Archive for May, 2018

VIA Unveils Edge AI System Line for Automotive, Enterprise IoT, and Smart City Applications

Thursday, May 31st, 2018

Developing world’s fastest Neural Network Inference Engine to accelerate native deep learning inference applications in next-generation Edge AI devices

VIA Technologies, Inc., today showcased its family of high-performance Edge AI systems for the Automotive, Enterprise IoT, and Smart City segments
at its global headquarters and highlighted its core facial and object recognition, 360-degree surround view, and ADAS (Advanced Driver Assistance System) technology platforms that are accelerating the development and deployment of groundbreaking real-world applications by customers in world markets.

“Edge AI systems that can see, hear, understand, and respond to their surrounding environment in real-time without having to rely on connections to the cloud provide the key to boosting innovation and creating engaging new customer services and experiences in industries as diverse as transportation, retail, entertainment, and medical,” commented Epan Wu, General Manager of the VIA Embedded Division. “With their scalable, high-performance designs, VIA Edge AI Systems will unlock the unlimited potential of artificial intelligence for transforming the world we live in.”

VIA Edge AI systems are powered by best-of-breed SoC platforms, including the Qualcomm® Snapdragon™ 820E Embedded Platform and NVIDIA Jetson TX2 module, and deliver the optimum blend of compute, graphics, and connectivity for the target AI application scenarios. System functionality and performance can be further optimized with the integration of VIA Smart Facial Recognition, VIA Mobile 360 ADAS, and VIA Mobile360 Surround View Computer Vision technology platforms that enable a diverse array of intelligent video AI applications including:

  • Emotion, age and gender detection and people counting and tracking for security, surveillance, and customer engagement applications
  • Real-time 360° in-vehicle monitoring and recording for up to six individual HD camera streams for tracking driver behavior and boosting awareness of road conditions
  • Lane Departure Warning, Forward Collision Warning, Blind Spot Detection, Pedestrian Detection, Vehicle Detection, Speed Limit Detection, and Rear-end Collision Avoidance for enhancing vehicle safety

To enable the integration of native deep neural network processing capabilities in next-generation Edge AI servers, systems, and devices, VIA has initiated the development of the world’s fastest Neural Network Inferencing Engine. In addition to support for 8b & 16b quantized-integer inference compatible with Google’s 8b TensorFlow Lite, this high-performance engine also features 16MB SRAM internal memory, 16 TB/s internal bandwidth, and 16 TOP/s plus a host of architectural optimizations for real-world AI applications.

“The VIA Neural Network Inferencing Engine promises to provide the most powerful solution for accelerating deep learning inference applications like image recognition, speech recognition, and natural language processing,” concluded Wu. “With its unmatched performance, it will drive the emergence of new generation of Edge AI devices that will inspire a wave innovative new applications and services that will transform the world we live in.”

For images related to this release, please visit: https://www.viagallery.com

 

About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for AI, IoT, computer vision, autonomous vehicle, healthcare, and smart city applications. Headquartered in Taipei, Taiwan, VIA’s global network links the high-tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names.

Contact Information

VIA Labs, Inc.

7F., No. 529-1, Zhongzhung Rd, Xindian Dist.,
New Taipei City, 23148
Taiwan

tele: 886-2-2218-1838
fax: 886-2-2218-1838
sales@via-labs.com.tw
http://www.via-labs.com/en/index.jsp

Crystal Group Demonstrates Proven Autonomous Driving System in Michigan and Germany June 5 – 7

Thursday, May 31st, 2018

TU-Automotive Detroit, Michigan USA, booth #C240
Autonomous Vehicle Technology World Expo Stuttgart, Germany, booth #AV5015

 

Hiawatha, Iowa, May 31, 2018 – Crystal Group Inc., a leading designer/manufacturer of rugged computer and electronic hardware, brings its field-tested and customer-proven autonomous driving computers to two simultaneous exhibitions: TU-Automotive Detroit in Novi, Michigan from June 5 – 7 at the Suburban Collection Showplace, and at Autonomous Vehicle Technology World in Messe Stuttgart, Germany from June 5 – 7 at Messepiazza 1.

