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Renesas, Toyota, and Denso Bring Autonomous-Driving Vehicles to Market Faster

Tuesday, October 31st, 2017

Toyota Selects Renesas’ R-Car SoC and RH850 MCU for its Model Year 2020 Autonomous-Driving Vehicles

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that its automotive technologies will drive Toyota Motor Corporation’s (TSE: 7203) autonomous vehicles, which are presently under development and scheduled for commercial launch in 2020. Selected by Toyota and Denso Corporation (TSE: 6902), Renesas’ autonomous-driving vehicle solution for Toyota’s autonomous vehicles combines the R-Car system-on-chip (SoC), which serves as an electronic brain for in-vehicle infotainment and advanced driver-assistance systems (ADAS), and the RH850 microcontroller (MCU) for automotive control. This combination delivers a comprehensive semiconductor solution that covers peripheral recognition, driving judgements, and body control.

 

 

As the leading global supplier of automotive processors (MCUs and SoCs, Note), Renesas offers highly-advanced technologies for use in increasingly critical areas for autonomous driving, such as security technology to protect against cyberattacks and functional safety technology to predict system failures. Production-ready autonomous-driving vehicles will require these capabilities as well as the expertise to match these technologies to actual use cases. Renesas has been committed to providing the perfect balance between advanced technologies and traditional automotive requirements, including performance and power consumption, optimal installation of electronic systems and considerations to the space available, and to implementing measures to protect against heat and environmental conditions.

Recognizing the depth of advanced automotive development technology and expertise that Renesas has demonstrated over the years, Toyota selected Renesas as the key semiconductor supplier for its “Highway Teammate,” an autonomous-driving prototype car designed to merge, pass, change lanes, and perform other actions during highway driving, under supervision. Production vehicles are planned for sale by 2020. The R-Car SoC has been selected for Denso’s engine control unit (ECU), which will be used for Toyota’s upcoming autonomous-driving vehicles. The R-Car SoC will function as the electronic brain for the autonomous-driving system, providing highly accurate intelligence on the vehicle’s position within its environment and making real-time decisions on vehicle control and active safety maneuvers based on sensor data. The RH850 was also selected to control driving, steering, and braking functions based on the judgements made by the R-Car SoC. The combination provides an excellent balance between performance and power consumption, and serves as a comprehensive autonomous-driving solution with high reliability, which had a decisive influence on the adoption by Toyota and Denso.

“To achieve a society where mobility means safety, efficiency and freedom, Toyota is constantly seeking out the latest technology and selecting systems incorporating the very best devices and materials,” said Ken Koibuchi, Executive General Manager at Toyota Motor Corporation. “We are partnering with Denso and Renesas, who bring superior technology and expertise to this project, with the aim to accelerate the development of autonomous-driving vehicles and encourage early adoption.”

“We are collaborating with Renesas to develop an ECU, the so-called electronic brain, for use in Toyota’s autonomous-driving vehicle,” said Hajime Kumabe, Executive Director at Denso Corporation. “We will maximize our sophisticated system design and software development capabilities by leveraging Renesas’ high-performance semiconductor devices to realize a highly reliable ECU system for autonomous-driving vehicles.”

“We are delighted that Toyota and Denso have selected Renesas’ high-performance automotive semiconductor devices for use in the autonomous-driving vehicle they are developing for commercial release,” said Ryuji Omura, Executive Vice President at Renesas Electronics Corporation. “Renesas introduced the Renesas autonomy™ Platform earlier this year as an open, innovative, and trusted platform for the autonomous driving era, to accelerate the development of self-driving vehicles for consumer adoption.”

Renesas is committed to strengthening its Renesas autonomy solutions for autonomous-driving vehicles and continues to advance technological developments that enable a safe and reliable driving experience. Renesas plans to contribute to making ADAS and autonomous-driving systems available for all types of vehicles, ranging from entry- to high-level models.

(Note) Source based on research by Strategic Analytics, 2017.

For more information about Renesas, follow Renesas Electronics America at @RenesasAmerica on Twitter and https://www.facebook.com/RenesasAmericas/.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live—securely and safely. The number one global supplier of microcontrollers, and a leader in Analog & Power and SoC products, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics (HE), Office Automation (OA) and Information Communication Technology (ICT) applications to help shape a limitless future. Learn more at renesas.com.

(Remarks) Renesas autonomy is a trademark of Renesas Electronics Corporation. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

Contact Information

Renesas Technology America, Inc.

450 Holger Way
San Jose, CA, 95134
USA

tele: 408.382.7500
www.renesas.com

Renesas Electronics Expands 3D Graphics Cluster Market to Entry-Class Cars with R-Car D3 System-on-Chip

Tuesday, October 31st, 2017

R-Car D3 Delivers High-Performance Graphic Capabilities and Significantly Reduced System Development Cost, and Enables Scalability from High-End to Entry-Class Vehicles

SANTA CLARA, Calif., October 31, 2017 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its high-performance R-Car D3 automotive infotainment system system-on-chip (SoC), designed to expand the use of 3D graphics instrument clusters (3D clusters) that support 3D graphics displays in
entry-class cars. The R-Car D3 achieves both high-performance graphic capabilities and contributes to significant reduction in overall system development cost.

The new SoC includes a high-performance 3D graphics core that enables a high-quality 3D display and lower system costs equivalent to the bill of materials (BOM) costs of developing with 2D graphics instrument clusters (2D clusters).

By adopting the R-Car D3, system developers can re-use their 3D graphics development assets, including software and graphics designs from high-end vehicles that adopt
high-performance R-Car H3 or R-Car M3 SoCs to entry-level cars. This scalability enables development of easy-to-use and high visibility entry cluster 3D graphics at approximately the same level cost as the existing 2D clusters. In addition, Renesas collaborates with
industry-leading partners in the instrument cluster field to further reduce development steps and costs.

