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Smartphone connectivity presents both opportunities and challenges for automotive processor chip suppliers

Tuesday, September 30th, 2014

The use of smartphones in motor vehicles—already a near-ubiquitous phenomenon—is the most disruptive trend in the automotive infotainment business today, presenting both challenges and opportunities for automakers and their processor semiconductor suppliers, according to a new report from IHS Technology.

The most promising prospect for automotive processors in the years ahead will be in the telematics portal head unit, which can connect with a smartphone for mobile broadband connectivity. Revenue for automotive infotainment processor chips for telematics portal head units will grow to $508 million in 2018, up from slightly less than $128 million in 2013, as shown in the figure below. And while this particular application accounted for only 8 percent of total global automotive infotainment processor market revenue in 2013, its share will surge to 30 percent in 2018.

In comparison, the automotive processor segment with the highest revenue last year, head units for navigation, will shrink dramatically by 2018. Revenue will plunge to $51.0 million in 2018, down from $367.8 million in 2013, as navigation becomes a standard feature provided not only by multimedia and telematics portals but also by smartphones.

“Smartphone use in vehicles has led to two divergent approaches to head-unit designs, one replacing smartphone and the other one embracing them,” said Tom Hackenberg, senior analyst for microcontrollers and microprocessors at IHS. “For the most part, automakers are heeding the call to accommodate mobile devices. This explains the dramatic rise in revenue for telematics portal head units, which address the complexities of the human-machine interface as well as the increasing consumer demand for ubiquitous connectivity.”

To keep up with such consumer preferences, automotive original equipment manufacturers (OEM) are providing systems that are more extensively integrated. Not only will infotainment systems come with features such as networked displays, controls built into the steering wheel and large touch screens, cars will also be able to capitalize on users’ smartphones to connect with the various integrated systems of the vehicle, in order to offer a richer and more up-to-date experience.

The great growth in new features from automotive OEMs is expected to take market share away from aftermarket vendors, which will be hard-pressed to exceed the rich user experience delivered from pre-installed and highly integrated infotainment systems.

Hitting the right mix

Some crucial challenges will face vehicle OEMs when developing media-rich cars. A feature-laden infotainment solution adapted from a consumer electronics design has a potential risk, however insignificant, of introducing previously unknown flaws or clashing with critical systems electronically. This can create a liability issue in vehicle design.

Also, excess or inappropriate infotainment can be construed as driver distraction—another liability for the OEM.

On the other hand, such concerns must be weighed against the potential for an inadequate user experience if car makers offer unsophisticated smartphone connectivity options, which could tarnish brands and make them seem irrelevant. Striking the correct balance—between a safe driving experience on the one hand, and the evolving demands of the connected consumer on the other—is creating a narrow but contentious design challenge for next-generation vehicle infotainment, Hackenberg noted.

The demand for a user experience commensurate with smartphones and tablets has additional implications for automotive infotainment, Hackenberg added. The disparity between the rapid development cycle of multimedia processors and the carefully tested development cycle of automotive OEMs means that the infotainment system designer must be creative in enabling flexible product-line solutions to accommodate a rapidly changing supply chain.

Another hurdle for automotive OEMs is to match consumer expectations of their infotainment experience. In this case, vehicle owners may want their connectivity interaction with the car’s infotainment system to look and feel the same as when they deal with their portable devices.

The problem is especially acute because mobile handsets come and go at a rapid pace, with new models and updates developing and introduced during a period of one year or less. Automotive makers, meanwhile, need to maintain a consistently high standard of quality, and it could take years to implement the new developments in connectivity, such as those related to interfacing with mobile devices like smartphones.

For the premium vehicle market, which is more likely to embrace multimedia and Internet connectivity features by replacing the need for a smartphone, this connotes designing a more modular and costly approach that can evolve at the pace of mobile technologies. For the more mainstream market embracing the smartphone for processing applications, this will mean a constant struggle with mobile device compatibility.

These findings can be found in the report entitled “Automotive Infotainment Processor Report – 2014,” from the Automotive & Transportation research service of IHS Technology.

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Teledyne LeCroy Announces Motor Drive Power Analyzer Software for HDO8000 Oscilloscopes

Tuesday, September 30th, 2014

Power Analyzer Capability for Three-phase Motor Drives Leverages 8 Channel, 12-bit Resolution, High Definition Oscilloscope Platform

Teledyne LeCroy today announces three-phase Motor Drive Power Analyzer software for its HDO8000 oscilloscopes. The HDO8000 mixed-signal oscilloscopes, with 8 input channels, 12-bit resolution, and up to 1 GHz bandwidth, are the perfect solution for motor drive embedded control and power section debug. With the addition of three-phase power analyzer capability and motor speed and torque integration, the complete drive system can be more quickly and easily validated and debugged, and extensive drive and motor power and efficiency measurements may be performed.

