Archive for November, 2016

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Fact vs. Fiction in Automotive IoT: New Research Clears the Air

Wednesday, November 30th, 2016

Mobile Experts LLC has released a study that draws a line between fact and myth in the developing automotive IoT market.

The report investigates connectivity for telematics, vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) applications using DSRC and LTE, as well as TPMS and other wireless applications related to cars. New business models for insurance and 5G technology prospects are explored.

“A political battle is raging in the United States, with the auto industry pushing for the Federal Communications Commission and the Department of Transportation to adopt DSRC using 802.11p,” commented Mobile Experts Principal Analyst Joe Madden. “However, the wireless industry—led by Qualcomm–is pushing for extension of Wi-Fi into the 5.8 GHz band and LTE for V2V communications. The outcome of this politicized decision will have far-reaching implications, as many other countries are waiting for the USA to make the first move.”

According to the Mobile Experts report, the overall number of wireless IoT modules shipped in the automotive sector will triple, from 200 million in 2015 to more than 600 million in 2021. That means that multiple radios will be used for each vehicle, since only about 80 million vehicles are sold each year. Mobile Experts predicts that revenue for automotive IoT modules will grow from about $6 billion today to $10.9 billion in 2021. Semiconductors for automotive IoT will grow steadily to about $5 billion in 2021, Mobile Experts reports.

“Cars are already connected using 2G, 3G, and LTE. We don’t see a role for 5G in the car, but we predict the rise of some very interesting new business models coming into the market with Usage Based Insurance, fleet management, infotainment, and improved safety. It’s important to note that autonomous cars collect huge amounts of data. This analysis makes some predictions about what cars will do with that data, and how much will be shared over the network,” said Principal Analyst Joe Madden.

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Toyota Motor Corp. Approves Mentor Graphics Volcano VSTAR AUTOSAR Stack for Deployment in Toyota Vehicles

Wednesday, November 30th, 2016

Mentor Graphics Corp. said Toyota Motor Corp. has approved its Volcano VSTAR AUTOSAR basic software stack for use in all Toyota vehicles. With this approval, global Tier 1 automotive suppliers can now leverage Mentor’s resource-efficient AUTOSAR stack for the design and development of advanced Electronic Control Units in next-generation Toyota models.
Supported by Volcano VSx design tools across the development cycle, Mentor’s Volcano VSTAR software stack provides scalable AUTOSAR 4 middleware which abstracts the application from the hardware-dependent layer for the rapid development of highly differentiated end-products.
A longtime premium partner of the AUTOSAR development partnership, Mentor has an track record of promoting AUTOSAR as the premier open standard for automotive electronics engineering. Designed to optimize re-use and transferability of ECU design assets, AUTOSAR allows automotive engineers and suppliers of ECUs to achieve modularity and scalability of software with standardized interfaces, improving the ability to handle high-complexity designs.

Contact Information

Mentor® A Siemens Business


tele: 1-800-547-3000
https://www.mentor.com/

Analog Devices Acquires Laser Beam Steering Technology from Vescent Photonics to Enable Mainstream Adoption of Automotive LIDAR Systems

Thursday, November 17th, 2016

Analog Devices Inc. purchased solid-state laser beam steering technology from Vescent Photonics Inc., a privately held company in Golden, Colorado. Vescent’s innovative non-mechanical beam steering technology enables more robust integrated LIDAR systems that overcome many of the major drawbacks associated with today’s bulky mechanical offerings such as reliability, size, and cost. This acquisition strengthens ADI’s position as an automotive safety system technology partner for next generation ADAS and autonomous driving applications.
“From inertial MEMS sensors used in airbag and electronic stability control applications to 24 GHz and 77 GHz automotive RADAR, ADI solutions have helped save lives for over two decades,” said Chris Jacobs, general manager of Automotive Safety, Analog Devices. “And now, this innovative technology will play an important role in making LIDAR systems more compact, more robust, and an affordable feature in every new car worldwide.”
Today’s ADAS systems must rely on a suite of sensor technologies that include cameras, RADAR, and LIDAR to effectively provide advanced safety features such as forward collision warning, blind spot detection, pedestrian detection, and autonomous driving functions. Cameras are used widely for object recognition while RADAR uses radio-frequency electromagnetic waves to measure distance. LIDAR uses laser beams to measure the distance and can also recognize objects. Scanning LIDAR systems can be used to detect objects on or near the roadway and fill the blind spots known to exist when using RADAR & cameras.