Many of the world’s leading automotive manufacturers and top technology firms have already partnered with Crystal Group to tap the company’s thirty- year expertise in developing rugged and reliable systems deployed in over 500 U.S.A. and Allied defense programs and hundreds of industrial and commercial applications worldwide. For the past two years Intel® and global OEM’s have chosen Crystal Group solutions for their autonomous vehicles (AV) and automated driving systems (ADS). To date, Crystal Group has successfully passed numerous in-vehicle crash safety tests.

“Self-driving vehicles require rugged computer platforms that can fuse tremendous amounts of sensor data and proper driving response, all while operating in extreme environments of vibration, temperature, humidity, and shock,” said Jim Shaw Crystal Group’s executive vice president of engineering. “Our new RACE0161 Autonomous Driving Computer, specifically designed for challenging autonomous automotive requirements, allows developers to reduce time to market and more importantly, improve vehicle and passenger safety.”

Simultaneously at Autonomous Vehicle Technology World and TU-Automotive Detroit, Crystal Group experts will be exhibiting its latest servers, embedded computers, and network switches technology for autonomous system applications including:

The new Crystal Group RACE™ line is engineered to accelerate time to deployment of autonomous vehicle (AV), automated driving system (ADS) projects. Crystal Group’s turnkey RACE0161 solution provides the horsepower autonomous systems need, combining robust I/O, multiple GPU capacity, dual Intel® Xeon® Scalable Processors, sophisticated thermal management, and other high-quality components stabilized in a rugged, aluminum enclosure measuring 6.5 x 14.1 x 15.6 inches and weighing 30-40 lb.

Crystal Group’s new AV computer, RACE0161, is built for safety and reliability, tapping over 30 years of experience tailoring high-performance, fail-safe rugged hardware for hundreds of military and aerospace missions, as well as challenging industrial, critical infrastructure, and commercial programs, including some of the most advanced autonomous vehicles.

Crystal Group Inc., a technology leader in rugged computer hardware, specializes in the design and manufacture of custom and commercial rugged servers, embedded computing, networking devices, displays, power supplies, and data storage for high reliability in harsh environments. An employee-owned small business founded in 1987, Crystal Group provides the defense, government and industrial markets with in-house customization, engineering, integration, configuration management, product lifecycle planning, warranty, and support services.

Crystal Group products meet or exceed IEEE, IEC, and military standards (MIL-STD-810, 167-1, 461, MIL-S-901); are backed by warranty (5+ year) with in-house support; and are manufactured in the company’s Hiawatha, Iowa, USA, facility certified to AS9100C:2009 and ISO 9001:2008 quality management standards.

Contact Information

Crystal Group Inc.


Hiawatha, IA,

https://www.crystalrugged.com/

Maxim’s Compact Synchronous Buck Converters Provide Industry’s Lowest EMI Performance for Automotive Infotainment and ADAS Applications

Wednesday, May 23rd, 2018

Automotive designers can significantly lower EMI and increase efficiency with the pin-compatible MAX20073 and MAX20074 buck converters from Maxim Integrated Products, Inc. (NASDAQ:MXIM). The compact converters, which offer the industry’s lowest EMI performance for low-voltage point-of-load applications, are ideal for automotive infotainment and ADAS applications.

Automotive designers are tasked with adding more features to modern, high-end cars, while using a highly efficient, compact solution that meets or exceeds EMI requirements. However, as more automotive features are added, the number of power rails continue to increase as well. Each individual power rail is powered from the car battery through a front-end buck converter and often require specific voltage regulation precision requirements. On top of all those challenges, designers need to meet stringent safety standards in the industry.

The MAX20073/MAX20074 features higher efficiency than competitive solutions and offer the lowest EMI in the industry, reducing interference that can impact the function of sub-systems in a small solution size with ultra-low quiescent current. Combined with Maxim’s unique spread spectrum oscillator, SYNC IN functionality, forced PWM, skip modes and current-mode architecture, the system quality and performance dramatically improves, easing overall system designs. Additionally, backend point-of-load (POL) buck converters, such as the MAX20073/MAX20074, send very specific voltages to the many power rails that come with adding advanced modern features. Its output voltage accuracy makes it ideal for applications that have these tight processor and memory voltage requirements. The ICs also adhere to tight safety standards, operate with low-input voltages across a wide range of temperatures, and minimize radio frequency interference (RFI) while exhibiting high accuracy, high efficiency, and high reliability.

