interface Products Division. “Our new MCP8063 delivers on that request, providing a complete single-chip solution for a wide variety of three-phase, brushless DC applications at attractive price points.”

The MCP8063 motor driver works stand-alone or in conjunction with Microchip’s large portfolio of PIC® microcontrollers and dsPIC® digital signal controllers. This offers a high degree of flexibility for everything from simple voltage control to closed-loop motor speed control using high-performance algorithms, such as sinusoidal sensorless drive.

Development Support
MCP8063_3To enable development with the new MCP8063 motor driver, Microchip also announced the MCP8063 12V 3-Phase BLDC Sensorless Fan Controller Demo Kit (part # ADM00575), which is available today for $49.99 each. Additionally, this tool comes with a user-friendly configuration GUI. Microchip also supports its motor control and driver portfolios with a full range of development solutions, including firmware, algorithms, application notes, development tools, evaluation boards and reference designs. Visit Microchip’s Motor Control and Drive Design Center at http://www.microchip.com/get/BTNR to access the complete repository.

Pricing and Availability
The MCP8063 motor driver is available today for samples and volume production, at the attractive price point of $1.12 each in 5,000-unit quantities. For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s Web site at http://www.microchip.com/get/JMXV. To purchase products mentioned in this press release, go to microchipDIRECT (http://www.microchip.com/get/99RH) or contact one of Microchip’s authorized distribution partners.

Follow Microchip

About Microchip Technology
Microchip Technology Inc. (NASDAQ: MCHP) is a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at http://www.microchip.com/get/X652.

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Note: The Microchip name and logo, PIC, and dsPIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.

Editorial Contact:
Eric Lawson
480-792-7182

Reader Inquiries:
1-888-624-7435
http://www.microchip.com/get/JMXV

Contact Information

Microchip Technology Inc.

2355 W. Chandler Blvd.
Chandler, AZ, 85224
USA

tele: 480.792.7200
toll-free: 888.MCU.MCHP
fax: 480.792.7277
here2help@microchip.com
www.microchip.com

Mentor Graphics Launches MicReD Industrial Power Tester 1500A for Power Cycle Testing of Electronic Components

Tuesday, May 13th, 2014

Mentor Graphics Corporation (NASDAQ: MENT) today announced the new MicReD® Industrial Power Tester 1500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance. The MicReD Industrial Power Tester 1500A tests the reliability of power electronic components that are increasingly used in industries such as automotive and transportation including hybrid and electrical vehicles and trains, power generation and converters, and renewable energy applications such as wind turbines. It is the only commercially available thermal testing product that combines both power cycling and thermal transient measurements with structure function analysis while providing data for real-time failure-cause diagnostics.

Power components are used for applications in which electrical energy is generated, converted, or controlled and where very high reliability is required during many years of constant operation. This new product is built for industrial electronic manufacturers to test reliability by examining the thermally induced degradations within the module stack-up. Both power cycling and thermal transient measurements are conducted on the MicReD Power Tester 1500A, without needing to remove the components from the test environment. A technician or engineer is able to see the failure as it progresses and determine the exact time/cycle and cause.

Reliability is a prime concern in many industries that use high-power electronics, so accelerated testing of these modules through a lifetime of cycles is a must for the component supplier, the system supplier, and the OEM. The MicReD Power Tester 1500A can power modules through tens of thousands—potentially millions—of cycles while providing “real-time” failure-in-progress data for diagnostics. This significantly reduces test and lab diagnosis time and eliminates the need for post-mortem or destructive failure analysis. Common thermally-induced mechanical failures that the Power Tester 1500A analyzes in “real time” include die-attach wire bond separations, die and package stack-up delamination and cracks, and solder fatigue.

“The ability to pinpoint and quantify degradation in the thermal stack for all semiconductor devices during development will greatly assist in the development of cost-optimized packaging solutions currently hampered by package-reliability concerns,” said Mark Johnson, professor of advanced power conversion, faculty of engineering, University of Nottingham. “Mentor’s Power Tester 1500A should be an invaluable tool for investigating thermal path degradation in all types of power modules.”