The HDO8000 and Motor Drive Power Analyzer software will be utilized by designers and manufacturers of motors, motor drives, variable frequency drives, variable speed drives, industrial automation and motion control equipment manufacturers. Design engineers that integrate motors into their designs (vehicles, power tools, appliances, elevators, fans, blowers, compressors, pumps, etc.) will utilize the product to validate proprietary controls and complete drive system designs.

Capability for Complete Drive System Validation and Debug

A complete drive system is a complex mix of three-phase power electronics, motor/mechanical analog and digital sensors, and embedded controls, with a complex variety of analog, digital, serial data and pulse-width modulated (PWM) signals. Oscilloscopes are able to capture higher-speed embedded control system or power transistor activities, but until now have been unable to measure drive power and efficiencies. Power Analyzers are a single-use tool for measuring input/output “black-box” drive power and efficiencies, but provide limited or no waveform capture for embedded control or drive system debug.

The HDO8000 oscilloscope with Motor Drive Power Analyzer software permits waveform captures from the drive power section, individual power transistors, and embedded control system, and performs coincident three-phase power analysis of the power section waveforms in one high-performance instrument, enabling debug and analysis of all aspects of the complete motor drive.

Flexible Setup Capability

An intuitive, graphical user interface provides setup/connection guidance. Setup capability is provided for any combination of single-phase or three-phase drive input/output, and supports both two- and three-wattmeter calculation methods and a line-line to line-neutral voltage conversion. Using the two-wattmeter method, drive input/output and motor output efficiencies can be measured using the eight inputs on the HDO8000 oscilloscope.

Most Complete Mechanical Motor Integration

The Motor Drive Power Analyzer software permits simple integration of nearly any type of speed, rotation or position sensor, including analog and digital (pulse) tachometers, Brushless DC (BLDC) Hall sensor, Quadrature Encoder Interface (QEI), and Resolvers. Additionally, Hall sensor and QEI signals can be integrated through digital inputs, preserving valuable analog input channels for other signals.

Beyond “Numbers” – More Information

Various voltage, current, power (real, apparent, and reactive), phase angle/power factor, and efficiency parameters are calculated on acquired voltage and current waveforms and displayed in a table. The table is user-configurable and is displayed along with the acquisition waveform, and corresponds to information normally provided by a Power Analyzer.

Additionally, a waveform showing any per-cycle measurement parameter variation can be displayed by simply selecting a table value. This waveform is time-correlated with other waveforms acquired by the HDO8000 oscilloscope and can be used to correlate complex drive behaviors to other control or power system waveforms, and to debug drive system problems. Statistical detail of the measurement set can also be displayed. This additional information goes well beyond what is provided by a Power Analyzer.

Dynamic Drive Response Analysis

The long acquisition memory in the HDO8000 (up to 250 Mpts/Ch) provides unique capabilities for motor and drive dynamic response analysis. For example, 25 seconds of continuous acquisition capture is possible at a sample rate of 10 MS/s. This permits complete understanding of dynamic drive behaviors, such as startup, application of load, or fast changing load conditions, and correlation of drive response problems to control system instructions or power section failures.


Standard Teledyne LeCroy passive or active voltage probes (passive or active) and current probes may be used for power measurements. In many cases, probes required for embedded control or power section debug can be used for power measurements, making incremental investments unnecessary. Other voltage and current measurement devices (potential or current transformers, current transducers, Rogowski coils, etc.) may also be easily and simply integrated to the HDO8000 oscilloscope.

1000VRMS isolation is available with Teledyne LeCroy’s HVD Series HV differential probes, with a maximum 2000VPK-PK differential voltage rating and 1% gain accuracy. These probes are high performance and very reasonably priced.

Expected Pricing and Delivery

The Motor Drive Power Analyzer software will sell for US $5000. It will be available for all HDO8000 oscilloscope models (350 MHz, 500 MHz, and 1 GHz).

Beta versions of the new three-phase Motor Drive Power Analyzer software are available in October, with product shipments scheduled for January 2014. Any customer who has already purchased a Teledyne LeCroy HDO8000 oscilloscope may request the beta software. The software beta availability follows worldwide alpha field testing and additional testing in Teledyne LeCroy’s dedicated motor drive lab.

