Archive for October, 2016

Qualcomm and Lumen Sign Commercial Wireless Electric Vehicle Charging License Agreement

Friday, October 28th, 2016

Qualcomm Inc. and Lumen Australia, a leading global supplier and integrator of electrical and electronic systems, have entered into a wireless electric vehicle charging (WEVC) license agreement. Lumen will include Qualcomm Halo WEVC technology in its product portfolio and will commercialize WEVC systems for plug in hybrid and electric vehicles manufacturers, as well as wireless charging infrastructure companies. The agreement enables Lumen to develop, make, and supply WEVC systems based on Qualcomm Halo WEVC technology.
Lumen is based in Asia-Pacific but represented globally through, manufacturing, technical and sales divisions and supported by the Global Centre of Excellence, situated in Melbourne, Australia.
“Lumen’s integration expertise ideally positions us to develop and deliver a widely varied portfolio of WEVC systems, including multi-coil systems to meet our customer’s requirements,” states Mr Jon Evans, chief executive officer, Lumen. “Working with Qualcomm provides us access to industry leading WEVC technology and extensive engineering knowledge and support.”
“Qualcomm is providing Lumen with a comprehensive technology transfer tailored to accelerate and enhance their ability to develop commercially and technically viable WEVC systems and to support the future design of improved WEVC designs,” said Steve Pazol, vice president, and general manager, wireless charging, Qualcomm Incorporated. “We are excited to be working closely with Lumen as they commercialize Qualcomm Halo technology, and bring WEVC charging into production and expand our network of high-quality automotive component suppliers into Asia-Pacific.”

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Mentor Graphics Partners with Telemotive on smart charging technology for plug-in vehicles

Thursday, October 27th, 2016

Mentor Graphics Corp. has inked a joint engineering and marketing agreement with Telemotive AG, a Magna International company. The heart of the agreement will be the integration of Mentor’s Volcano VSTAR AUTOSAR stack with Telemotive’s Power Line Communication (PLC). The two technologies together provide key software building blocks to automotive suppliers creating electronic control units (ECUs) that allow for smart charging of electric vehicles.
Smart charging, which includes transmission of data via charging cables, allows for secure payments at the burgeoning network of for-pay public charging stations around the world. Telemotive has long provided a software stack supporting error-free communication between a charging column and vehicle. The modular software, compliant with the international standard governing communication between plug-in vehicles and electrical supply equipment (ISO 15118), can be integrated into every relevant ECU.
Mentor’s Volcano VSTAR stack includes platform and communication middleware, an operating system, design/validation tools, and more. The integrated Mentor-Telemotive stack can be implemented on nearly any microcontroller serving as the brains of a smart-charging system, whether developed by a Tier One supplier or OEM.
“These highly synergistic Mentor and Telemotive technologies are well-suited to help engineers quickly develop highly advanced automotive smart charging solutions,” said Franz Diller, board member of Telemotive AG.
The integrated stack enables easy connection to a PLC transceiver serving as the gateway to internet-based services supporting payments, and perhaps eventually to applications such as the dynamic negotiation of charging plans in the context of evolving environmental or user conditions.
“Electrification of the powertrain is one of the major trends impacting the auto industry, and is also tightly linked to other disruptors like autonomous driving and vehicle/cloud connectivity,” said Rainer Oder, general manager of Mentor Graphics’ Automotive Business Unit. “These trends are, in turn, driving increased focus on smart charging and other PLC-enabled services, which present new engineering challenges for both established and emerging auto industry players.”

Contact Information

Mentor Graphics – Veloce Emulation Platform

8005 SW Boeckman Rd.
Wilsonville, OR, 97070

tele: 1-503-685-8000
toll-free: 1-800-547-3000

Intrinsic-ID’s PUF-based security solution for VxWorks addresses the needs of mission-critical and safety-critical VxWorks customers

Wednesday, October 26th, 2016

Intrinsic-ID announces the availability of SRAM PUF (Physical Unclonable Function) tightly integrated with Wind River® VxWorks® real-time operating system as a kernel library. The solution adds critical key management services for protection and provisioning of cryptographic keys without the need for added secure elements or other dedicated hardware. The SRAM PUF technology, which has been validated and certified by US and EU security labs, will add the most advanced method of protection for embedded systems.