The MicReD Power Tester 1500Ais based on the Mentor Graphics® T3Ster® advanced thermal tester used in industries worldwide for accurate thermal characterization of semiconductor device packages and LEDs. The Power Tester 1500A is the first product in the MicReD Industrial line and it provides fully automated power cycling and testing (both thermal and electrical measurement) of power modules to provide comprehensive data for failure cause assessment. This enables organizations to make product improvements for reliability and extended performance. The MicReD industrial products incorporate the laboratory-level accuracy of the T3Ster product in robust machines for operators to use inside manufacturing facilities.

“Our MicReD Power Tester 1500A serves the growing demand for power electronics components that need to perform under extreme conditions with high reliability,” stated Roland Feldhinkel, general manager of Mentor Graphics Mechanical Analysis Division. “We’re leveraging our expertise in thermal characterization and testing to deliver a product for industrial applications, where we see great potential – from electric vehicles and railway systems to renewable energy products.”

The MicReD Industrial Power Tester 1500A can perform power cycling tests of metal-oxide semiconductor field-effect transistors (MOSFETs), insulated-gate bipolar transistors (IGBTs) and power diodes. The MicReD Power Tester 1500A provides a user-friendly touch-screen interface and can record a broad range of information during test, such as current, voltage and die temperature sensing; and detailed structure function analysis to record changes in the package’s thermal structure. This makes it an ideal platform for package development and quality checking of incoming parts before production.

Key Advantages of the MicReD Industrial Power Tester 1500A This new power tester provides several key benefits:

  • Continuous power cycling until failure which saves time because the component doesn’t need to be removed, taken for lab testing then back to tester for more cycles.
  • Enables multiple samples to be tested concurrently.
  • Different powering strategies (constant power on/off time, constant case temperature swing, and constant junction temperature rise) can be applied during operation.
  • Provides “real-time” structure function diagnostics to show failure in progress, number of cycles, and failure cause.
  • Eliminates the need for lab post-mortem (x-ray, ultrasonic, visual) or destructive failure analysis.
  • Features touch-screen setup and controls enabling use by both specialists and production personnel.

Product Availability

The MicReD Industrial Power Tester 1500A is available immediately. Please contact a Mentor Graphics sales representative or visit the company website for more information:
http://www.mentor.com/powertester-1500a


About Mentor Graphics

Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months in excess of $1.15 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com/.

Contact Information

Mentor Graphics – Veloce Emulation Platform

8005 SW Boeckman Rd.
Wilsonville, OR, 97070
USA

tele: 1-503-685-8000
toll-free: 1-800-547-3000
sales_info@mentor.com
mentor.com

Global Apps Integration Software Units to Reach 370 Million Units by 2020; Google Projected Mode to Lead, According to IHS Automotive

Friday, May 9th, 2014

General Motors Expected to Lead all Other OEMs in Apps Integration

The global auto industry will see more than 370 million Smartphone apps integration software units in-use by 2020, according to a recent report and forecast from IHS Automotive, part of IHS Inc. (NYSE: IHS), the leading global source of critical information and insight.

Original equipment manufacturers (OEMs) are expected to continue today’s trend of integrating smartphone apps that are controlled via a vehicle’s HMI or as part of an infotainment system controlled by the vehicle’s HMI through the remainder of the decade. The recent introductions of Google Projected Mode and Apple CarPlay have changed the industry landscape dramatically and both companies are expected to become clear leaders in Smartphone apps integration.

Cars with Google Projected Mode software are expected to top 100 million units by 2020, up from just 86,000 units in 2014. Cars with Apple CarPlay, with 105,000 units in 2014, will exceed 94 million units in 2020, a compound annual growth rate of 210 percent. These volumes will contribute significantly to the nearly 370 million Smartphone apps integration units expected in the automotive industry by 2020, from just 6.9 million units in 2014. MirrorLink, Aha by Harman, Ford SYNC AppLink and others are also included in these numbers.