“Full graphics cluster systems equipped with a large thin filter transistor panel are expected to become mainstream for future vehicles, which will require high-definition 3D graphics displaying at a high speed to accurately convey information to the driver,” said Toshiaki Ishibashi, Managing Officer, Engineering Headquarters, Nippon Seiki Co., Ltd. “We are excited that the R-Car D3 will respond to this need as well as reduce BOM costs.”

“For more than a decade, automotive OEMs and Tier 1s have relied on BlackBerry QNX® to deliver world-class software solutions for infotainment, telematics, and instrument cluster systems,” said Grant Tourville, senior director of product management at BlackBerry QNX. “The combination of the new R-Car D3 SoC and BlackBerry’s ISO 26262 ASIL B-certified QNX Platform for Instrument Clusters will enable our customers to confidently deliver state-of-the-art, safety-certified digital clusters rapidly to the market.”

“The safe and secure INTEGRITY® real-time operating system is widely used for automotive in-vehicle infotainment and instrument clusters in productions programs around the globe. Our support for the R-Car D3 builds on years of successful partnership with Renesas and their other R-Car devices, providing the customer with certified automotive safety, time-savings development tools, and optional virtualization for Linux,” said Matt Sager, Director of
Asia-Pacific Business Development at Green Hills Software. “We see this third-generation

R-C ar D3 as a valuable addition to the R-Car Family of SoCs, enabling customers to easily migrate and reuse existing R-Car and INTEGRITY software assets for faster time to market for their next-generation integrated cockpit designs.”

“For practical implementation of autonomous driving, the instrument cluster needs to instantly, accurately, and safely report a wide variety of information to the driver. The Renesas R-Car D3, which provides powerful graphics capabilities and critical functional safety features for instrument clusters, is expected to revolutionize the 3D cluster user experience,” said Lynwood Stanley, Vice President of Global Engineering Services at Altai. “Altai is using our Deep Screen code generator, which optimizes the HMI code, for the Renesas R-Car with the goal to deliver the highest-performance embedded HMIs to the market.”

“For instrument clusters based on large-scale LCD displays, the market is expected to grow rapidly in the future, and it would be a great benefit to the customer to be able to implement such instrument clusters at a low BOM cost,” said Rock Yang, Vice President at Thunder soft. “As one of the leading providers of UI/UE and OS technology, we at Thunder soft provide both software system integration and our HMI tool “Kanzi” for the R-Car including the new R-Car D3. We believe we can work with Renesas to drive the R-Car solutions market.”

The increasing number of connections between the instrument cluster and the various sensors and control devices allows more information about the vehicle and its surroundings to be captured and displayed on the instrument cluster. However, this increases the need for improved visibility from a safety point of view.

Currently, entry-class vehicles feature mostly 7- to 10-inch liquid crystal displays (LCDs) that support mainly 2D graphics. In the future, advancements in automotive LCDs size, resolution, and prices will support an anticipated explosive demand in 3D clusters to meet the growing need for clearer and highly visible designs on a large screen, particularly in the Chinese market.

In the meantime, system developers working with automotive instrument clusters must manage an increasing number of development steps and costs, as 3D clusters for entry-class cars are required to meet both the strict cost and high-performance as existing 2D clusters but with 3D graphics drawing requirements.

Renesas developed the R-Car D3 with these functions and performance capabilities in mind, offering developers a reliable, robust 3D clusters solution that is scalable from entry-level to high-end vehicles.

Key features of the R-Car D3

High-performance 3D graphics core that enables high-quality 3D display and lower system costs equivalent to that of 2D cluster development
The new SoC includes a 3D graphics core that enables high-performance
human-machine interface (HMI) and realizes significantly reduced system development cost equivalent to those of existing 2D cluster systems.

3D graphics core that enables high-performance HMI
Leveraging one of the latest graphics cores from Imagination Technologies, Inc, the Power VR® Series 8XE, the R-Car D3 achieves approximately six times improved

drawing performance compared to the existing 3D graphics R-Car D1 SoC.

This allows system developers to reuse content created for high-end cars in
entry-class cars, and system designers who had previously been concerned about hardware graphics performance limitations can now create graphics content without concern or limitations.

Reduced system costs by approximately 40 percent compared to existing Renesas devices (Note 1)
The R-Car D3 adopts the ball grid array (BGA) package, which simplifies the use of printed circuit boards (PCBs). This allows system developers to create 3D clusters using low-cost, four-layer PCBs, reducing the system BOM costs. The Renesas R-Car D3 reference boards, also use four-layer PCBs, and Renesas provides the design data as reference data for system developers to simplify the design of their own systems. In addition, since the new SoC achieves industry-leading level of low power consumption (Note 1), developers can configure a power supply circuit using a relatively inexpensive discrete power supply regulator. Since a cluster system can be configured with one DDR SDRAM, it is possible to reduce BOM cost by approximately 40 percent (Note 1) compared with 3D cluster systems that include the existing R-Car D1, realizing the total system development cost equivalent to the existing 2D cluster. The automatic memory calibration function (Note 2) of the DDR SDRAM, which is standard in R-Car SoCs, eliminates the need for timing adjustment of data transfer with the SRAM and memory evaluation man-hours requirements.

  • Robust partner ecosystem to streamline development steps
    Renesas works with several operating system (OS) manufacturers, HMI manufacturers, and system integrators who are leading the instrument cluster field. System developers can take advantage of a wide range of automotive solutions by working with the more than 200 Renesas R-Car Consortium partner companies to further reduce the number of development steps and cost for 3D graphics.