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Analog Devices


http://www.analog.com/

Samsung Electronics to Acquire HARMAN, Accelerating Growth in Automotive and Connected Technologies

Monday, November 14th, 2016

Samsung Electronics and Harman International Industries, Inc. have entered into a definitive agreement under which Samsung will acquire HARMAN for $112.00 per share in cash, or total equity value of approximately $8.0 billion. Upon closing, the transaction will give Samsung a significant presence in the large and rapidly growing market for connected technologies, particularly automotive electronics, which has been a strategic priority for Samsung, and is expected to grow to more than $100 billion by 2025. HARMAN is a leader in connected car solutions, with more than 30 million vehicles currently equipped with its connected car and audio systems, including embedded infotainment, telematics, connected safety and security. Approximately 65% of HARMAN’s $7.0 billion of sales during the 12 months ended September 30, 2016 are automotive-related. Its order backlog for this market at June 30, 2016 was approximately $24 billion.

HARMAN’s experience designing and integrating sophisticated in-vehicle technologies will create significant growth opportunities for the combined business by enabling it to leverage Samsung’s expertise in connected mobility, semiconductors, user experience, displays and its global distribution channels.

“HARMAN perfectly complements Samsung in terms of technologies, products and solutions, and joining forces is a natural extension of the automotive strategy we have been pursuing for some time,” said Oh-Hyun Kwon, Vice Chairman and Chief Executive Officer of Samsung Electronics. “As a Tier 1 automotive supplier with deep customer relationships, strong brands, leading technology and a recognized portfolio of best-in-class products, HARMAN immediately establishes a strong foundation for Samsung to grow our automotive platform. Dinesh Paliwal is a proven global leader and, in our extensive discussions, we have developed deep respect for him, his strong senior leadership team and HARMAN’s talented employees.”

“The vehicle of tomorrow will be transformed by smart technology and connectivity in the same way that simple feature phones have become sophisticated smart devices over the past decade,” added Young Sohn, President and Chief Strategy Officer of Samsung Electronics. “We see substantial long-term growth opportunities in the auto technology market as demand for Samsung’s specialized electronic components and solutions continues to grow.”

Dinesh Paliwal, HARMAN Chairman, President and CEO, stated, “This compelling all-cash transaction will deliver significant and immediate value to our shareholders and provide new opportunities for our employees as part of a larger, more diversified company.”

Customer Benefits and Significant Growth Opportunities
Samsung expects the combination to deliver significant growth opportunities and benefits to customers by leveraging Samsung’s and HARMAN’s complementary technologies, resulting in increased market penetration across important end markets.

• Automotive: Combining HARMAN’s new connected car technologies, including its top positions in infotainment, cyber security, over-the-air updates and telematics, with Samsung’s experience in connectivity technologies, including 5G, UX/UI, display technology and security solutions, will enhance HARMAN’s automotive and connected services businesses to drive greater sales as automakers speed the adoption of next-generation connected cars.

• Audio: HARMAN’s leading brands and cutting-edge audio systems include JBL, Harman Kardon, Mark Levinson, AKG, Lexicon, Infinity, and Revel. The company also licenses Bowers & Wilkins and Bang & Olufsen brands for automotive.

• Professional: The combination will also expand the combined company’s business-to-business platform through its ability to deliver integrated, large-scale audio and visual professional solutions at stadiums, concert facilities and other performance centers such as The John F. Kennedy Center for the Performing Arts and STAPLES Center.

• Connected Services: Samsung will gain access to HARMAN’s 8,000 software designers and engineers who are unlocking the potential of the IoT market. This collaboration will deliver the next generation of cloud-based consumer and enterprise experiences, as well as end-to-end services for the automotive market through the convergence of design, data and devices.

Operating Structure and Leadership
Upon closing, HARMAN will operate as a standalone Samsung subsidiary, and continue to be led by Dinesh Paliwal and HARMAN’s current management team. Samsung’s Automotive Electronics Business Team, which was established in December of 2015 to identify opportunities for Samsung in the automotive sector, will work closely with the HARMAN management team to realize the full growth potential of the combination.

The transaction, which is subject to approval by HARMAN shareholders, regulatory approvals and other customary closing conditions, is expected to close in mid-2017.