“Apps for autos are growing rapidly and will have a profound impact on auto infotainment and connectivity in the next decade,” said Egil Juliussen, the report’s co-author and research director at IHS Automotive. “Auto apps will influence the competitive landscape among auto manufacturers and will even change the brand market share between them. OEMs will have to keep up to remain competitive.”

North America expected to lead apps integration

At a regional level, North America is expected to continue to lead the industry in automotive apps integration, with more than 115 million expected by 2020. This is due to the U.S. being the pioneer in deploying such systems and high Smartphone penetration and with extensive Smartphone apps usage. Western Europe will remain in second place through 2019 and will have over 65 million apps integration enabled cars in use by 2020. China will grow rapidly and will surpass Western Europe in 2020, with over 71 million apps integration enabled cars. As the apps integration technology and market matures, the growth will be driven by car sales, Smartphone penetration and apps availability.

OEM adoption and integration of apps in vehicles is expected to be led by General Motors, for whom embedded apps development for infotainment systems will continue to increase. GM also is using HTML5 as its apps platform, which is well-known by developers and predicted to continue as the standard for web apps and web content. This platform also creates a larger knowledge and competency base that the auto industry can leverage for growing a large auto apps portfolio.

Apps developed for an OEM’s Software Development Kit (SDK) are just beginning to gain interest in the automotive market and will grow in importance in the next decade, the IHS report says. “We anticipate the most innovative apps will come from apps developers using OEM SDK’s,” said Juliussen. GM is currently the leader in the embedded apps category.

Embedded infotainment apps currently have two approaches: current SDKs are either OEM-specific or multi-OEM specific. Growth in these sectors also is expected, though will not be as aggressive as some of the other options.

More than 36 million apps-enabled vehicles will be in use with Apple CarPlay in 2020, up from just over 0.1 million in 2014, according to the IHS Automotive forecast. Google Projected mode apps are expected to be included in more than 40 million vehicles in 2020, from less than 0.1 million in 2014.

“The in-car app market is a new frontier for Apple and Google’s mobile competition,” said Jack Kent, mobile analyst at IHS Technology. “Each is aiming to use their established expertise in delivering mobile apps and content into the new realm of automotive entertainment and services.”

Global app spending to hit $40 billion by 2020

World consumer spend on mobile apps is set to grow from $24 billion in 2014 to more than $40 billion by 2020. “While games will dominate, other services such as music, location and navigation will contribute to revenue growth,” Kent said.

IHS research shows that apps are the fastest growing digital content category. The rise of devices that connect to smartphones and tablets including cars and also wearable and other smart devices will further increase mobile app downloads and revenues.

App stores will be the key distribution channel for auto apps. “App stores have revolutionized how consumers access digital content and services, providing a global distribution, discovery and billing platform that will reach well beyond smartphones and tablets,” Kent said.


About IHS (www.ihs.com)
IHS (NYSE: IHS) is the leading source of information, insight and analytics in critical areas that shape today’s business landscape. Businesses and governments in more than 165 countries around the globe rely on the comprehensive content, expert independent analysis and flexible delivery methods of IHS to make high-impact decisions and develop strategies with speed and confidence. IHS has been in business since 1959 and became a publicly traded company on the New York Stock Exchange in 2005. Headquartered in Englewood, Colorado, USA, IHS is committed to sustainable, profitable growth and employs more than 8,000 people in 31 countries around the world.

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Microchip Expands Portfolio of Digitally Enhanced Power Analog Controllers With Integrated MCU

Thursday, May 1st, 2014

MCP19114/5 Family Provides Flexible, Analog-based Solutions for DC/DC Power-Conversion Applications

Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced an expansion of its 8-bit PIC16F178X enhanced Mid-Range core microcontroller (MCU) family with increased Flash memory densities, intelligent analog and digital peripherals, such as on-chip 12-bit Analog-to-Digital Converters (ADCs), 16-bit PWMs, 8-bit and 5-bit Digital-to-Analog Converters (DACs), operational amplifiers, and high-speed comparators with 50 ns response time, along with EUSART (including LIN), I2C™ and SPI interface peripherals. The PIC16F178X are the first PIC® MCUs to implement the new Programmable Switch Mode Controller (PSMC), which is an advanced 16-bit Pulse-Width Modulator (PWM) with 64 MHz operation and high-performance capabilities.