In addition, the R-Car D3 uses open GL ES 3.1 for 3D graphics drawing, which enables scalability with third-generation R-Car devices. Furthermore, the new SoC uses the same 2D graphics core as the RH850/D1M microcontroller (MCU) for 2D graphics applications. This assures that users will be able to reuse all their software assets and design content assets development from applications ranging from 2D clusters to high-end 3D clusters.

As part of the third-generation R-Car SoC Family, the R-Car D3 supports the ISO 26262 (ASIL-B) automotive functional safety standard, and provides a functional safety support
program for implementing safe driving support systems, contributing to the realization of a safe driving experience.

Availability
Samples of the R-Car D3 are available now. Mass production is scheduled to begin in September 2019 and is expected to reach a volume of 200,000 units per month in September 2020. (Availability is subject to change without notice.)

(Note 1) According to Renesas research.

(Note 2) A function that automatically adjusts the timing to solve the individual differences of

SoC, DDR SDRAM, and printed circuit board, which is essential for using DDR SDRAM.

For more information about Renesas, follow Renesas Electronics America at
@RenesasAmerica on Twitter and https://www.facebook.com/RenesasAmericas/.

About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live—securely and safely. A global leader in microcontrollers, analog, power, and SoC products and integrated platforms, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics, Office Automation and Information Communication Technology applications to help shape a limitless future. Learn more at renesas.com.

Contact Information

Renesas Technology America, Inc.

450 Holger Way
San Jose, CA, 95134
USA

tele: 408.382.7500
www.renesas.com

Renesas, Toyota, and Denso Bring Autonomous-Driving Vehicles to Market Faster

Tuesday, October 31st, 2017

Toyota Selects Renesas’ R-Car SoC and RH850 MCU for its Model Year 2020 Autonomous-Driving Vehicles

 

SANTA CLARA, Calif., October 31, 2017 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that its automotive technologies will drive Toyota Motor Corporation’s (TSE: 7203) autonomous vehicles, which are presently under development and scheduled for commercial launch in 2020. Selected by Toyota and Denso Corporation (TSE: 6902), Renesas’ autonomous-driving vehicle solution for Toyota’s autonomous vehicles combines the R-Car system-on-chip (SoC), which serves as an electronic brain for in-vehicle infotainment and advanced driver-assistance systems (ADAS), and the RH850 microcontroller (MCU) for automotive control. This combination delivers a comprehensive semiconductor solution that covers peripheral recognition, driving judgements, and body control.

 

As the leading global supplier of automotive processors (MCUs and SoCs, Note), Renesas offers highly-advanced technologies for use in increasingly critical areas for autonomous driving, such as security technology to protect against cyberattacks and functional safety technology to predict system failures. Production-ready autonomous-driving vehicles will require these capabilities as well as the expertise to match these technologies to actual use cases. Renesas has been committed to providing the perfect balance between advanced technologies and traditional automotive requirements, including performance and power consumption, optimal installation of electronic systems and considerations to the space available, and to implementing measures to protect against heat and environmental conditions.

Recognizing the depth of advanced automotive development technology and expertise that Renesas has demonstrated over the years, Toyota selected Renesas as the key semiconductor supplier for its “Highway Teammate”, an autonomous-driving prototype car designed to merge, pass, change lanes, and perform other actions during highway driving, under supervision. Production vehicles are planned for sale by 2020. The R-Car SoC has been selected for Denso’s engine control unit (ECU), which will be used for Toyota’s upcoming autonomous-driving vehicles. The R-Car SoC will function as the electronic brain for the autonomous-driving system, providing highly accurate intelligence on the vehicle’s position within its environment and making real-time decisions on vehicle control and active safety maneuvers based on sensor data. The RH850 was also selected to control driving, steering, and braking functions based on the judgements made by the R-Car SoC. The combination provides an excellent balance between performance and power consumption, and serves as a comprehensive autonomous-driving solution with high reliability, which had a decisive influence on the adoption by Toyota and Denso.

“To achieve a society where mobility means safety, efficiency and freedom, Toyota is constantly seeking out the latest technology and selecting systems incorporating the very best devices and materials,” said Ken Koibuchi, Executive General Manager at Toyota Motor Corporation. “We are partnering with Denso and Renesas, who bring superior technology and expertise to this project, with the aim to accelerate the development of autonomous-driving vehicles and encourage early adoption.”

“We are collaborating with Renesas to develop an ECU, the so-called electronic brain, for use in Toyota’s autonomous-driving vehicle,” said Hajime Kumabe, Executive Director at Denso Corporation. “We will maximize our sophisticated system design and software development capabilities by leveraging Renesas’ high-performance semiconductor devices to realize a highly reliable ECU system for autonomous-driving vehicles.”

“We are delighted that Toyota and Denso have selected Renesas’ high-performance automotive semiconductor devices for use in the autonomous-driving vehicle they are developing for commercial release,” said Ryuji Omura, Executive Vice President at Renesas Electronics Corporation. “Renesas introduced the Renesas autonomy™ Platform earlier this year as an open, innovative, and trusted platform for the autonomous driving era, to accelerate the development of self-driving vehicles for consumer adoption.”

Renesas is committed to strengthening its Renesas autonomy solutions for
autonomous-driving vehicles and continues to advance technological developments that enable a safe and reliable driving experience. Renesas plans to contribute to making ADAS and autonomous-driving systems available for all types of vehicles, ranging from entry- to high-level models.

(Note) Source based on research by Strategic Analytics, 2017.

For more information about Renesas, follow Renesas Electronics America at
@RenesasAmerica on Twitter and https://www.facebook.com/RenesasAmericas/.