Key Advantages

  • Lowest EMI: Unique spread-spectrum and SYNC IN features mitigate the system EMI radiation, easing the effort for designers to meet EMI specifications
  • Higher Efficiency: Exhibits superior efficiency across the entire operating range for best-in-class efficiency compared to competitive solutions
  • Small Solution Size: Its small 3mm x 3mm 10-pin TDFN-EP package reduces overall system footprint, while saving system BOM cost
  • Output Voltage Accuracy: Output voltage can be pre-set at the factory to allow ±1.5 percent output-voltage accuracy without the need for expensive 0.1 percent external resistors

Commentary

  • “Designers need buck converters that meet today’s increasingly stringent requirements such as small solution size, specific voltage regulation precision, and higher efficiency,” said Warren Tsai, Director of Business Management for the Automotive Business Unit at Maxim Integrated. “The MAX20073 and MAX20074, newest members of the updated family of low-voltage, small POL buck converters meet all their system’s power requirements and pass EMI prerequisites.”

Availability and Pricing

  • The MAX20073 is available for $1.20 and MAX20074 is available for $1.30; Both are available at Maxim’s website
  • Operates over the -40-degree Celsius to +125-degree Celsius ambient temperature range
  • MAX20073EVKIT# and MAX20074EVKIT# evaluation kits are available for $45
  • Designers are recommended to contact Maxim for pin-compatible ASIL variants

About Maxim Integrated
Maxim Integrated develops innovative analog and mixed-signal products and technologies to make systems smaller and smarter, with enhanced security and increased energy efficiency. We are empowering design innovation for our automotive, industrial, healthcare, mobile consumer, and cloud data center customers to deliver industry-leading solutions that help change the world. Learn more at https://www.maximintegrated.com.

Contact Information

Maxim Integrated


http://www.maxim-ic.com/

Safer roads with self-driving cars?

Wednesday, May 23rd, 2018

New report examines impact of automated vehicles on road safety and cyber-security vulnerabilities

Paris/Leipzig, 23 May 2018 | Automated vehicles promise more safety by eliminating crashes linked to human error. But claims that self-driving cars could avoid 90% of road deaths by eliminating these errors are untested, says a new report by the International Transport Forum.

Shared responsibility between robot and human drivers can in fact lead to more complex driving decisions. The unintended consequences might make driving less safe, not more. In situations where humans take over control from robots, more crashes might occur among “average” drivers who normally do not take risks.

Humans retain an advantage

Full automation may reduce the number of severe crashes significantly. Yet with partially automated systems, humans retain an advantage in many contexts. Overcoming this gap requires multiple sensors and connectivity with infrastructure.

Such fully automated and connected cars are vulnerable to cybersecurity risks, however. “The avoidance of crashes should never depend on access to shared external communication channels alone”, the report warns.

It recommends designing automated vehicles so that safety-critical systems are functionally independent and cannot fail in case of connectivity issues.

Safe System approach

Automation makes it more urgent to adopt a Safe System approach to road transport. A Safe System organises all elements of road traffic in a way that when one safety mechanism fails, another steps in to prevent a crash, or at least serious injury. Applying this approach to automated driving means the traffic system will account for machine errors.

The report cautions against using safety performance to market competing automated vehicles. “The relative safety level of vehicles … should not be a competition issue. The regulatory framework should ensure maximum achievable road safety, guaranteed by industry, as a precondition of allowing these vehicles … to operate”, the report says.

Other recommendations include:

  • Require automated vehicles to report safety-relevant data.
  • Develop and use a staged testing regime for automated vehicles.
  • Establish comprehensive cybersecurity principles for automated driving.
  • Provide clear and targeted messaging of vehicle capabilities.

The report Safer Roads with Autonomous Vehicles? was initiated and supported by the Corporate Partnership Board of the International Transport Forum.

Free download: https://www.itf-oecd.org/safer-roads-automated-vehicles

Acceleration of L2 to L3 Autonomous Driving by OEMs Fuels Demand for LeddarTech Automotive-Grade LiDARs

Tuesday, May 22nd, 2018

QUEBEC CITY, May 22, 2018 /PRNewswire/ — Automotive OEMs are accelerating their efforts to bring SAE Level 2 and Level 3 active safety and semi-autonomous driving solutions to mass market within the 2020 to 2025 timeframe. As a result, an increasing number of system developers are turning to solid-state LiDAR (SSL) sensor solutions to achieve the highest level of system reliability and redundancy.