About Teledyne LeCroy

Teledyne LeCroy is a leading manufacturer of advanced test instruments that measure, analyze, and verify complex electronic signals. The Company offers high-performance oscilloscopes and protocol test solutions used by electronic design engineers in a wide range of application and end markets. Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy’s website at

Contact Information

Teledyne LeCroy

700 Chestnut Ridge Rd
Chestnut Ridge, NY, 10977

toll-free: 800-909-7211

0V to 100V, 1% Accurate Energy Monitor Bias 12 Bit Output

Friday, September 26th, 2014

Linear Technology Corporation introduces the LTC2946, a high or low side charge, power and energy monitor for DC supply rails in the 0V to 100V range. An integrated ±0.4% accurate, 12-bit ADC and external precision time base (crystal or clock) enables measurement accuracy better than ±0.6% for current and charge, and ±1% for power and energy. A ±5% accurate internal time base substitutes in the absence of an external one. All digital readings, including minimums and maximums of voltage, current and power, are stored in registers accessible by an I²C/SMBus interface. An alert output signals when measurements exceed configurable warning thresholds, relieving the host of burdensome polling for data. The LTC2946 provides access to all the necessary parameters to accurately assess and manage board level energy consumption. In addition its wide operating range makes it ideal for monitoring board energy consumption in blade servers, telecom, solar and industrial equipment, and advanced mezzanine cards (AMC).

The LTC2946 can be powered from 2.7V to 5V directly, from 4V to 100V through an internal linear regulator, or beyond 100V through an internal shunt regulator. Two of the three general purpose input/output (GPIO) pins are configurable as an accumulator enable and alert output. The internal ADC operates in either a continuous scan mode or a snapshot mode. In shutdown mode, the device current consumption drops from 900µA to 15µA.

The LTC2946 is available in two options: the LTC2946 I²C interface has separate SDA input and output pins for standard or opto-isolated I²C, whereas the LTC2946-1 has an inverted SDA output for inverting opto-isolator configurations. Specified over the commercial, industrial, automotive and military temperature ranges, the LTC2946 is offered in 16-pin MSOP and 4mm x 3mm DFN packages. 1,000-piece pricing starts at $3.95 each. Device samples and evaluation circuit boards are available online or from your local Linear Technology sales office. For more information, visit

Summary of Features: LTC2946

  • Monitors Supply Voltage, Current, Charge, Power & Energy Use
  • 0V to 100V Monitoring Range, >100V with Internal Shunt Regulator
  • 12-Bit ADC with Scan & Snapshot Modes
  • I²C/SMBus Digital Interface
  • Guaranteed Accuracy:
    • ±0.4% for 12-Bit Voltage
    • ±0.6% for 12-Bit Current & 32-Bit Charge
    • ±1% for 24-Bit Power & 32-Bit Energy
  • Internal ±5%, External or Crystal Time Bases
  • Minimum & Maximum Value Recorder
  • Bias Supply Range: 4V to 100V, or 2.7V to 5.9V
  • Alerts on Exceeding Warning Thresholds
  • Split SDA Eases Opto-Isolation
  • Shutdown Mode with IQ < 40µA
  • 16-Pin MSOP & 4mm x 3mm DFN Packages

The USA list pricing shown is for budgetary use only. International prices may differ due to local duties, taxes, fees and exchange rates.

About Linear Technology

Linear Technology Corporation, a member of the S&P 500, has been designing, manufacturing and marketing a broad line of high performance analog integrated circuits for major companies worldwide for over three decades. The Company’s products provide an essential bridge between our analog world and the digital electronics in communications, networking, industrial, automotive, computer, medical, instrumentation, consumer, and military and aerospace systems. Linear Technology produces power management, data conversion, signal conditioning, RF and interface ICs, µModule® subsystems, and wireless sensor network products. For more information, visit

NXP Becomes World’s First Supplier to Deliver V2X Chipset for Mass-Production Secure Connected Cars

Thursday, September 25th, 2014

NXP supplies Delphi with RoadLINK technology for major global automaker, enabling cars to securely connect with one another and with traffic infrastructure

NXP Semiconductors (NASDAQ: NXPI), a global technology leader for the secure connected car, today announced a significant breakthrough for automotive drivers around the world. For the first time, V2X chipsets will be put into high-volume manufacturing. NXP will supply Delphi Automotive PLC (NYSE: DLPH) with its RoadLINK™ chipset for Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) communication. The wireless technology significantly improves road safety by alerting drivers of critical traffic information. Having secured a partnership with a leading global automaker, Delphi’s platform will be first to market and is expected to be on the roads in as little as two years.

Using NXP’s technology combined with application software from Cohda Wireless, Delphi’s platform allows alerts to be delivered to vehicles from other cars and surrounding infrastructure, such as traffic lights and signage to alert drivers about potentially hazardous traffic situations even beyond the line of sight, optimally complementing Advanced Driver Assistance Systems (ADAS) like radar. Messages could include blind-intersection collision, road condition hazards, road works, presence of emergency vehicles, stationary or slow moving vehicles, traffic jam, and accident warnings, as well as traffic signals or signage indicators. The solution avoids cellular or other networks that can be slow or unreliable, instead operating on IEEE 802.11p, a wireless communication standard designed for the needs of the automotive industry, and directly connects surrounding infrastructure and vehicles to each other to achieve immediate transmission and ensure reliable road safety communications. The V2X communication is protected against illegal attacks or data theft by NXP’s V2X hardware security module.