About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live—securely and safely. The number one global supplier of microcontrollers, and a leader in Analog & Power and SoC products, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics (HE), Office Automation (OA) and Information Communication Technology (ICT) applications to help shape a limitless future. Learn more at renesas.com

Contact Information

Renesas Technology America, Inc.

450 Holger Way
San Jose, CA, 95134
USA

tele: 408.382.7500
www.renesas.com

Rear View Safety Introduces Optian 7 Driver Assist System with DVR

Monday, October 30th, 2017

Rear View Safety, an industry leader in the sales and distribution of vehicle safety solutions, including backup camera systems, backup sensor systems, driver fatigue systems, mobile DVR’s, and dash cameras, recently introduced the RVS-OP7 Optian 7 Driver Assist System with DVR. This two camera HD system features a 2.4″ QVGA TFT Panel and Advanced Driver Assistance Systems (ADAS).

The RVS-OP7 is the ultimate safety system. The uses Advanced Driver Assistance Systems (ADAS) to dramatically lower vehicular dangers including forward collision risk and lane departure risk. This state-of-the-art-technology warns of impending dangers, giving drivers more time to react. This system prevents collisions before they happen. The Optian 7 features multiple ADAS.

Headway Monitoring Warning (HMW): Informs driver how close they are (in seconds) to vehicle in front. This feature gives visual and audio alerts if distance becomes unsafe. Lane Departure Warning (LDW): LDW generates an audible warning if the vehicle departs from the driving lane while driving above the adjustable operating speed. Lane departure warning helps avoid lane departure accidents caused by drowsiness or carelessness on the road. Font Car Departure Alert (FCDA): This helpful feature informs the driver when a stopped vehicle in front of their own starts moving forward. It is only activated when the host vehicle is stationary and the front vehicle starts moving. This helps prevent fender benders. Pedestrian Detection (PD): This feature detects pedestrians around the vehicle and displays their location on the display screen.

The front camera of the Optian 7 Driver Assist System is equipped with a full HD 1920 x 1080 resolution, while the rear camera features a HD 1280 x 720 resolution. These cameras record in multiple modes and a built-in G sensor protects important features.

To find out more information about The RVS-OP7 Optian 7 Driver Assist System with DVR, or to learn more about wide range of safety solutions that Rear View Safety has released to market recently, please visit the organization’s official website at http://www.rearviewsafety.com today or call 800-764-1028.

Rear View Safety has long been a leader in vehicle safety solutions. The commercial backup camera provider is also available on Facebook, Twitter, LinkedIn, and maintains a Road Safety Resource site.

 

Synopsys Test Platform Tools Certified for the Most Stringent Level of Automotive Safety Measures Defined by the ISO 26262 Standard

Monday, October 30th, 2017

MOUNTAIN VIEW, Calif., Oct. 30, 2017 /PRNewswire/ —

Highlights:

  • All Synopsys test platform products can be confidently used for functionally safe automotive systems
  • Test platform tools, tool qualification report and IP certification accelerate ISO 26262 functional safety qualification for automotive ICs up to the most stringent safety requirements for ASIL D
  • Synopsys test platform offers all required components for advanced manufacturing test and in-system self-test for safety-critical automotive ICs

Synopsys, Inc. (NASDAQ: SNPS), today announced that its test platform tools for high-quality manufacturing test are completely certified for the ISO 26262 automotive functional safety standard. To achieve this, SGS-TÜV Saar GmbH, an independent accredited assessor, recently certified the tool qualification reports for the DFTMAX™, DFTMAX Ultra, and DFTMAX LogicBIST solutions. These certifications are in addition to previously certified Synopsys test products that include TetraMAX® II ATPG solution, DesignWare STAR Memory System® and STAR Hierarchical System. Certification provides designers the highest level of confidence in the use of Synopsys’ test solution for safety-critical automotive applications and accelerates functional safety qualification for automotive ICs, up to the stringent requirements for ASIL D.

Automakers are increasingly deploying complex electronic safety systems, or advanced driver-assistance systems, to monitor and control in-vehicle safety-critical functions. Since failures in these systems may lead to unacceptable consequences, automakers work with their suppliers to increase IC quality and reliability and to ensure the methods and tools used during design and maintenance processes are compliant with safety standards. The ISO 26262 standard outlines requirements that must be taken into consideration while developing a functionally safe automotive IC, including qualification requirements for design tools. SGS-TÜV Saar has certified Synopsys’ test platform tools, tool qualification reports, and IP for ASIL D, the highest level of functional safety requirements prescribed by the ISO 26262 standard.

“Reducing risk is critical to ensure functional safety for automotive electronic systems, such as advanced driver-assistance systems,” said Gudrun Neumann, head of functional safety software at SGS Group, SGS-TÜV Saar GmbH. “For safety-critical automotive applications, designer confidence in tools and IP rises when they satisfy the qualification requirements of the ISO 26262 automotive functional safety standard. We issued certificates to Synopsys test platform tools and tool qualification reports based on a successful evaluation against the requirements of ISO 26262.”

“Achieving functional safety is a growing challenge for automotive IC suppliers,” said Bijan Kiani, vice president of marketing in Synopsys’ Design Group. “We are committed to reducing the time and effort for our customers to meet this challenge. ISO 26262 certification of our test platform further reinforces our commitment to enable designers to efficiently meet their automotive IC’s functional safety requirements related to manufacturing test quality and in-system test.”