LeddarTech’s LeddarCore LCA2 system on chip for autonomous driving solutions, on display at CES 2018 in Las Vegas, Nevada on January 9, 2018.

The automotive industry’s critical need for cost-effective, high-performance sensing solutions is greatly benefitting LeddarTech, a developer of automotive-grade SSL solutions for the general automotive market.

LeddarTech’s LeddarCore LCA2 system on chip for autonomous driving solutions, on display at CES 2018 in Las Vegas, Nevada on January 9, 2018. (PRNewsfoto/LeddarTech)

The first half of LeddarTech’s 2018 fiscal year (ended March 31, 2018) was transformative for the organization, marked by ongoing expansion activities aimed at supporting a growing number of strategic Tier-1 clients and OEM projects, in addition to significant product milestones and achievements.

Managing Accelerated Growth
LeddarTech is in accelerated-growth mode following a successful US$101M (CAN$130M) financing round completed at the end of fiscal year 2017. After growing its team by over 70% last fiscal year, LeddarTech added another 33 employees over the last two quarters. Intensive recruitment activities are ongoing, with more than 20 open positions currently available. Once these positions have been filled, the company’s total headcount will be 125. These hirings, primarily within the company’s growing R&D and automotive product teams, further support the LeddarCore SoC development program and ongoing commercial partnership projects.

To support business ramp-up and its growing team, the company has also expanded its corporate headquarters—doubling its footprint in the process. The organization has also initiated the process toward ISO 9001:2015 certification, which is expected to be completed by the end of the 2018 calendar year.

New COO
To bolster this rapid expansion of its activities, LeddarTech has appointed industry veteran Frantz Saintellemy as its new President and Chief Operating Officer (COO). With over 20 years of experience in the automotive, semiconductor and sensor sectors, Saintellemy brings extensive industry knowledge to LeddarTech.

One of Saintellemy’s first mandates was to oversee the reorganization of LeddarTech’s activities into two distinct business units – Automotive Solutions and Module Solutions – in order to better address the unique needs of customers from different market segments.

Both units are aligned with LeddarTech’s mission to solve intelligent mobility sensing application challenges, with the Automotive Solutions unit focusing on the development of advanced automotive-grade LiDAR solutions, and the Module Solutions unit providing off‑the‑shelf industrial‑grade SSL modules to other mobility markets, such as the intelligent transport system (ITS), drone and industrial vehicle segments.

Saintellemy is also implementing automotive quality and test operations, a key requirement for this demanding market.

Product and Business Highlights
Major milestones in LeddarTech’s automotive LiDAR development roadmap were achieved on schedule during the first half of fiscal 2018. Highlights include:

  • Delivery of the first LeddarCore LCA2 system‑on‑chip (SoC) engineering product samples
  • Engineering samples of the first complete LiDAR sensors based on the LCA2 SoC
  • Engineering samples of a discrete implementation of the next-generation LeddarCore LCA3 SoC
  • Initiation of the LCA3 SoC integration program, launched through a signed development agreement with semiconductor expert

Integrated Device Technology (IDT)
Together, the LCA2 and LCA3 LiDAR engines deliver the required LiDAR configurations, performances and price points needed to implement SAE Levels 1 through 5 of autonomous driving. The SoCs were highly prominent at CES 2018, where LeddarTech was joined by multiple co‑exhibiting partners at the Leddar Ecosystem Pavilion, a unique two-story outdoor structure built specifically for CES 2018. Implementations of LeddarCore SoC technology were also featured in the booths of strategic partners, including Magneti Marelli, Osram, Optis, TriLumina, Renesas Electronics and AutonomouStuff.

Prestigious industry recognition was associated with these product and business achievements, as follows:

  • CES 2018, Las Vegas – Innovation Award Honoree in two categories for the LeddarCore LCA2 SoC: Embedded Technologies and Vehicle Intelligence and Self-Driving Technology
  • Tech.AD Awards 2018, Berlin – Runner-up, Most Innovative Active Safety or ADAS Technology/Product/Service category for the LeddarCore LCA2 SoC
  • Fidéides 2018, Quebec – High-Tech Company of the Year distinction, presented at this awards ceremony hosted by the Quebec
  • City Chamber of Commerce and Industry (CCIQ) to promote regional entrepreneurship, innovation and business excellence