“The ability to detect and warn drivers of danger ahead is a significant leap toward improving car safety and traffic management,” said Jeff Owens, chief technology officer, Delphi Automotive.

Torsten Lehmann, senior vice president and general manager at NXP Semiconductors, explains: “The fact that Delphi, a leading global supplier of electronics and technologies for automotive and commercial vehicle market segments, has selected NXP as semiconductor supplier for its V2X communication technology makes us very proud. It underpins our strong commitment to make this life-saving technology a reality and proves our technology leadership in semiconductors for the secure connected car. It is also yet another milestone in our long-lasting close collaboration with Delphi.”

About NXP RoadLINK

The NXP RoadLINK™ product range for the connected car enables cars to communicate wirelessly with each other and with traffic infrastructure, exchanging data including location, speed and direction. This allows for 360-degree driver awareness to improve road safety by reducing collisions, warning of potential hazards, and avoiding traffics jams. With TEF510x and SAF5100 available to OEMs and Tier1s, NXP RoadLINK™ clearly pushes the global V2X market. The products cover all major global standards: they meet Japanese 760Mz C2X requirements, US and European (5.9GHz) as well as Wi-Fi and DSRC (5.8GHz) specifications. Next to the wireless communication products NXP offers a complete solution for V2X security, including hardware security modules (HSM) and verification acceleration to protect the connected car against hacking or data theft.


SAF5100 software-defined radio processor

TEF510x, a dual-radio, multi-band RF transceiver

NXP and Delphi enter strategic collaboration

About NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.82 billion in 2013. Find out more at

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NXP Semiconductors

Microchip Expands Low-Cost 8-bit PIC® Microcontroller Portfolio With New Devices Featuring Dual ADC Peripheral

Wednesday, September 24th, 2014

PIC16LF1554/9 Combine Low Power and Dual ADCs with Hardware Support for Advanced Touch-Sensing and General-Purpose Sensor Applications

Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced a new addition to its PIC12/16LF155X 8-bit microcontroller (MCU) family with the PIC16LF1554 and PIC16LF1559 (PIC16LF1554/9) devices.  The PIC16LF1554/9 includes two independent 10-bit 100K samples per second Analog-to-Digital Converters (ADC) with hardware Capacitive Voltage Divider (CVD) support for capacitive-touch sensing.  This unique ADC configuration enables more efficient sensor acquisition and assists with advanced touch-sensing techniques for extremely noisy environments, low-power applications, matrix keypads and water-resistant designs.

Watch a short video:

The 14- and 20-pin PIC16LF1554/9 MCUs combine up to 17 ADC channels with automated hardware CVD modules to implement capacitive sensing and other front-end sampling applications with minimal software overhead.  These devices also include up to 14 KB Flash/512 Bytes RAM, a 32 MHz internal oscillator, two PWM modules, along with I2C™, SPI and EUSART for communications. Additionally, they are eXtreme Low Power (XLP) compliant with active and sleep currents of 35 µA/MHz and 30 nA, respectively, for applications where energy conservation is paramount.  These features, combined with the low cost and small footprint of the PIC16LF1554/9, make it well suited for a wide range of applications in the consumer-electronic (e.g., remote controls, audio players, cell phone accessories, small appliances, wearable devices such as headphones, watches and fitness wristbands), medical (e.g., blood-pressure monitors and wearable heart-rate monitors), automotive markets (e.g., automotive interior controls and control panels) and industrial markets (e.g., RFID and sensors), among others.

“The PIC16LF155X family is designed to enable basic application functions for a wide variety of end equipment,” said Fanie Duvenhage, director of Microchip’s Human-Machine Interface Division.  “The multiple Analog-to-Digital structure coupled with the high number of input channels makes the family stand out in applications that require advanced touch-sensing.  The hardware CVD simplifies capacitive touch-sensing designs considerably and reduces the related code by more than 40%.”

Development Support

Microchip’s full suite of development tools support the PIC16LF1554/9 MCUs, including the MPLAB® X Integrated Development Environment (IDE)PICkit™ 3 (part # PG164130, $47.95), MPLAB XC8 Compiler for 8-bit PIC MCUs and MPLAB® Code Configurator.