World record: Infineon chip solves Rubik’s Cube in 637 milliseconds

Friday, November 11th, 2016

The Rubik’s Cube was solved in just 637 thousandths of a second: At the “electronica” trade fair, the machine “Sub1 Reloaded” pulled off the feat with the help of microchips from Infineon. The microcontroller AURIX™, one of the world’s most powerful minicomputers, also contributed to the record-breaking effort: It is one of the essential elements that enable autonomous driving. For the Rubik’s Cube, it achieved the best time in the approximately 30 years that have passed since the Hungarian Ernő Rubik invented the cube. It takes a human at least 4.9 seconds to solve the puzzle. That is the best time recorded for a so-called “speedcuber” listed in the Guinness World Records.

The six faces of the cube each have nine squares of a color that can be turned in opposing directions. The object is to rotate the faces until they have returned to the original position – without driving yourself crazy in the process. More than 43 quintillion combinations of the colored squares are possible. The same number of cubes could cover our planet in 275 layers of cubes. The Earth would then be covered with an approximately 20-meter-high layer of Rubik’s Cubes.

It takes tremendous computing power to solve such a highly complex puzzle with a machine. In the case of “Sub1 Reloaded”, the power for motor control was supplied by a microcontroller from Infineon’s AURIX™ family, similar to the one used in driver assistance systems. Minimal reaction times play an even greater role in autonomous driving. A high data-processing rate is necessary to ensure real-time capabilities with clock frequencies of 200 MHz. As a result of this ability, a vehicle can safely and reliably apply the brakes when it approaches a barrier.

The electronic version of senses, brain, and muscles

“Sub1 Reloaded” contains a number of other microchips. Like most devices we use every day, they link the real and digital worlds. The attempt started with the press of a button. The shutters of the sensor cameras were removed. The machine then detected the position of the elements. These had been previously scrambled, in accordance with the special requirements of the World Cube Association. The computing chip, or the “brain” of the machine, figured out the fastest solution and transmitted the necessary commands to the power semiconductors. These “muscles” then activated six motors, one for each side of the cube, at record speed and then brought them to a halt – all within the fraction of a second.

Every Rubik’s cube can be unscrambled with just 20 movements. A variety of algorithms can be used to solve the puzzle, the most well-known of which is the Fridrich Method. But Infineon’s constructor Albert Beer did not design his prodigy with the fewest moves in mind. Rather, he was intent on achieving the best time – he even allowed the “Sub1 Reloaded” a few extra moves to reach this goal.

Infineon at electronica 2016 (November 8–11, 2016, Munich, Germany)

The world is getting smarter and more connected by the day. At electronica 2016 Infineon presents exciting demos and product solutions that are making tomorrow’s cars, factories and homes smart, secure and energy-efficient. New products and demos can be discovered at booth 506 in hall A5. Further information about this fair’s highlights is available at www.infineon.com/electronica.


About Infineon

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2015 fiscal year (ending September 30), the company reported sales of about Euro 5.8 billion with some 35,400 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

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VALEO ACQUIRES A 50% STAKE IN CLOUDMADE

Thursday, November 10th, 2016

Valeo is acquiring a 50% stake in CloudMade, a developer of smart and innovative big data-driven automotive solutions such as a machine learning platform. The purpose is to improve and personalize vehicle comfort and safety for motorists and their passengers.

CloudMade is a pioneering start-up in machine learning and artificial intelligence, with a focus on designing applications for the car industry. Valeo’s investment in the company will provide it with the financial and technological resources it needs to fully achieve its development.

Valeo’s expertise in the technologies required to develop driving assistance applications (sensors, cameras and laser scanners) as well as connectivity, human-machine interface and thermal climate control solutions, combined with CloudMade’s command of big data processing, artificial intelligence and predictive engines, will allow CloudMade to provide its carmaker customers with solutions to continuously adapt driving assistance functions to the profile of each individual driver. This radically innovative product offering will enhance the user experience in terms of both intuitive driving and in-vehicle well-being.

Contact Information

VadaTech Inc.

198 N. Gibson Road
Henderson, NV, 89014
US

tele: 702.896.3337
fax: 702.896.0332
sales@vadatech.com
http://www.VadaTech.com

Renesas Electronics and ESCRYPT Collaborate on Hardware/Software Security Solution for Automotive ECUs