This combination of features enables higher efficiency and performance, along with cost and space reductions. The new MCUs also feature eXtreme Low Power (XLP) Technology for active and sleep currents of just 32 µA/MHz and 50 nA, respectively, helping to extend battery life and reduce standby current consumption. Low power consumption in combination with advanced analog and digital integration make the PIC16F178X MCUs ideal for LED and other lighting applications, battery management, digital power supplies, motor control and general-purpose applications.

Available in 28- and 40-pin packages, the MCUs’ intelligent analog integration paired with Core Independent Peripherals, inclusive of the PSMC, DACs, Op Amps, high-speed comparators and 12-bit ADC, enable self-sustaining smart control loops with minimal CPU intervention. This allows for optimal application control while freeing the CPU to provide incremental application value, such as system health monitoring, communications, or human- interface control. Additionally, the MCUs feature a 32 MHz internal oscillator, 2 – 16K Words (3.5 – 28K Bytes) of Flash, 256 – 2K Bytes of RAM and 256 Bytes of data EEPROM.

“The PIC16F178X integrates intelligent analog and advanced Core Independent Peripherals, enabling high-performance capabilities within a low cost and versatile 8-bit PIC MCU, lending itself to numerous applications including power supplies, power management, motor control and lighting applications,” said Steve Drehobl, vice president of Microchip’s MCU8 Division. “This level of integration and capability really emphasizes that it is not necessarily all about the core CPU, but rather the capabilities that can be cost effectively enabled.”

Development Support

Initial evaluation and development of the PIC16F178X family can quickly begin with the F1 PSMC 28-pin Evaluation Board Platform (part # 164130-10, $19.99). Additionally, the PIC16F178X family is supported by Microchip’s standard suite of world-class development tools, including the PICkit™ 3 (part # PG164130, $44.95), MPLAB® REAL ICE™ (part # DV244005), $499.98), MPLAB ICD 3 (part # DV164035, $189.99) debuggers/programmers, and MPLAB XC8 Compiler.

Pricing & Availability

The PIC16(L)F1782/3/4/6/7/8/9 MCUs are available now for sampling and volume production in 28-pin SOIC, SPDIP, 6 x 6 mm QFN, and 4 x 4 mm UQFN; as well as 40-pin PDIP, TQFP, 8 x 8 mm QFN, and 5 x 5 mm UQFN packages. Pricing starts at $1.18 each, in 10,000-unit quantities.

For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s Web site at http://www.microchip.com/get/T2VS. To purchase products mentioned in this press release, go to microchipDIRECT or contact one of Microchip’s authorized distribution partners.


About Microchip Technology

Microchip Technology Inc. (NASDAQ: MCHP) is a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at http://www.microchip.com/get/2VRF.

Contact Information

Microchip Technology Inc.

2355 W. Chandler Blvd.
Chandler, AZ, 85224
USA

tele: 480.792.7200
toll-free: 888.MCU.MCHP
fax: 480.792.7277
here2help@microchip.com
www.microchip.com

Connected cars, already a reality

Thursday, May 1st, 2014

On the market side, in 2018, 420 million automobiles will be connected; representing a 57% CAGR on the 45 million connected vehicles in 2013.

In its latest report, IDATE analyses the connected car strategies of manufacturers, mobile carriers and application providers. The study provides the main drivers and barriers for connected car market take-off. It describes the connected car ecosystem, in terms of applications, implementation techniques and also related business models.

A ‘connected car’ is one equipped with access to the Internet (the network of networks) whereby it can communicate with the outside world. This allows the car to share Internet access to other devices both inside and outside around the vehicle.

“The strategy of most manufacturers is to make their cars connected.” Says Samuel Ropert, Project Leader of this report. “The main driver here is based on the regulation related to safety issues in Europe and the underlying revenue opportunity for them. In the USA, the recent GM announcement to embed 4G modules in all new cars is seen as a key trigger for market take-off.”