About the Synopsys Test Platform

The Synopsys test platform is comprised of DFTMAX Ultra, DFTMAX, TetraMAX and TetraMAX II technologies for power-aware logic test and physical diagnostics; DFTMAX LogicBIST for in-system self-test; SpyGlass® DFT ADV for testability analysis; the DesignWare® STAR Hierarchical System for automated hierarchical testing of analog/mixed-signal IP, digital logic blocks, memory and interface IP on an SoC; the DesignWare STAR Memory System® for embedded test, repair and diagnostics; and Yield Explorer design-centric yield analysis. Synopsys’ test solution combines Design Compiler® RTL synthesis with embedded test technology to optimize timing, power, area and congestion for test as well as functional logic, leading to faster time-to-results. The Synopsys test solution delivers tight integration across the Synopsys Design Platform, including Design Compiler synthesis, IC Compiler™ II place and route, and PrimeTime timing analysis, to enable faster turnaround time while meeting both design and test goals, higher defect coverage and faster yield ramp.

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.

Contact Information

Synopsys, Inc.

700 E. Middlefield Road
Mountain View, CA, 94043
USA

tele: 650.584.5000
www.synopsys.com

Smart thanks to Bosch: what connected trucks and clever homes have in common

Friday, October 27th, 2017

CES 2018 Innovation Awards for Bosch connectivity solutions

  • With the Common Telematics Platform, Bosch is connecting trucks worldwide
  • Connectivity module developed in association with Daimler Trucks and Fleetboard, where it is used as the Truck Data Center
  • Energy-saving acceleration sensor makes homes even smarter

Amsterdam, Netherlands – More convenience, more safety, and more possibilities: thanks to Bosch connectivity solutions, trucks, homes, and wearables are growing even smarter and more efficient, earning Bosch two CES 2018 Innovation Awards at CES Unveiled in Amsterdam on October 26, 2017. Every year, the prestigious award recognizes the best solutions ahead of the world’s largest electronics show and is an indicator of the trends of the future.

Making life easier by connecting truck drivers and logistics professionals
A tight schedule, high mileage, and constantly increasing traffic: every day, truck drivers and their vehicles have their work cut out for them. To help them master their task, drivers and trucking companies can count on support from Bosch. “The Common Telematics Platform is the foundation for new digital services for commercial vehicles that allow trucking companies to do a better job of planning their transports, making more efficient use of their fleets, and getting goods to their destinations more safely,” says Dr. Dirk Hoheisel, member of the Robert Bosch GmbH board of management. In recognition of its telematics solution for the cutting-edge connectivity of heavy commercial vehicles, Bosch received a CES 2018 Innovation Award in the category Tech For A Better World. The Common Telematics Platform was developed in association with Daimler Trucks and Fleetboard, and is used worldwide in the manufacturer’s heavy commercial vehicles as its Truck Data Center, where it acts as the foundation for new digital services such as Mercedes-Benz Uptime. The platform checks the technical status of trucks in real time and sends the information, allowing fleet managers to detect breakdowns before they happen, avoid unplanned repairs, and further optimize scheduled repair shop visits. This increases the reliability of transports and reduces costly truck downtime. In the future, Bosch’s Common Telematics Platform can enable over-the-air software updates. The wireless updates will keep vehicle systems up to date while saving drivers and fleet managers time by reducing the number of repair shop visits. They will also make it possible to install new and improved functions directly in trucks.

A tiny sensor makes houses even smarter
Extremely energy efficient, small, and powerful: these qualities have won the BMA400 acceleration sensor from Bosch Sensortec a CES 2018 Innovation Award in the category Embedded Technologies. The tiny sensor combines very low power consumption with high performance, thereby significantly extending the service life of batteries in devices. As a result, batteries need less frequent charging and replacement. The sensor also enables highly precise angle measurement and vibration recording, making the BMA400 particularly interesting for applications in the internet of things (IoT). In smart homes, the energy-saving acceleration sensor can recognize whether windows are open, tilted, or closed, for example, making it possible to set air conditioning or heating systems accordingly and save energy. When installed in doors and windows, the BMA400 detects motion and vibrations, helping deter burglaries. Thanks to smart energy management, the tiny sensor is also ideally suited for use in wearables.

About the CES Innovation Awards
The CES Innovation Awards are a program run by the Consumer Technology Association (CTA). Each year, the awards are presented in 28 categories. Bosch has already won awards in the past. In 2017, for example, Bosch was honored for a connected water heater and two innovative motorcycle solutions. In 2016, the technology company received recognition for neoSense, a touchscreen with haptic feedback.

EXPERIENCE BOSCH AT CES 2018 in Las Vegas, U.S:
The demand for safety, security, energy efficiency, and convenience in cities is growing. These are just a few of the challenges that are resulting from growing urbanization. The key to overcoming them is intelligently connected cities – known as smart cities. In many places, such cities are already a reality: Bosch has a multitude of solutions that are helping to make cities smarter and improve quality of life for their residents. At CES 2018, Bosch is showcasing an expanded portfolio of “Simply.Connected.” solutions for everything from urban mobility and the connected working world to intelligent homes and buildings.

PRESS CONFERENCE: Monday, Jan. 8, 2018, 8:00–8:45 a.m. (local time) with Dr. Markus Heyn, member of the board of management of Robert Bosch GmbH and Mike Mansuetti, president of Bosch North America, at Mandalay Bay Hotel, Las Vegas Convention Center, Mandalay Bay Ballrooms BCD.
BOSCH BOOTH: Tuesday to Friday, Jan. 9–12, 2018, in the Central Hall, booth #14028
• FOLLOW the Bosch CES 2018 highlights on Twitter: #BoschCES
PANELS WITH BOSCH EXPERTS: More information to come – stay tuned!