In addition, LeddarTech’s Series C financing round was recognized by the international media as the third-largest venture capital deal of the year in Canada
In the first half of its fiscal year, LeddarTech’s general-purpose LiDAR module solutions also experienced growing customer traction, with design wins in a variety of mobility-related applications like: Obstacle detection with driver-alert technology (for public transit buses); Collision avoidance (for autonomous shuttles, commercial drone obstacle avoidance and altimetry); Pedestrian crossing automation; and Vehicle profiling for e-tolling systems. During this period, LeddarTech showcased its innovative end-to-end SSL solutions at two of the biggest international ITS events: ITS World Congress (Montreal) in October 2017, and Intertraffic (Amsterdam) in March 2018.

Market trends and highlights
Recent reports from industry analysts on LiDAR market opportunity confirm the strategic position of SSL technology in terms of enabling mass-market autonomous driving deployments.

Demand for LiDAR in the automotive market has been rising significantly, as confirmed by the latest data from Infinium Global Research forecasting a 35% CAGR over the period from 2017 to 2023. According to Technavio, a leading market research company with global coverage, LiDAR is the sensor of choice for automotive driving applications, with industry experts confirming its necessity for self-driving cars. Transparency Market Research came to the same conclusion, stating in a recent press release that demand for solid-state technology is expected to propel the multibillion automotive LiDAR sensor market, in turn taking a majority of market share from expensive mechanical scanners. And, in its just-released market report overview, technology and market analyst firm Yole Développement expects the global automotive LiDAR market to reach $5B by 2023 and $28B by 2032.

LiDAR technology has fortified its position in achieving Level 3 and Level 4 (semi-autonomous and autonomous) vehicle automation, with nearly all major automotive manufacturers working toward the production of autonomous driving vehicles. McKinsey & Company research points in this direction, with the firm’s most disruptive scenario for 2030 forecasting that 35% of all cars sold at this time will include conditional automation (Level 3), with 15% offering high automation (Level 4).

About LeddarTech
LeddarTech is the developer and owner of Leddar, a patented solid-state LiDAR sensing technology that constitutes a novel approach to light detection and ranging. Developed over 10+ years of R&D, Leddar is a unique combination of advanced light wave digital signal processing and software algorithms that enable the production of solid-state LiDARs delivering superior performance and reliability at a highly competitive price. LeddarTech sensors are used in multiple mobility-related markets including automotive, intelligent transport systems, drones, and industrial vehicles. Its technology contributes to improving safety and quality of life through applications minimizing the risks of accidents, reducing traffic congestion, and improving transport efficiency. www.leddartech.com

Contact Information

LeddarTech

4535 Wilfrid-Hamel Blvd
Suite 240
Quebec City, QC,
Canada, G1P 2J7

tele: 1-418-653-9000
toll-free: 1-855-865-9900
fax: 1-418-653-9000
https://leddartech.com

Crystal Group Releases White Paper on Engineering Automated Driving Systems for Safety

Monday, May 21st, 2018

Hiawatha, Iowa USA, May 21, 2018 – Crystal Group, a leading designer/manufacturer of rugged computer hardware, announces the release of a new industry whitepaper, written by Jim Shaw, executive vice president of engineering at Crystal Group, that discusses best practices of engineering autonomous driving systems for safety.

Autonomous vehicles (AVs), including fast-growing fleets of self-driving cars and trucks, are poised to revolutionize transportation. The global automotive industry is on the cusp of significant change, enabled by innovative automated driving system (ADS) and autonomous vehicle (AV) technologies in a fast-growing market estimated to reach $7 trillion by 2050; yet, widespread deployment hinges almost entirely on safety.

Self-driving cars and trucks are easily the most sophisticated and complex mobile platforms, outside the military, to hit public streets – largely unpredictable environments. Onboard systems must always be ready to identify and avoid hazards in their path.

Crystal Group’s latest white paper provides insight into how modern autonomous vehicle system designs benefit from reliable, safety-critical electronics built on proven, trusted military and aerospace system engineering standards and practices.

Predictable, repeatable performance over time is integral to safety, which in turn builds trust. Automated driving system failures are not an option and must be avoided, using systems specifically designed to be durable, offer high availability, and perform reliably in various operational environments throughout their life cycle.