Three main technical solutions exist. The embedded module system (in the car itself) is the most technically advantageous system as it has a dedicated system for connected services. The next option consists of the use of the smartphone for connectivity tethering, with the technical limitation (use of the miniature antenna). The last model is a combination of the first two other models (use of embedded system for telematics and smartphone tethering for entertainment (mobile Internet-like services). Ultimately, it is an opportunity for a fundamental shift from a largely capex model to a more opex-oriented one, even potentially shifting the focus of manufacturers’ core businesses to embrace a new focus on car-based products and services.

For telcos, the revenue opportunity could be interesting as the connected car will generate traffic that telco will charge indirectly (through the automobile manufacturer). All main M2M mobile carriers are involved in the connected car space, as the connected car represents one of the major markets in volume. In a context where their traditional mobile revenues are flat and even declining in some regions, providing mobile connectivity in cars is a key business opportunity for telcos. Beyond car-related applications in driver assistance, from the perspective of a telco, the car can be seen as an additional cellular device, with a potential high-consumption service profile with such usage as the mobile Internet, entertainment on demand and mobile hotspot features.

The prime business model remains the traditional wholesale relationship (B2B2C), even though AT&T unveiled a retail data plan for Audi A3 in early March and AT&T is expected to announce a new version of its share plan by the summer 2014 which includes the connected car.

For Internet players, the strategy here is clear: the automobile is an additional connected device just as smartphones, tablets and laptops and needs to be addressed. However, Apple and Google do not have really the same approach. Indeed, whereas Apple aims to introduce its technology to interface with its products, Google is promoting the embedment of its technology into the car as a regular device. Google also wants to collect data to provide the most accurate advertising as possible, such as a related point-of-interest, based mainly on location.

On the market side, according to IDATE, in 2018, 420 million automobiles will be connected; representing a 57% CAGR on the 45 million connected vehicles in 2013. Nevertheless, this growth is not homogeneous for each category of connected cars. The embedded systems will lead the market with 222 million units by 2018.

In 2018, the connectivity revenue for connected cars will exceed 8 billion EUR. This encompasses direct connectivity through embedded systems but also the indirect revenue related to smartphone usage. The major issues to be raised here are on the real willingness of the user to pay for such services. To encourage users to subscribe, telcos and manufacturers are already contemplating different revenue models including share plans. All the same, adoption is likely to remain limited over the next five years.


IDATE and the DigiWorld Institute
Since 1977, IDATE has been recognized, based on the capabilities of its specialized investigation teams, as a reliable resource for tracking telecom, Internet and media markets. With strong support from its members, represented by more than 40 major players in the digital economy, the Institute, under the name of DigiWorld, has started a new phase in its development based on three lines of business:

  • IDATE Research, an independent observer whose vocation is to provide active surveillance of the digital economy, to collect pertinent data and offer reference analysis on the markets and innovations in the telecommunications, Internet and media markets, through a complete catalogue of reports and monitoring services.
  • IDATE Consulting, analysis and consulting capabilities. Our team of economists and engineers has established their credibility and their independence by completing hundreds of research assignments requested each year by the major industry players and public authorities.
  • DigiWorld Institute, a European forum open to the world. The DigiWorld Institute showcases all of IDATE’s initiatives such as the DigiWorld Summit, the DigiWorld Yearbook and the monthly Clubs established in London, Paris and Brussels. It offers its members the opportunity to participate in collaborative research programmes on the industry’s major future problems by mobilising external expert resources and its own teams.

Contact Information

Digiworld Institude


http://www.idate.org/en/Home/

MOST Efficient Connection: MOSTCO Presents UPnP and Video Coding Use Cases at the MOST Forum 2014

Thursday, May 1st, 2014

At the upcoming MOST Forum on May 13, 2014 in Stuttgart/Esslingen (Germany), the MOST® Cooperation – standardization organization for the leading automotive multimedia network technology Media Oriented Systems Transport (MOST) – will show the latest application highlights for the MOST150 network technology. “These will demonstrate that MOST Technology is the most efficient connection between various domains in the vehicle, such as infotainment, driver assist, navigation and communications inside and outside the vehicle,” stated Henry Muyshondt, Executive Director of the MOST Cooperation. “MOST meets the challenge of keeping the network at top efficiency by providing optimal performance at low cost.”