Press photos: #452274, #1257451, #1257453, #1257454

Additional information:
Video on vehicle connectivity

Contact person for press inquiries:
Annett Fischer, phone: +49 711 811-6286

Mobility Solutions is the largest Bosch Group business sector. In 2016, its sales came to 43.9 billion euros, or 60 percent of total group sales. This makes the Bosch Group one of the leading automotive suppliers. The Mobility Solutions business sector combines the group’s expertise in three mobility domains – automation, electrification, and connectivity – and offers its customers integrated mobility solutions. Its main areas of activity are injection technology and powertrain peripherals for internal-combustion engines, diverse solutions for powertrain electrification, vehicle safety systems, driver-assistance and automated functions, technology for user-friendly infotainment as well as vehicle-to-vehicle and vehicle-to-infrastructure communication, repair-shop concepts, and technology and services for the automotive aftermarket. Bosch is synonymous with important automotive innovations, such as electronic engine management, the ESP anti-skid system, and common-rail diesel technology.

The Bosch Group is a leading global supplier of technology and services. It employs roughly 390,000 associates worldwide (as of December 31, 2016). The company generated sales of 73.1 billion euros in 2016. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT company, Bosch offers innovative solutions for smart homes, smart cities, connected mobility, and connected manufacturing. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to deliver innovations for a connected life. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiaries and regional companies in some 60 countries. Including sales and service partners, Bosch’s global manufacturing and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 120 locations across the globe, Bosch employs some 59,000 associates in research and development.

Additional information is available online at www.bosch.com, iot.bosch.com, www.bosch-press.com, www.twitter.com/BoschPresse.

Contact Information

Software Radio Reconfiguration enables upgrades to in-vehicle and IoT radio systems

Thursday, October 26th, 2017

Sophia Antipolis, 26 October 2017: Most new cars sold today offer connectivity as a feature, whether standard or optional. Customers expect their navigation systems to be connected, to download real time traffic information and map updates. Vehicle manufacturers increasingly provide remote diagnostics and vehicle software updates. And yet a fundamental problem remains: today these vehicles use 2G, 3G or 4G mobile networks to connect, while long before the end of their useful lives, 5G networks will be more common. The complete lifecycle of a vehicle is significantly longer than that of a mobile device, and completely out of step.

ETSI’s Technical Committee for Reconfigurable Radio Systems has developed a system which can help solve this and similar issues. ETSI’s Software Radio Reconfiguration model provides a modular and scalable solution to the challenge of deploying and using software radio systems. The solution, described in a recent ETSI white paper and in the EN 303 146 series of European Standards, allows a gradual and
stepwise deployment of software reconfigurable radio. This enables device manufacturers to gradually implement software reconfigurable radios, developing confidence at each step of the way.

The ETSI Software Radio Reconfiguration model provides solutions to the following
issues which all software radio systems must address:

How to transfer and install radio software components in a secure way

  • How to provide access to new software components to a user/operator
  • How to deal with device certification and type approval when new radio software
    components can modify the radio behaviour of a device
  • How to provide software portability and achieve efficient radio performance
  • How to gradually evolve a system towards software reconfigurability

With the use of software reconfigurable radio, the radio system on board a vehicle
can evolve and improve over time, with new software upgrades. Software
reconfigurable radios will also help in other situations. For example, security
concerns may require the upgrade and patching of radio systems deployed in the
field. Yet manual intervention would be costly in the case of vehicles, or even
impossible in the case of inaccessible IoT devices.

An overview of the ETSI model and the solutions and functionality it offers is
provided in the recent ETSI White Paper “Software Radio Reconfiguration: A
highly efficient and modular software reconfiguration approach for mobile
devices”, available from the ETSI website. ETSI will also host a webinar on
this subject, on 8 December 2017. Registration is open on the ETSI webinar channel.

About ETSI
ETSI produces globally-applicable standards for Information and Communications
Technologies (ICT), including fixed, mobile, radio, aeronautical, broadcast and
internet technologies and is officially recognized by the European Union as a
European Standards Organization. ETSI is an independent, not-for-profit association
whose over 800 member companies and organizations, drawn from 68 countries,
determine its work programme and participate directly in its work.

Contact Information

ETSI

650, Route des Lucioles
Sophia Antipolis
Valbonne, 06560
France

tele: +33 (0)4 92 94 42 00
fax: +33 (0)4 92 94 42 00
info@etsi.org
http://etsi.org

Renesas Electronics and ASTC Accelerate Software Development for Smart Cameras with Virtual Platform for R-Car V3M

Tuesday, October 24th, 2017

PC-Based VLAB/IMP-TASimulator Contributes to a Significant Reduction in Development Time and Improvement in Software Quality

SANTA CLARA, Calif., October 24, 2017 – Renesas Electronics Corporation (TSE: 6723, Renesas), a premier supplier of advanced semiconductor solutions, Australian Semiconductor Technology Company Pty Ltd (ASTC), and VLAB Works, a subsidiary of ASTC, today announced a joint development of the VLAB/IMP-TASimulator virtual platform (VP) for Renesas’ R-Car V3M, an automotive system-on-chip (SoC) for advanced driving assistance systems (ADAS) and in-vehicle infotainment systems. The VP simulates image recognition and cognitive intellectual properties (IPs) in the R-Car V3M SoC and realizes embedded software development using a PC only, which enables the VP to shorten development time as well as improve software quality. The VLAB/IMP-TASimulator is one of the latest software development tools for the Renesas R-Car V3M and is part of Renesas autonomyTM concept, which was announced in April 2017.

“Our goal is to provide a comprehensive, unified, and easy-to-use software development environment to all automotive system developers using R-Car SoCs,” said Jean-Francois Chouteau, Vice President, Global ADAS Center, Renesas Electronics Corporation. “The VLAB technology from ASTC is an important building block to speed up the development of ADAS software on the Renesas autonomy Platform.”