Major automotive manufacturers and top technology firms have already partnered with Crystal Group to tap the company’s expertise in and portfolio of rugged and reliable systems for use in autonomous vehicles and automated driving systems. Crystal Group’s ruggedization techniques combine to deliver highly reliable systems to boost the safety of virtually any autonomous vehicle application. To date, Crystal Group has successfully passed numerous in-vehicle crash safety tests.
Download Crystal Group’s white paper, “Rugged by Design: Engineering Automated Driving Systems for Safety” in PDF format at http://go.crystalrugged.com/e/141931/white-papers-/53tn3f/238068616.

About Crystal Group Inc.
Crystal Group Inc., a technology leader in rugged computer hardware, specializes in the design and manufacture of custom and commercial rugged servers, embedded computing, networking devices, displays, power supplies, and data storage for high reliability in harsh environments. An employee-owned small business founded in 1987, Crystal Group provides the defense, government and industrial markets with in-house customization, engineering, integration, configuration management, product lifecycle planning, warranty, and support services.

Crystal Group products meet or exceed IEEE, IEC, and military standards (MIL-STD-810, 167-1, 461, MIL-S-901); are backed by warranty (5+ year) with in-house support; and are manufactured in the company’s Hiawatha, Iowa, USA, facility certified to AS9100C:2009 and ISO 9001:2008 quality management standards.

Contact Information

Crystal Group Inc.


Hiawatha, IA,

https://www.crystalrugged.com/

Renesas and Magna Bring Advanced Safety Features to More Vehicle Segments and Consumers

Thursday, May 17th, 2018

Cost-Efficient 3D Surround View System for Mass-Produced Vehicles

TOKYO, Japan, AURORA, Canada, May 17, 2018 ―Renesas Electronics Corporation (TSE: 6723), an industry-leading supplier of automotive semiconductor solutions, and Magna, a mobility technology company and one of the world’s largest automotive suppliers, aim to accelerate the mass adoption of advanced driving assistance system (ADAS) features with a new cost-efficient 3D surround view system designed for entry- and mid-range vehicles. The 3D surround view system adopts Renesas’ high-performance, low-power system-on-chip (SoC) optimized for smart camera and surround view systems. By enabling 3D surround view safety capabilities, the new system helps automakers to deliver safer and more advanced vehicles to a larger number of car consumers, contributing to a safer vehicle society.

Magna’s 3D surround view system is a vehicle camera system that provides a 360-degree panoramic view to assist drivers when parking or performing low speed operations. Drivers can adjust the view of their surroundings with a simple-to-use interface, while object detection alerts drivers about obstacles in their path. The system provides drivers a realistic 360-degree view of their environment, a significant upgrade to the bird’s-eye view offered by existing parking assist systems.

The innovative, ready-to-use system minimizes integration time and development costs, making the system an easy, cost-efficient option for automakers.

Several automakers have already expressed strong interest in the technology, including a European automaker, which will be the first to integrate the 3D surround view system into a future vehicle.

“Automated driving systems require scalability to address the wide range of requirements of car consumers,” said Shinichi Yoshioka, Senior Vice President and Deputy General Manager, Automotive Solution Business Unit, Renesas Electronics Corporation. “The collaboration, combining our best-in-class automotive semiconductor expertise, and Magna’s world-class automotive system innovation is an important step in delivering cost efficient 3D surround view system across vehicle classes, bringing valuable safety features to diverse price ranges.”

“The collaboration with Renesas is a great example of how companies can jointly develop and deliver a greater number of optimized, cost-effective semi-autonomous features to a variety of different vehicle segments,” said Kelei Shen, President of Magna Electronics. “By combining our strengths we will be able to put advanced driver assistance and safety technology into more vehicles and to more drivers.”

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live—securely and safely. A global leader in microcontrollers, analog, power and SoC products and integrated platforms, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics, Office Automation and Information Communication Technology applications to help shape a limitless future. Learn more at renesas.com.

About Magna

We have more than 172,000 entrepreneurial-minded employees dedicated to delivering mobility solutions. We are a mobility technology company and one of the world’s largest automotive suppliers with 340 manufacturing operations and 93 product development, engineering and sales centres in 28 countries. Our competitive capabilities include body exteriors and structures, power and vision technologies, seating systems and complete vehicle solutions. Our common shares trade on the Toronto Stock Exchange (MG) and the New York Stock Exchange (MGA). For further information about Magna, visit www.magna.com.

Contact Information

Renesas Technology America, Inc.