Pricing & Availability

The PIC16LF1554 MCUs are available now for sampling and production in 14-pin PDIP, TSSOP, SOIC and 16-pin QFN (4 x 4 x .9 mm) packages.  The PIC16LF1559 MCUs are available now for sampling and production in 20-pin PDIP, SSOP and QFN (4 x 4 x .9 mm) packages.  Pricing starts at $0.63 each, in 10,000-unit quantities.

For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s Web site at  To purchase products mentioned in this press release, go to microchipDIRECTor contact one of Microchip’s authorized distribution partners.

About Microchip Technology
Microchip Technology Inc. (NASDAQ: MCHP) is a leading provider of microcontroller, mixed-signal analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at

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Microchip Technology Inc.

2355 W. Chandler Blvd.
Chandler, AZ, 85224

tele: 480.792.7200
toll-free: 888.MCU.MCHP
fax: 480.792.7277

Shipments of OEM embedded telematics systems will grow to 54.5 million worldwide in 2020

Wednesday, September 24th, 2014

According to a new research report by Berg Insight, shipments of OEM embedded telematics systems worldwide are forecasted to grow from 8.4 million units in 2013 at a compound annual growth rate (CAGR) of 30.6 percent to reach 54.5 million units in 2020. Moreover, Berg Insight forecasts that the number of cars sold worldwide equipped with head-units featuring handset-based telematics capabilities will grow from 7.0 million in 2013 to 68.5 million in 2020. Telematics is a broad term that may be applied to a wide range of connected services in the automotive industry. Berg Insight’s definition of a car telematics system is an automatic system designed for passenger cars that incorporates some form of cellular communication. Automotive manufacturers can choose between several connectivity options when creating connected car services, which are not mutually exclusive. The main options today are embedded telematics devices, tethered handsets and integrated smartphones. Car manufacturers often use a combination of these options to support different customer needs and keep pace with the rapid development of mobile technology.

Connected car services are gaining momentum globally after many years of development and gradual rollout. The drivers behind adoption of telematics systems among car manufacturers are both commercial and regulatory. Safety regulations that aim to make automatic emergency calls with vehicle location mandatory in all new cars are for instance being adopted in the EU and Russia with the eCall and ERA-GLONASS initiatives respectively. In other markets such as North America and Japan, commercial services have driven adoption of OEM telematics services that have evolved from being a differentiator to a mainstream feature offered by most car brands.

Several categories of connected car services are now offered by leading car manufacturers. Examples include emergency call and roadside assistance, stolen vehicle tracking (SVT), vehicle diagnostics, connected navigation and infotainment, as well as convenience applications. Convenience applications for instance include remote control of vehicle functions such as door lock/unlock and air conditioning, vehicle status and finding the last parking position. Several other applications also exist, for instance usage-based insurance, leasing and rental fleet management, as well as electronic toll collection and road charging. Most telematics services can be supported by any connectivity type, although embedded connectivity is the most suitable option for applications including emergency call, SVT and convenience applications. There are many business rationales for car telematics, ranging from monetary savings for the car owner in the case of SVT and usage-based insurance, to product differentiation, improved customer relationship management, potentially lower costs of product recalls and soft value creation for the car OEM.

Berg Insight forecasts that the number of telematics service subscribers using embedded systems will grow at a compound annual growth rate of 38.1 percent from 16.6 million subscribers in 2013 to 158.9 million subscribers in 2020. “A key factor that influences the growth in active subscribers is the length of the free trial period included in the price of new cars”, said André Malm, Senior Analyst, Berg Insight. He adds that the free period now typically ranges from 6–12 months in the case of Chrysler, GM, Mercedes-Benz, Toyota and Volkswagen to 3 years for Hyundai and 10 years for BMW. “Renewal rates for telematics subscriptions after the free period expires are presently relatively low”. However, car brands are now launching cloud-based telematics services that facilitate customisation of service packages to better meet the needs of individual customers. Several car manufacturers have app stores that enable car owners to download apps directly to the infotainment system of the car. “New split-billing solutions being introduced by telecom operators also increase flexibility in business models for car manufacturers offering connected car services to their customers”, said Mr Malm. Split-billing can for example enable car manufacturers to bundle services such as eCall, roadside assistance and diagnostics for the lifetime of the car, while high bandwidth applications like infotainment and car hotspot features are billed separately.

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Telematics West Coast USA 2014 Releases Sample Delegate List: Over 150 Senior-Execs Already Confirmed to Attend

Monday, September 22nd, 2014

Telematics Update has today announced that with less than one month remaining until the Telematics West Coast 2014 Conference & Exhibition (Oct 30-31, San Diego) over 150 senior influencers from leading OEMs, TSPs, content providers, and many more have already signed-up to attend; with a record 75% hailing from California and more automakers attending than ever before.