Intrinsic-ID’s SRAM PUF-based solution includes:Flexible key provisioning and hardware-based key storageHardware fingerprinting for authentication and identificationDevice cloning preventionHardware to software binding to protect IP Protection of sensitive data from malware. The Intrinsic-ID library will be integrated with crypto libraries to enable a seamless use by application developers. Additionally, key provisioning and signing tools will be available for customer to support the manufacturing of the devices.

“By working together, Wind River and Intrinsic ID enable customers to have a robust, tamper-resistant and cloning-resistant embedded system across a wide variety of hardware platforms,” said Pim Tuyls, CEO of Intrinsic-ID. “As our world becomes more interconnected with intelligent devices, the need for authentication grows with it. Today, as more and more automobile manufactures implement safety features like collision avoidance systems, it is vital that the sensors providing real-time data are reliable, genuine, authentic and protected from being spoofed.”

Dinyar Dastoor, vice president and general manager of operating system platforms at Wind River, commented: “VxWorks customers with sensitive data and systems to protect such as the military, hospitals, aerospace and automotive industries, can now easily deploy uncloneable and counterfeit-resistant authentication to their offerings through VxWorks and Intrinsic-ID’s security offering without having to go through the cost of adding additional security hardware.”

About Intrinsic-ID

Intrinsic-ID is the world’s leading digital authentication company and the inventor of SRAM Physical Unclonable Function or SRAM PUF. Intrinsic-ID leverages inherent manufacturing variations in chips to create unique IDs and keys to authenticate chips, data, devices and systems. Since a unique ID can be extracted easily from SRAM with Intrinsic-ID’s technology, adding authentication and key provisioning is much less expensive than with current methods; no additional hardware is needed. Due to the low cost of implementing SRAM PUF and the critical need for security, Intrinsic-ID’s authentication technology is ideally positioned to address the needs of the fast-growing IoT market. Intrinsic-ID’s solutions are used worldwide to validate payment systems, secure connectivity, authenticate sensors and protect sensitive government and military data and systems.

Contact Information

Intrinsic-ID B.V. Headquarters

High Tech Campus 9
5656 AE Eindhoven
The Netherlands

tele: +31 40 851 90 20

Infineon AURIX TC3xx microcontroller family drives automated driving and electromobility

Monday, October 24th, 2016

Serving Infineon Technologies’ AURIX TC3xx microcontroller line serves the requirements of automated cars and electric vehicles, offering six cores so real-time performance is three times higher than that available today.
With hexa-core architecture and advanced features for connectivity, security and embedded safety, the AURIX family TC3xx is facilitates a wide field of automotive applications. In addition to engine management and transmission control, powertrain applications include electrical and hybrid drive systems. Specifically, it handles hybrid domain control, inverter control, battery management, and DC-DC converters.
The AURIX TC3xx microcontrollers are well-suited to safety-critical applications ranging from airbag, braking and power steering to sensor-based systems using radar or cameras. The combination of performance and a powerful safety architecture can be beneficial for domain control and data fusion applications that support the next levels of automated driving.
The AURIX TC3xx family, which will be automotive qualified in 2019, will be highly scalable and offer Flash memory sizes of up to 16 MByte and more than 6 MByte of integrated RAM. Compared to today’s AURIX TC2xx microcontrollers with up to three TriCore cores, the TC3xx multicore architecture provides up to six TriCore cores, each with a full clock frequency of 300 MHz. Four of the six cores feature an additional lockstep core, enabling a new level of ISO 26262 functional safe computational power on a single integrated device. Up to 2,400 DMIPS performance supports applications classified ASIL-D. That performance more than triples the 740 DMIPS of the previous AURIX architecture.
The performance increase and the reuse of existing safety concepts allow automotive system suppliers to reduce development costs by 20 percent and improve time-to-market. Also, more functions can now be implemented on a single microcontroller, such as powertrain and chassis domain control and next generation radar and fusion algorithms.
Automotive radar systems ranging from blindspot monitoring to advanced front radar specifically benefit from the capabilities of the AURIX TC3xx family. TC3xx microcontrollers will feature a radar processing sub-system with up to two dedicated Signal Processing Units running at 300 MHz enabling computation of next-generation radar algorithms on a single chip. In addition, radar chips can be seamlessly connected to AURIX via a high-speed digital radar interface.
AURIX TC3xx addresses security with a programmable Hardware Security Module (HSM) available across the family. It supports secure on-board communications and preventa hardware manipulation such as motor tuning. New asymmetric cryptography accelerators are integrated into the HSM hardware to help achieve full EVITA support. The AURIX TC3xx facilitates fast software-over-the-air updates to protect against software hijacking.
As a host controller in gateway and telematics applications, AURIX TC3xx microcontrollers offer a Gigabit Ethernet interface, up to 12 CAN-FD channels compliant to ISO11898-1 and up to 24 LIN channels. An additional eMMC interface for external Flash interfacing enables local data storage supporting software-over-the-air update concepts.