“We have a longstanding relationship with Renesas and are pleased to collaborate on their Renesas autonomy Platform to further accelerate software development for ADAS and automated driving,” said Hiroshi Yoshizawa, Australian Semiconductor Technology Company K.K. Vice President. “We have worked with Renesas on applying VLAB technology to model the R-Car V3M architecture, function, and timing, enabling R-Car V3M customers to bring new ADAS applications to market quickly with high quality and strong reliability.”

In ADAS and automated driving systems, algorithm development, including object detection and recognition to estimate the position of the vehicle, has become more complex and larger scaled, and algorithm development by PC has become the standard. However, it is difficult to port PC-developed algorithms to embedded software that deeply depends on hardware architecture. This makes it essential to have a development environment that enables a smooth transition or integration between the algorithm development phase and the embedded software development phase.

To address this need, Renesas and ASTC have jointly developed the VLAB/IMP-TASimulator VP, which enables embedded software development for the R-Car V3M using the PC only. ASTC’s core technology, VLAB, simulates target hardware on the PC to enable system developers to develop embedded software only with a PC, eliminating the use of actual hardware. This enables system developers to check and control the hardware on a virtual environment displayed on the PC. In addition, the VP can efficiently detect defects in the developed software. By using the VLAB/IMP-TASimulator, system developers can develop high-quality software in less than half the development time.

Key features of the VLAB/IMP-TASimulator

Ÿ Significant reduction in software development period by reproducing R-Car V3M’s IMP-X5 image recognition engine on PC
The new VP reproduces the IMP-X5’s built-in 64 thread MIMD processor on the PC, which enables debugging such as step execution, break, and variable reference of software written in C language dedicated to multithreaded programming. This reduces the software development period dramatically compared to when not using this virtual environment.

Ÿ ASTC’s timing-correlated simulation technology enables an accurate estimation of the hardware processing time
The new VP includes a timing-correlated simulator that accurately grasps and reflects the hardware key timing and efficiently simulates the IMP-X5 by modeling the complicated timing behaviour of the cache, bus, processor and other major components. This allows system developers to estimate the hardware processing time at least 100 times faster than the currently used cycle-based simulator.

Availability

The VLAB/IMP-TASimulator VP will be available from Q1 2018 from ASTC and VLAB Works. www.vlabworks.com.

For more information on Renesas, follow Renesas Electronics America at @RenesasAmerica on Twitter and http://www.facebook.com/RenesasAmerica.

Contact Information

Renesas Technology America, Inc.

450 Holger Way
San Jose, CA, 95134
USA

tele: 408.382.7500
www.renesas.com

Keysight Technologies Launches Industry-First Automotive Ethernet Solutions for Standards-Compliance of BroadR-Reach,100Base-T, 1000Base-T Devices

Tuesday, October 24th, 2017

New automotive Ethernet solutions enable quick and easy testing across entire signal path

Highlights:
· Industry-first protocol triggering and decode for BroadR-Reach and 100Base-T1

· Complete transmit compliance testing for BroadR-Reach,100Base-T1 and 1000Base-T1

· Industry-first 100 percent test coverage for link segment tests using BroadR-Reach and100Base-T1 definitions

· Industry-first bit error rate verification for comparing receiver tests to the BroadR-Reach and 100Base-T1 standards

· Automotive Ethernet solution for end-to-end functional and standards-compliance conformance testing of BroadR-Reach/100Base-T1 devices

· Complete bundled solution orderable under a single part number

SANTA ROSA, Calif., Oct. 24, 2017 – Keysight Technologies, Inc. (NYSE: KEYS) today unveiled a total of five new automotive Ethernet solutions at the Automotive Testing Expo 2017, Suburban Collection Showplace, Booth 2008, Novi, Michigan, Oct. 24-26. These solutions help automotive design and test engineers bring their products to market faster with easy-to-use conformance testing.

Among the innovations unveiled publicly for the first time is the suite of BroadR-Reach, 100Base-T1 and 1000Base-T1 compatible automotive Ethernet bundles—providing automated set-up and testing for Tx, link segment and Rx connectivity and protocol decoding.

Automotive Ethernet is increasingly more important as a backbone to a car’s communication network. Safety standards and increased consumer communication demands require the automotive industry to add more applications with ever-increasing complexity for connectivity to networks. Faster data transfer times and more reliable networks demand that the backplane be lighter, faster and more robust than before. Car manufacturers, OEMs and chipset vendors in the automotive industry are looking to automotive Ethernet as a replacement for the aging media oriented systems transport (MOST) bus.

Keysight’s solutions simplify the test setup and interpretation of results to validate BroadR-Reach, 100Base-T1 and 1000Base-T1 specifications for physical media attachment (PMA), physical layer solutions (PHY), and physical coding sublayer (PCS). With four different software options, Keysight offers the most comprehensive automotive Ethernet compliance solutions on the market today. All the software options automate compliance with 100 percent test coverage for all tests in the automotive physical layer BroadR-Reach,100Base-T1 and 1000Base-T1 specifications respectively.