Telematics West Coast is the most focused forum on in-car content and services for the North American connected car industry. Held in San Diego in October, Telematics West Coast will showcase world class speakers, crucial industry debates and executive attendees, including nine OEM speakers from Ford, Mercedes-Benz, Chrysler, Volkswagen, Nissan, and more (

Record Number of Delegates attending

The event has seen a record number of bookings, with the number of attendees up 20% from last year. Telematics Update’s Annie Reddaway said: “The level of interest in this show demonstrates just how important west coast hubs have become for the automotive industry. It looks like the region will be able to hold its own in influencing key industry decisions- I look forward to this being reflected in the debate. We are heading towards a fantastic event full of high-quality speakers and networking opportunities with the important decision makers in the industry’

A sample of the current delegate list is available to preview on the website:

Telematics West Coast 2014 boasts its highest OEM representation yet, as Volkswagen, Mercedes-Benz, Ford, Jaguar Land Rover, Nissan, Chrysler and Kia will be sharing their expertise with an audience of over 250 executives. They join speakers from across the value chain to tackle the topic of delivering the next generation of in-car content and services. The conference will address how to effectively utilize data and harness the latest technology developments to create a seamless user experience that empowers the consumer.

Pandora said of the conference: ‘A great opportunity to hear what is happening in such a dynamic space, and a phenomenal networking opportunity’.

Key Topics Include:

  • How to harness data to deliver contextual & personalized content and services
  • Examine the rapidly evolving connected car industry and address the crucial question of who will take ownership of the user experience
  • Leverage real-time vehicle data to improve vehicle and customer relationship management as well as revolutionize the R&D process
  • Debate the place of automotive in the Internet of Everything and how to integrate the car into the connected lifestyle
  • Address the important issue of security and learn how to develop a secure autograde platform

For the complete Telematics West Coast 2014 conference program and speaker line-up, access the e-brochure at or contact the Telematics Update team at

Register before October 3 via the secure link below to take advantage of a $100 saving on all conference passes:

About Telematics Update:

Telematics Update Conferences are the most prestigious in the industry. We produce the largest telematics events in North America, Europe & Asia, and attract the most influential speakers providing a rich environment for establishing strategic relationships and networking.

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Teledyne LeCroy Announces 8 Channel, 12-bit, 1 GHz Bandwidth Oscilloscope with HD4096 Technology

Thursday, September 18th, 2014

Further, Finer, Faster — More channels, high-definition, and higher bandwidth are ideal for high-power three-phase power electronics systems analysis

hdo8k-md2_7645rt-bldc9Teledyne LeCroy today announces the HDO8000 oscilloscope product line with 8 analog input channels, 12-bits of vertical resolution utilizing Teledyne LeCroy’s HD4096 technology, and up to 1 GHz of bandwidth. The HDO8000 oscilloscopes have maximum performance, going further (8 channels), with finer resolution (12-bits) and faster (up to 1 GHz bandwidth). A wide variety of mixed-signal, serial data, long memory, and probe options and accessories are available with the HDO8000 oscilloscopes.

The HDO8000 is ideal for high-power three-phase power electronics system analysis. The global market for power electronics is growing quickly, especially in high-power and three-phase energy conversion applications focused on distributed power generation (solar PV, wind, etc.) and hybrid electric and electric (HEV and EV) vehicle propulsion systems. New and expanded efficiency requirements for electric motors and variable frequency (motor) drives are also driving higher demand for three-phase power electronics.

Additionally, 8 channel high-definition oscilloscopes are highly useful in debugging deeply embedded systems in applications such as automotive electronic control units (ECUs), consumer appliances (e.g. washing machines, refrigerators) and industrial systems (e.g. robotics) that contain a complex mix of power electronic, power, clock, digital logic, serial data, and analog sensor signals. More channels and more resolution provide faster insight into embedded system behavior.

HD4096 High Definition Technology

HD4096 High Definition Technology is rooted in high-sample-rate 12-bit ADCs; amplifiers with high signal-to-noise ratios; and a low-noise system architecture. This technology enables high definition oscilloscopes to capture and display signals of up to 1 GHz with high sample rate and 16 times more resolution than other oscilloscopes. In addition to HD4096 technology, the HDO8000 features Teledyne LeCroy’s ERES (Enhanced Resolution) filtering, which enables users to gain up to three additional bits of resolution for 15-bit vertical resolution.

Q-ScapeTM Multi-tabbed Displays

Teledyne LeCroy’s new Q-Scape multi-tabbed display provides four times the display area and better organization of large numbers of channel, zoom and math waveforms (up to 40 total) on the oscilloscope’s 12.1” WXGA high-resolution display. Four “tabbed” displays are provided. Waveforms can be simply dragged and dropped to the desired location to conveniently organize the many different acquired and calculated waveforms for more intuitive analysis. Q-Scape is especially helpful in three-phase system analysis as each phase can be displayed on a dedicated tab.