Wednesday, November 9th, 2016

Renesas Electronics Corp. and ESCRYPT GmbH, a system provider for embedded security, announced their collaboration on an integrated hardware and software platform solution that provides high-level security for protecting automotive electronic control units (ECUs).
The new joint hardware/software platform solution comprises Renesas’ RH850/P1x-C Series of automotive safety microcontrollers (MCUs) that combine on a single-chip: functional safety, security, and vehicle control network technologies, with ESCRYPT’s CycurHSM, a security software stack, to realize highly complex automotive security solutions.
The solution reduces development time and integrates security functions in safety-critical automotive ECU applications. Additionally, the solution serves as a stepping stone to achieve autonomous driving by accelerating the integration of safety and security functions.
In the autonomous-driving era, in-vehicle infotainment, vehicle-to-vehicle, and vehicle-to-infrastructure networks are expected to become mainstream. The connectivity between these networks allows systems to obtain information on road conditions and other factors that could impact the driving experience. It also requires robust security measures to ensure the systems are protected from unauthorized external access.
The RH850/P1x-C Series integrates a hardware security module with a co-processor supporting data encryption, authentication and random number generation to address these mission-critical security requirements in vehicle systems. CycurHSM is a security software stack that perfectly fits RH850/P1x-C MCUs and complements the security features in hardware with additional security services, e.g., secure boot, secure flashing, and debugging.
New use cases such as software updates Over The Air (OTA) or advanced driver assistance systems (ADAS) and the resulting in-vehicle communications require higher ECU protection levels against unauthorized or malicious access and manipulation. Therefore, in addition to protection through software, hardware security protection within the ECU has also become essential.

Contact Information

Renesas Technology America, Inc.

450 Holger Way
San Jose, CA, 95134
USA

tele: 408.382.7500
www.renesas.com

AEC-Q101 Qualified Surface Mount TVS Diodes from Littelfuse Safeguard Sensitive Automotive Electronics

Wednesday, November 9th, 2016

Provides a 7000W or 2200W peak pulse power dissipation rating in a surface mount SMTO-263 package and meets ISO7637-2 5a/5b protection and ISO16750 load dump test

Littelfuse_TVS_Diode_SLD8S_Hi_Res.jpg

Littelfuse, Inc., the global leader in circuit protection, today introduced a series of AEC-Q101 qualified TVS Diodes designed specifically to protect sensitive electronic equipment from voltage transients induced by load dump and other transient voltage events. The new products were announced at the company’s booth (Hall A6-Booth 153) during Electronica, the international trade fair for electronic components, systems and applications, held November 8-11, 2016, at the Munich Trade Fair Center.

SLD8S Series Automotive SMT Transient Voltage Suppression (TVS) Diodes offer a choice of 7000W (10/1000μs) or 2200W (load dump) peak pulse power dissipation ratings in a surface mount SMTO-263 package. These high peak pulse power dissipation ratings allow power systems to pass the ISO 7637-2 5a, 5b surge tests and meet the ISO 16750-2 load dump waveform standard, which are widely used in the automotive industry as the basis for transient specifications. Their surface mount package is ideal for automatic pick-and-place assembly and reflow processes.

SLD8S Series TVS Diodes are well suited for applications such as load dump protection and ESD protection in automotive electronics like transmission control units (TCUs), electronic control units (ECUs), body control modules (BCMs), battery management systems (BMSs), sensors, and entertainment systems, as well as in other long pulse applications that require high reliability.

“The SLD8S Series is ideal for automotive load dump protection and its surface mount design reduces manufacturing costs and allows for higher soldering quality than axial lead packages,” said Charlie Cai, global product marketing manager at Littelfuse. “Its SMTO-263 package design is footprint-compatible with popular solutions in DO-218AB packages, while offering a wider range of stand-off voltages, up to 57V, so it allows for easy replacement in new circuit designs.”

SLD8S Series Automotive TVS Diodes offer these key benefits:

  • Meets ISO7637-2 5a/5b protection and ISO16750 load dump test requirements, making them well suited for load dump protection.
  • Features an SMT package that is ideal for automatic pick and place assembly and reflow processes, which helps reduce manufacturing costs and allows for higher soldering quality than axial lead packages.
  • Ensures maximum performance in automotive and high reliability applications due to their AEC-Q101 qualified design and operating junction temperature (TJ) of up to 175°C.

Availability
The SLD8S Series (SMTO-263 package) is provided in tape and reel packaging in quantities of 500. Sample requests can be placed through authorized Littelfuse distributors worldwide. For a listing of Littelfuse distributors, please visit Littelfuse.com.

For More Information
Additional information is available on the SLD8S Series product page. For technical questions, please contact: Charlie Cai, global product marketing manager, CCai@littelfuse.com.


About Littelfuse
Founded in 1927, Littelfuse is the world leader in circuit protection with growing global platforms in power control and sensing. The company serves customers in the electronics, automotive and industrial markets with technologies including fuses, semiconductors, polymers, ceramics, relays and sensors. Littelfuse has over 10,000 employees in more than 40 locations throughout the Americas, Europe and Asia. For more information, please visit Littelfuse.com.