450 Holger Way
San Jose, CA, 95134
USA

tele: 408.382.7500
www.renesas.com

Synopsys Introduces Industry’s First ASIL D Ready Embedded Vision Processor IP for ADAS Applications and Self-Driving Vehicles

Thursday, May 17th, 2018

May 17, 2018: Synopsys, Inc. (Nasdaq:SNPS) today announced its new automotive safety integrity level (ASIL) B, C, and D Ready DesignWare® EV6x Embedded Vision Processors with Safety Enhancement Package (SEP) to accelerate the development of automotive system-on-chips (SoCs). The EV6x Processors with SEP include differentiated hardware safety features, safety monitors, and lockstep capabilities for safety-critical designs. These features enable designers to achieve the ISO 26262 standard’s most stringent level of functional safety and fault coverage without significant impact on performance, power, or area compared to the non-ASIL Ready EV6x processors. The ASIL Ready EV6x Processors with SEP integrate scalar, vector DSP, and convolutional neural network (CNN) processing units to help speed certification of automotive systems that require deep learning functionality.

To accelerate the development of ISO 26262-compliant code, the ASIL D Ready DesignWare ARC® MetaWare EV Development Toolkit for Safety provides the necessary tools, runtime software, and libraries to develop embedded vision and artificial intelligence (AI) applications for the EV6x Processors with SEP. The tools support software development with C/C++ and OpenCL™ C programming languages as well as open vision standards such as OpenVX™ and OpenCV. The MetaWare EV Toolkit also includes a tool to automatically map neural network graphs trained on popular frameworks such as Caffe and TensorFlow™ to the EV6x’s various processing resources for optimum execution.

The DesignWare EV6x Processors integrate scalar, vector DSP and CNN processing units for highly accurate and fast vision processing. With up to four vector DSPs that operate in parallel to the CNN engine, the EV6x Processors provide scalable performance that supports all vision algorithms and CNN graphs. An optional IEEE 754-compliant vector floating point unit, integrated into the vector DSP core, and its supporting software offer performance levels of up to 328 Gigaflops for single precision operations and 655 Gigaflops for half precision operations. The EV6x Processors with SEP option include state-of-the-art safety mechanisms and hardware safety features such as lockstep capabilities, ECC memories, error checking on core registers and safety-critical registers, a dedicated safety monitor, and a windowed watchdog timer for each core. An optional dedicated safety island monitors and executes safety escalations and diagnostics within the SoC and protects system bring-up.

“Safety-critical ADAS modules are the fastest growing segment of automotive electronics, with a corresponding increase in the use of deep learning,” said Phil Amsrud, Sr. Principal Analyst for Automotive Systems at IHS Markit, a global business information provider. “Given the increasing importance of performance and power consumption, ASIL D Ready solutions that promise higher performance while consuming lower power, should be of interest to ADAS module designers.”

“We are seeing a dramatic increase in design starts for ADAS SoCs that implement vision processing and AI for safety-critical systems,” said John Koeter, vice president of marketing for IP at Synopsys. “The combination of the new DesignWare EV6x Embedded Vision Processors with SEP, integrated CNN, unique safety features, and comprehensive set of software development tools gives SoC designers everything they need to accelerate ISO 26262 certification of their automotive systems.”

Availability & Resources
The ASIL B, ASIL C and ASIL D Ready DesignWare EV6x Vision Processors with Safety Enhancement Package option are available now. The vector floating point unit and safety island options are available now. The DesignWare ARC MetaWare EV Development Toolkit is available now, and the ASIL D Ready certified DesignWare ARC MetaWare EV Development Toolkit for Safety is scheduled to be available in September 2018.

Register for the webinar: Designing Smarter, Safer Cars with DesignWare EV6x Embedded Vision Processor IP
Read the white paper: The Impact of AI on Autonomous Vehicles
Watch the video: Addressing Automotive Safety Requirements with ASIL D Ready Vision Processor IP

About DesignWare IP
Synopsys is a leading provider of high-quality, silicon-proven IP solutions for SoC designs. The broad DesignWare IP portfolio includes logic libraries, embedded memories, embedded test, analog IP, wired and wireless interface IP, security IP, embedded processors, and subsystems. To accelerate prototyping, software development and integration of IP into SoCs, Synopsys’ IP Accelerated initiative offers IP prototyping kits, IP software development kits, and IP subsystems. Synopsys’ extensive investment in IP quality, comprehensive technical support and robust IP development methodology enable designers to reduce integration risk and accelerate time-to-market. For more information on DesignWare IP, visit www.synopsys.com/designware.