These automotive Ethernet test software packages automatically execute tests and display the results in a flexible report format. In addition to the measurement data, the report provides a margin analysis that shows how closely the devices passed or failed each test. The automotive Ethernet electrical compliance solutions perform a complete set of electrical tests to meet the BroadR-Reach, 100Base-T1and/or 1000Base-T1 specifications:

· Transceiver testing for BroadR-Reach V3.2 and 100Base-T1 and (IEEE 802.3bw) specifications

· Receiver testing for BroadR-Reach V3.2 and 100Base-T1 (IEEE 802.3bw) specifications

· Transceiver testing for 1000Base-T1 (IEEE 802.3bp)

· Protocol Trigger & Decode for BroadR-Reach V3.2 and 100Base-T1 (IEEE 802.3bw) specifications

· Link testing for BroadR-Reach V3.2 and 100Base-T1 (IEEE 802.3bw) specifications

“At Keysight, we recognize that it is critical to address the growing market demands within the Automotive market,” said Siegfried Gross, vice president and general manager of Keysight’s Automotive and Energy Solutions business unit. “These new solutions represent yet another way that Keysight is supporting the evolution and standardization of technologies for our automotive customers. With our latest solution release, we have given designers, R&D and test engineers the critical tools and capabilities they need to release products according to the required Automotive Ethernet specifications.”

Additional Information

More information about Keysight’s automotive Ethernet solutions is available at www.keysight.com/find/Automotive-Ethernet. Images of the new Keysight automotive Ethernet solutions are available at www.keysight.com/find/automotive-ethernet-images.

About Keysight in Automotive

The development of the intelligent and connected car depends on up-to-date tools that let designers easily explore new signals, scenarios and topologies. Keysight’s automotive solutions are ready to enable deeper insights as development evolves with the standards. In design and test, Keysight is helping industry leaders innovate across new and existing technologies as they transform ideas into reality. Additional information about Keysight’s automotive design, test and measurement solutions is available at www.keysight.com/find/automotive.

About Keysight Technologies

Keysight Technologies, Inc. (NYSE: KEYS) is a leading technology company that helps its engineering, enterprise and service provider customers optimize networks and bring electronic products to market faster and at a lower cost. Keysight’s solutions go where the electronic signal goes, from design simulation, to prototype validation, to manufacturing test, to optimization in networks and cloud environments. Customers span the worldwide communications ecosystem, aerospace and defense, automotive, energy, semiconductor and general electronics end markets. Keysight generated revenues of $2.9B in fiscal year 2016. In April 2017, Keysight acquired Ixia, a leader in network test, visibility, and security. More information is available at www.keysight.com.

Contact Information

Keysight


toll-free: +1 800 829-4444
usa_orders@keysight.com
http://www.keysight.com/

For the Autonomous Driving Era: Toyoda Gosei Develops First Steering Wheel with Grip Sensor in Japan

Monday, October 23rd, 2017

New Anechoic Chamber Also Installed to Enhance Development of Electronic Products

KIYOSU, Japan–(BUSINESS WIRE)–Toyoda Gosei Co., Ltd. has developed Japan’s first steering wheel with a grip sensor, which is compatible with today’s advanced driver assistance systems (ADAS). The company has also installed a new anechoic chamber at its Miwa Technical Center to develop high value-added modules that can be used with future autonomous driving technologies.

1. Steering wheel with grip sensor

Toyoda Gosei jointly developed this new steering wheel with Toyota Motor Corporation. These steering wheels can detect whether the driver is gripping the steering wheel, and will be used on the new Lexus LS.

Vehicles equipped with ADAS have automatic brakes, devices to keep vehicles in their driving lane and other advanced functions, but the steering wheel must still be gripped by the driver for emergency operation. The newly developed steering wheel has sensors embedded in the wheel that can detect the driver’s grip with a high level of precision.*

These steering wheels also have heaters to warm the steering wheel during winter. Normally this would require both a heating element and a sensing element. With design modifications, Toyoda Gosei succeeded for the first time in combining the two elements. This provides the sensor function with no loss to heating performance and contributes to lighter weight.

As autonomous driving systems will increasingly assist drivers in vehicle operation, Toyoda Gosei aims to integrate various functions in the steering wheel, a key point of driver-vehicle contact, or the human machine interface (HMI). The newly developed steering wheel with grip sensor exemplifies the company’s effort to provide functions that correspond to the current driving assistance systems.

*The vehicle determines whether the driver’s hands are on the steering wheel or not, and sends a signal.

2. Anechoic chamber

Toyoda Gosei has recently installed an anechoic chamber to strengthen product development that combines electronic components with its core technologies centered on the field of rubber and plastics. Anechoic chambers block electromagnetic waves from the outside and suppress reflection of electromagnetic waves on the inside, so that the frequency range and strength of electromagnetic waves emitted from a product can be accurately measured.

The Company has long provided a large number of parts for the cockpit area and area around the front grille. With advances in autonomous driving, these areas are expected to confer various functions that create more comfortable interior spaces, and to be equipped with greater numbers of sensors that detect surrounding conditions.

With the increasing number of electronic components used in autonomous driving, it will become more and more important to prevent interference between these electromagnetic waves. The new anechoic chamber is a state-of-the-art facility that can simultaneously measure electromagnetic waves with a wide range of properties emitted from various directions from multiple products, improving the reliability of products equipped with many electronic components.

Using this anechoic chamber, Toyoda Gosei will develop module products that incorporate electronic components and give high added value to customers.

About Toyoda Gosei

Established in 1949 and headquartered in Kiyosu, Aichi Prefecture, Japan, Toyoda Gosei is a leading specialty manufacturer of rubber and plastic automotive parts and LEDs. Today, the Toyoda Gosei Group provides a variety of high-quality products internationally, with a network of approximately 100 plants and offices in 18 countries and regions. Through its flexible, integrated global supply system and leading-edge technologies for automotive safety, comfort, and environmental preservation, Toyoda Gosei is a global supplier that aims to deliver the highest levels of quality, innovation, and satisfaction to customers worldwide.

Contact Information

Toyoda Gosei Co., Ltd.


http://www.toyoda-gosei.com/

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