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Friday, October 7th, 2016


U.S. DOT Secretary Addresses Importance of Testing Connected, Automated and Zero-Emission Vehicle Technology

Monday, October 3rd, 2016

Sec. Foxx observes advanced R&D projects designed to improve road safety, accelerate vehicle electrification, and prepare for vehicle automation

U.S. Department of Transportation (USDOT) Secretary Anthony R. Foxx visited the International Transportation Innovation Center (ITIC) in Greenville, S.C. today to observe examples of the latest road safety and road charging technology in development for automated, sustainable and connected vehicles. Headquartered in Greenville, S.C., ITIC operates as a neutral, non-profit provider of innovation, testing and testbed development services for automotive technology R&D.

Speaking before a crowd of more than 100 business and industry leaders, Foxx focused his remarks on the four major points of the Federal Automated Vehicle Policy his department issued last week.

“We are on the cusp of one of the most dramatic transformations in the history of transportation,” he said. “When it comes to the future of technology, our policy leaves plenty of room for leadership to come in and help us continue to raise the bar on safety. It’s exhilarating to see what’s happening here at ITIC and in other places like Detroit and Silicon Valley.”

Demonstrations Sec. Foxx observed focused on sensor-based roadside safety systems; camera-based vehicle side collision avoidance systems; and in-motion wireless power transfer supported by a cybersecure DSRC (Dedicated Short Range Communication)-based infrastructure. The technology demonstrations were orchestrated by ITIC Chief Technology Officer Dr. Joachim Taiber and supported by BMW, Cisco, Duke Energy, Mobileye, Oakridge National Laboratory, Proterra and Toyota. Other event partners included SK Telecom and SmartTruck as well as event sponsor Club Car.

“The innovations we’re developing for multi-modal, on-demand automated and sustainable transportation systems are in current demand for smart city environments all over the world,” said ITIC’s Dr. Taiber. “The recently published Federal Automotive Vehicle Policy developed under the leadership of USDOT provides an important framework for a new approach to test automated vehicles and related infrastructure.”

For information about ITIC, visit

About the International Transportation Innovation Center

The International Transportation Innovation Center (ITIC) is building a global network of open and closed automotive testbeds for the most advanced innovations in connected, automated and sustainable mobility. It offers automotive OEM’s, suppliers, infrastructure service providers, research organizations and startups a multitude of services for developing and testing solutions for transportation megatrends such as vehicle automation, connectivity and electrification in an ecosystem that is safe, secure and confidential.

Headquartered at the South Carolina Technology & Aviation Center in Greenville, S.C., ITIC is currently developing a 600-acre neutral automotive testbed for connected, automated and zero-emission driving technologies. Accessible to a large ecosystem of public and private R&D and manufacturing partners from across the automotive and IT industries, the ITIC testbed will allow companies to validate their technological innovations to ensure compliance with federal regulations.

ITIC is also involved in the design of automotive testbeds in Seaside, Florida; Munich, Germany; and Trondheim, Norway. More information may be found at

Contact Information

International Transportation Innovation Center (ITIC)

5 Hercules Way
Greenville, SC, 29605

tele: (864) 451-5755
fax: (864) 451-5755

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