About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.

Contact Information

Synopsys, Inc.

700 E. Middlefield Road
Mountain View, CA, 94043
USA

tele: 650.584.5000
www.synopsys.com

TI Simplifies Space-constrained Automotive Application Designs with Robust, Reliable 100BASE-T1 Ethernet PHY

Wednesday, May 2nd, 2018

New 100-Mbps single-pair Ethernet PHY with SGMII support enables designers to pack more capability and intelligence into their automotive network designs

 

DALLAS (May 2, 2018) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a new automotive Ethernet physical layer (PHY) transceiver that cuts the external component count and board space in half and consumes as little as half the power of competitive solutions. The DP83TC811S-Q1’s support for serial gigabit media independent interface (SGMII), small packaging and integrated diagnostic features enable designers to bring greater intelligence via Ethernet connectivity to space-constrained automotive body electronics, infotainment and cluster, and advanced driver assistance systems (ADAS) applications. For more information, see www.TI.com/DP83TC811S-Q1-pr.

As the first 100BASE-T1 device to support SGMII, the DP83TC811S-Q1 Ethernet PHY improves design flexibility by enabling connections to multiple switches and interfaces. The DP83TC811S-Q1 supports the full range of media independent interfaces (MII), which enables designers to implement Ethernet connectivity with various media access controllers (MACs) and processors such as TI’s Jacinto™ automotive processors. To help the system monitor and detect cable breaks, temperature and voltage variations, and electrostatic discharge (ESD) events, the DP83TC811S-Q1 features a diagnostic toolkit, including a patent-pending ESD monitor.

Key features and benefits of the DP83TC811S-Q1 Ethernet PHY

  • Smaller solution size and lower weight: In addition to requiring fewer external components, the DP83TC811S-Q1 comes in a 6-mm-by-6-mm wettable flank package, which can reduce solution size by 50 percent. In addition, the device is compliant with the Institute of Electrical and Electronics Engineers (IEEE) 802.3bw standard and OPEN Alliance qualification, enabling the use of unshielded single twisted-pair copper cable, which reduces overall cable weight and cost.
  • Lowest power consumption: Developed using one of TI’s low-power process technologies, the DP83TC811S-Q1’s lower power minimizes thermal dissipation and enables components to be placed closer together. The device also includes power-saving features such as standby, disable and wake-on local area network (LAN).
  • Robust and intelligent design: The integrated diagnostic toolkit features cable diagnostics, temperature and voltage sensors, and an ESD monitor, enabling engineers to create designs that can withstand ESD and voltage events. The diagnostic features enable designers to continually monitor the integrity of the Ethernet link. Additionally, the DP83TC811S-Q1 provides up to 8 kV of ESD protection, helping shield the device against high-voltage faults.
  • Simpler layout, flexible design and high performance: SGMII uses only four pins instead of the 12 required for reduced gigabit media independent interface (RGMII), reducing board size and number of traces and in turn simplifying the design layout. Additionally, the integration of a physical medium dependent (PMD) filter, MII series terminators, PMD termination and power-supply filtering components reduce the need for external discrete circuitry, leaving more board space for designers to add features. The DP83TC811S-Q1 has a latency as low as 140 ns, allowing latency-critical systems like automotive ADAS to respond and communicate more quickly.

Tools and support to speed design

Designers can easily evaluate the device and its SGMII support with the DP83TC811SEVM evaluation module. Designers who need only RGMII can use the DP83TC811EVM evaluation module. Both are available for US$299.00 through the TI store and authorized distributors. Engineers can also jump-start their system design with the Automotive Stand-Alone Gateway Reference Design and the Cost-Effective In-Vehicle Infotainment System Reference Design.

Package, availability and pricing

The DP83TC811S-Q1 is now available in a 36-pin wettable flank very thin quad flat no-lead package (VQFNP) through the TI store and authorized distributors, starting at US$2.25 in 1,000-unit quantities.

Learn more about TI’s Ethernet PHY devices


Extension Media websites place cookies on your device to give you the best user experience. By using our websites, you agree to placement of these cookies and to our Privacy Policy. Please click here to accept.