One use case demonstration will be the coding and decoding of video data transmitted from a TV tuner over the MOST network. Another highlight will be the demonstration of the Universal Plug and Play (UPnP) standard with MOST Technology. The interaction of UPnP within the MOST network will provide the close integration of consumer devices in MOST based vehicles. This makes the vehicle user interface more personalized. In addition, it allows carmakers to keep up with the short lifecycles of consumer electronics.


About MOST Technology
MOST (Media Oriented Systems Transport) is a multimedia networking technology optimized for use in cars and other applications. It enables the transport of high Quality of Service audio and video together with packet data and real-time control over a single transmission medium. MOST can use plastic optical fibers (POF), coax based electrical physical layer, and shielded and unshielded twisted pair (STP/UTP) copper wires that meet automotive environmental requirements. Today, MOST is used in over 150 car models as the communication backbone for their information and entertainment equipment.About MOST Cooperation

The MOST Cooperation (MOSTCO) is the organization through which MOST Technology is standardized and refined so that it continues to stay abreast of the latest industry requirements. Today it consists of 16 international carmakers and more than 60 key component suppliers. They have joined together to work with the MOST Technology and to contribute to its innovation. The MOST Cooperation is prepared to embrace efforts to further develop and standardize the technology for other industries and to establish the corresponding work structures. The MOST Cooperation was founded in 1998 to standardize MOST Technology as a global standard for multimedia networking. Audi, BMW, Daimler, HARMAN and Microchip Technology are its core partners and constitute its Steering Committee. For more information see http://www.mostcooperation.com.

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Car Radio Processor from STMicroelectronics Makes Visteon’s New Connected Audio Products Sing

Thursday, May 1st, 2014

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced its automotive microprocessor for car radio and display audio has been selected by Visteon Corporation’s Chinese joint venture, Yanfeng Visteon Electronics (YFVE). YFVE is using ST’s car radio processor in its new Connected Audio Products, which are in production with a major global OEM on several vehicle lines.

Visteon’s “Connected Audio Solution” incorporates ST’s Automotive-grade cost-optimized Car Radio Processors. The ST processor family features multicore processors (ARM®-core processors and an application-specific DSP) performing multiple functions: digital audio decoding and playback, processing of audio effects, rich peripheral connectivity (including support for smartphone mirroring), visual interfaces, acceleration for graphical HMI, and dedicated secure CAN Vehicle Interface subsystem, among others.

“Visteon worked closely with ST on the development of this platform, which is an ideal solution to address the growing complexity of the products and the fast market requirements,” said Fabio Marchio, Vice President of Automotive Product Group and General Manager of Micro and Infotainment Division, STMicroelectronics. “Drivers and their passengers will continue to reap the benefits of the ST and Visteon cooperation in the Infotainment domain.”

The platform offers a cost-effective system architecture for minimal CPU usage and best-in-class processing performance. The platform provides full support for Open Source Linux OS offering a wide choice of middleware and application components. It is the heart of in-vehicle head units that allow multiple different programs (such as audio-video navigation) to run on the radio unit to permit customers to experience numerous applications: display control (touch screen, others), navigation, multimedia playing, connectivity, and mirroring of smartphone/tablet interface and content.


About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people’s life. By getting more from technology to get more from life, ST stands for life augmented.

In 2013, the Company’s net revenues were $8.08 billion. Further information on ST can be found at www.st.com.

About Yanfeng Visteon Electronics
Founded in 1994, Yanfeng Visteon Electronics is a China Automotive electronics industry leader on development and manufacturing for domestic and foreign markets, consolidated under Visteon Corporation.

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STMicroelectronics

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