For those desiring a larger display area and even higher display resolution, the HDO8000 supports extended-desktop operation with a WQXGA (3840×2160 pixels) DisplayPort 1.2 video output. Q-Scape tabbed displays may then be viewed on a larger display while another program (e.g. MATLAB) is viewed on the smaller oscilloscope display.
Powerful Analytics

The HDO8000 is standard with 50 Mpts/ch of acquisition memory with options for 100 Mpt or 250 Mpt/ch. These long acquisition memory options are ideal for power electronics and embedded/mechatronic systems where high-speed microprocessor signals may be captured coincidentally with lower speed pulse-width modulated (PWM), serial data, or analog sensor signals. The Teledyne LeCroy deep toolbox is provided for statistical, frequency and time-domain analysis using Tracks, Trends, Histograms and a variety of other math and measurement capabilities. Tracks are particularly useful for PWM analysis. A variety of other application-based software options are available.

An Intel™ Core® i5-4670s Quad (core) motherboard with 8GB of RAM provides fast and efficient processing of acquired channels and calculated waveforms, and additional capability when third-party programs are run on the oscilloscope. The motherboard is upgraded to 32GB of RAM with the 100 Mpt and 250 Mpt/ch memory options.

HDO8000 Pricing and Delivery

Models are available at 350 MHz (HDO8038), 500 MHz (HDO8058), and 1 GHz (HDO8108) of bandwidth. The HDO8038, HDO8058 and HDO8108 are priced at $23,850, $26,850, and $29,850, respectively. A 16 digital channel MSO option (HDO8k-MSO) is priced at $2,800, and the 100 Mpt/ch (HDO8k-L) and 250 Mpt/ch (HDO8k-XL) are priced at $8,000 and $10,225 respectively. A variety of other probe, serial trigger/decoder and application package solutions are priced starting at $840. Teledyne LeCroy expects to begin customer shipments of HDO8000 models in August of 2014.

About Teledyne LeCroy

Teledyne LeCroy is a leading manufacturer of advanced test instruments that measure, analyze, and verify complex electronic signals. The Company offers high-performance oscilloscopes and protocol test solutions used by electronic design engineers in a wide range of application and end markets. Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy’s website at

Contact Information

Teledyne LeCroy

700 Chestnut Ridge Rd
Chestnut Ridge, NY, 10977

toll-free: 800-909-7211

ZF Friedrichshafen Agrees to Acquire TRW Automotive

Tuesday, September 16th, 2014
  • Combined Company With Pro Forma Sales of More Than € 30 Billion and 138,000 Employees
  • Complementary Portfolio of Acknowledged Products and Technologies Benefitting from Megatrends Such as Fuel Efficiency, Increased Safety Requirements and Autonomous Driving
  • Balanced Regional and Customer Portfolio in Both Volume and Premium Segments
  • All Cash Transaction at Full and Certain Value for TRW Stockholders

Friedrichshafen, Germany and Livonia, MI, USA. ZF Frie-drichshafen AG and TRW Automotive Holdings Corp. (NYSE: TRW) today announced that they have entered into a definitive agreement under which ZF will acquire TRW. The combined company will be a global leader in the automotive supplier business with pro forma combined sales of about € 30 billion (approx. US$ 41 billion) and 138,000 employees. Together, ZF and TRW will be uniquely positioned to benefit from the megatrends of the automotive industry on a global basis.

Combination of two Highly Successful Technology Leaders
Both companies have acknowledged technology positions in high-growth segments that profit from the megatrends towards fuel efficiency, increased safety requirements and autonomous driving. ZF is an important player in driveline and chassis technologies, whereas TRW is a significant supplier of active and passive safety technologies, including advanced driver assistance systems. Both companies have demonstrated a strong track record based on high product quality and continued innovation for their customers.

Globally, pro-forma combined R&D investments (total company funded engineering expenses incl. R&D, ref. to FY 2013) will amount to approximately € 1.5 billion (about US$ 2.1 billion), making ZF a global leader in R&D.

Stefan Sommer, Chief Executive Officer of ZF, said: “The acquisition of TRW fits perfectly into our long-term strategy. The transaction combines two highly successful companies that have remarkable track records of innovation and growth and solid financial positions. We are strengthening our future prospects by enlarging our product portfolio with acknowledged technologies in the most attractive segments.”

Sommer continued: “This is an acquisition in the spirit of a part-nership. We look forward to welcoming TRW’s employees to our company and are committed to working closely with them to realize the potential of this exciting combination. The Detroit metro area will remain a major business center for the company, and we expect employees from both companies to benefit from the enhanced career opportunities at a larger, more diversified company.”