Contact Information

Littelfuse, Inc.

8755 West Higgins Road
Suite 500
Chicago, IL, 60631
USA

tele: 773-628-1000
fax: 773-628-1000
http://www.littelfuse.com/

Valens and Daimler partner to enable simultaneous transmissions of video & audio, USB, data, and power over a single, unshielded twisted-pair cable

Monday, November 7th, 2016

Valens and Daimler announced their collaboration to bring HDBaseT Automotive into cars in the near future.
At the forefront of in-vehicle connectivity today, Daimler has selected HDBaseT Automotive as the technology of choice to guarantee high performance of advanced infotainment, advanced driver assistance systems (ADAS), and telematics systems. Valens, as the inventor of HDBaseT and founder of the HDBaseT Alliance, brings the technology and expertise to accomplish the goal of commercializing HDBaseT-enabled vehicles in the near future.
“Valens has led the revolution in digital connectivity in the AV sector, and we are looking forward to repeating this success in the automotive market. Over the years, Daimler has led the market with the integration of innovative technologies to maximize the driving experience, and we are honored to be part of the efforts in optimizing in-vehicle connectivity,” said Dror Jerushalmi, CEO, Valens.
“One of Daimler’s strategic focus is to be a technological leader – in ‘green’ technologies, safety, autonomous driving and connectivity. HDBaseT Automotive is a perfect fit as its architectural benefits, reliability and robustness lead to a superior driving experience to our customers,” said Dr. Jan Bauer, Daimler.

HDBaseT Automotive enables the tunneling of high-speed video and audio, USB, data, and more, with native networking capabilities over a single unshielded twisted-pair (UTP) cable for up to 15m (50ft). HDBaseT Automotive also allows for daisy-chaining and multistreaming.

Infineon speeds up in-vehicle communication and makes it secure and reliable with CAN FD transceivers

Friday, November 4th, 2016

Around 60 electronic control units communicate with each other in vehicles today via the Controller Area Network (CAN). The need for in-vehicle communication is growing as the amount of networking increases and more comfort and automation are implemented. The new protocol variant CAN FD (CAN Flexible Data-rate) allows a higher data bandwidth and transmission speed. This saves time in programming, in tests and diagnostic routines as well as for software updates over the air (SOTA).

With its TLE925x CAN FD transceivers, Infineon Technologies makes data exchange up to 30 times faster than today. The TLE925x reaches transmission speeds of up to 5 Mbit/s. Compared to the classical CAN transceivers with a maximum of 8 byte, the CAN FD transceivers such as TLE925x can send a payload of up to 64 byte per message. This opens up the possibility to check the transmitted data for consistency in the transmitting control unit and to sign it with a 21-bit checksum instead of the 17-bit possible so far. Longer checksums ensure reliable communication between the control units. This makes it possible to better secure data transmission in the vehicle without the application software becoming more complex in the electronic control unit.

The TLE925x CAN FD transceivers are used, for example, in body control modules and gateways, in power steering, engine and transmission control units as well as in radar and camera-based driver assistance systems. On average, every vehicle today has 17 CAN transceivers. The number should rise to more than 20 within the next five years.

The TLE925x CAN FD transceivers permit an interface voltage to the microcontroller of 3.3 V as well as 5 V for best-possible signal symmetry. The more symmetrical the signals are, the better the electromagnetic compatibility (EMC) is. Compared to the previous CAN generation, Infineon has improved the robustness of the CAN FD transceivers to electromagnetic interference (EMI) in the standard frequency range of 1 MHz to 1 GHz.

The electromagnetic emission (EME) of the TLE925x between 150 kHz and 1 GHz is lower than in any other CAN transceiver available today. At the same time the CAN FD transceivers pass electrostatic discharge tests (ESD) of at least ±8 kV according to IEC61000-4-2.

Infineon offers a comprehensive portfolio of products for a wide variety of bus segments such as CAN FD, CAN with Partial Networking, High-Speed-CAN, LIN and FlexRay. For the protocol variant CAN FD with 5 Mbit/s, Infineon offers, apart from the TLE925x transceivers compliant to ISO11898-2:2016, the matching system basis chips in the TLE9278 Multi-CAN Power-SBC family. The TC3xx multicore microcontrollers in the AURIX family have up to 12 CAN FD channels according to ISO 11898-1:2015 and round off CAN FD portfolio of Infineon.

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