John C. Plant, Chairman and CEO of TRW, said: “We have long respected ZF as a very successful company in our industry with similar values and focus on innovation. This transaction provides significant benefits for our shareholders who will receive a full and certain value for their shares, as well as for our employees, customers and communities, all of which will reap the benefits of being part of a larger, more diversified global organization. Our employees have shown admirable dedication in growing TRW into the formidable company it is today, and our strong performance is a testament to their hard work.”

U.S. and China Sales Volumes to More Than Double
With the acquisition of TRW, ZF would more than double its sales in two of the most significant countries of the world for automotive sales: China and the United States.

ZF has done business in the U.S. since 1979 and currently operates 12 sites, including a production site for automatic transmission systems in South Carolina that was opened in mid-2013. Through the transaction, ZF would significantly increase its annual sales volume in the U.S. from € 2.8 billion (US$ 3.9 billion) to € 6.5 billion (US$ 9.0 billion).

ZF’s presence in China, accounting for two thirds of the company’s total regional sales of € 3 billion (US$ 4.1 billion) in Asia-Pacific, would be significantly strengthened as a result of the combination. Together with TRW, which also has a strong presence in China, ZF would achieve a sales volume of € 4.0 billion (US$ 5.5 billion) in China. Furthermore, the combined company would achieve annual sales of about € 5.4 billion (approx. US$ 7.5 billion) in the Asia-Pacific region.

Both companies have invested heavily into expanding their pro-duction footprint over recent years. Further, both have major pro-duction sites and strong R&D operations in China: ZF is currently expanding its R&D Center in Shanghai to 800 employees which is a 30 minute drive away from TRW’s new R&D facility. The TRW facility will eventually house 1,200 employees, making it TRW’s largest R&D site worldwide.

Balanced Regional and Customer Portfolio
The combined group will generate about half of its sales in Europe and half in North America, Asia-Pacific and the rest of the world. The transaction will also lead to a balanced portfolio of customers in both the premium and the volume segments. TRW achieves a large portion of sales in the volume segment and maintains strong relationships with US and European volume manufacturers. ZF possesses a broader customer base and is strong among premium car producers. Further, the combined company will be well positioned to supply car manufacturers in Asia.

TRW to Become a Separate Business Division of ZF
ZF will remain headquartered in Friedrichshafen. TRW will be integrated into ZF as a separate business division. No decisions about management responsibilities for the TRW business have been made yet. The companies plan to establish integration teams consisting of balanced representation from both companies to ensure a seamless integration that positions the combined company for accelerated growth while addressing potential challenges for employees and customers. Due to the complementarity of the two companies the main focus will be on growth while cost synergies are expected to be mainly derived from greater purchasing power and sharing best practise standards.

Full and Certain Value for TRW Stockholders
Under the terms of the agreement, ZF will acquire TRW in an all-cash transaction valued at approximately US$ 12.4 billion based on equity value. The agreement has been approved by ZF’s Supervisory Board and Management Board and TRW’s Board of Directors. TRW stockholders will receive US$ 105.60 in cash for each share of TRW stock.

Transaction Fully Financed on Conservative Terms
ZF has received firm financing commitments from Citigroup and Deutsche Bank and remains committed to its conservative finan-cial policy. Due to the strong growth and cash flow profile of the combined company, ZF expects to reduce its financial leverage significantly again in the coming years.

Transaction Closing Conditions
The transaction is subject to several customary closing conditions, including antitrust and US foreign investment clearance and the approval of TRW’s stockholders representing more than 50 percent of TRW’s outstanding shares. ZF expects the transaction to close in the first half of 2015. Following the closing, TRW will be delisted from the New York Stock Exchange.

Benefits for all Stakeholders
Stefan Sommer added: “The combination makes sense for all of our constituencies: Customers of both companies will have access to a broader offering under one roof and employees from ZF and TRW will enjoy enhancements that result from the combined organization. TRW stockholders will receive an attractive valuation and our own shareholders – the Zeppelin and Ulderup foundations – will benefit from improved future prospects and diversification of the combined company.” Prof. Dr. Giorgio Behr, Chairman of the ZF Supervisory Board, underlined that “both companies make this step from a position of strength. They have excellent growth prospects”.

Contact Information

ZF Friedrichshafen

Microchip’s MCP8063 – A World-First in Sinusoidal Motor Driving

Thursday, September 11th, 2014

This video introduces Microchip’s first feature-rich 3-phase BLDC motor gate driver with power module and provides detailed features.

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Contact Information

Microchip Technology Inc.

2355 W. Chandler Blvd.
Chandler, AZ, 85224

tele: 480.792.7200
toll-free: 888.MCU.MCHP
fax: 480.792.7277

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