Archive for June, 2018

Solid-state battery: are we entering in a new era?

Thursday, June 28th, 2018

Extracted from: Solid-State battery report, Yole Développement – Release date: June 2018

LYON, France – June 28, 2018: Last week, Volkswagen announced its partnership with QuantumScape. This announcement confirms the growing interest of EV/HEV makers in solid-state battery technology. Is the solid-state battery entering in a new era? Not now for sure but probably by 2022, announces Yole Développement (Yole) in its latest Solid-State Battery report. According to its aggressive market forecast scenario, mass production of solid-state batteries will begin by 2022…

Today, there is no commercially-available bulk solid-state battery (1). Over the last several years, numerous different players have made announcements regarding the readiness of prototype cells and expected commercialization starts, only to see these ultimately be cancelled or postponed. And despite decades of development, many technology challenges remain unsolved.

Why is there a strong, growing interest in solid-state battery development and commercialization? What are the key drivers? Yole offers you today to discover the technical challenges and market issues related to the solid-state batteries.

 

Solid State Battery Applications Roadmap.  (Source: Solid-State battery report, Yole Développement, June 2018)

First research activities in solid-state battery technology date to the late 1950s. Soli

d-state battery technology has found applications in the form of microbatteries as a micro-power source for sensors, etc. Unfortunately, materials and manufacturing methods used for microbattery’s fabrication are extremely difficult to translate into bulk-size battery manufacture on a cost-effective basis.

According to Yole’s analysis, the current momentum for growing interest in solid-state batteries is the strong application-pull of game-changing battery industry players: the EV/HEV makers. Indeed, established automotive players including Toyota, Volkswagen, BMW, etc. and newcomers such as Dyson, Fisker, plan to commercialize EV/HEV with a battery that will be safer, lighter, and longer-running than conventional Li-ion battery.
A growing number of players involved in solid-state battery development is another reason for increased momentum, as is a variety of newly established solid-state battery consortiums.

Numerous industry players and R&D players from different areas are combining their efforts, each bringing a piece of technology knowhow. As an example, 23 companies take part in the Japanese Libtec consortium.

“Sharing know-how from the four main technology areas is crucial for bringing solid-state battery to commercialization,” explains Dr. Milan Rosina, Senior Analyst, Power Electronics & Batteries, within the Power & Wireless division at Yole. These areas include: Solid-state electrolyte technology – Equipment – Battery cell – Automotive.

In addition, large coverage of multiple topics by different players is important for solid-state battery, enabling accelerated evaluation of different technology approaches and concentration on the most promising ones.

Regarding solid-state battery technology development, there are many technology bricks involved, including electrolyte material screening, ionic conductivity enhancement, electrolyte/electrode interface stability, lithium metal anode, separator coating, cell and pack manufacturing methods, BMS , and battery pack design. Yole’s analysts identified more than 100 companies and R&D players involved in solid-state battery development.
“For an emerging technology, it might be surprising to see that only 14 of 68 industrial companies identified are startup companies”, comments Dr. Rosina. “These start-ups, including Ionic Materials, NEI Corporation, QuantumScape, are positioned mainly in electrolyte material screening and development.”

Actually, R&D activities are rapidly developing within 54 big companies. These companies are mainly car makers including Toyota, BMW, Volkswagen, Renault-Nissan-Mitsubishi Alliance, and Hyundai.

Toyota, with a strong solid-state development history and 200+ engineers working on solid-state battery technology, is considered a leader here.

Strong participation from EV/HEV makers is extremely important for solid-state battery commercialization. Besides huge market potential, they bring to solid state battery development know-how regarding EV/ HEV battery requirements, battery pack assembly, testing, and qualification. And in fact, the simplification of battery pack design and its components will improve solid-state battery’s cost-competitiveness compared to conventional Li-ion batteries.

Other players include conventional Li-ion battery cell manufacturers (i.e. Samsung SDI, LG Chem, A123 Systems), battery separator technology solutions suppliers (Asahi Kasei), and materials suppliers (Solvay, Umicore, etc.).

The market research and strategy consulting company, Yole releases today its Solid-State Battery report. This new analysis offers deep insight into the key drivers and value proposition of solid-state battery technologies, compared to conventional Li-ion batteries. It also proposes a comprehensive analysis of the remaining challenges to bringing solid-state battery to commercialization. Main applications and different approaches for solid-state battery commercialization are well detailed in the report as well as an overview of the different materials and manufacturing methods.

A full description of this report is available on i-micronews.com, Batteries & Energy Management reports section.
(1) Not including the polymer based solid-state batteries from Bolloré Group, which must be heated to 60 – 80°C.

Acronyms:
EV/HEV : Electric Vehicle/Hybrid Electric Vehicle
BMS : Battery Management System

Contact Information

Yole Développement


http://www.yole.fr/

ACEINNA Launches New MTLT305D High Performance Dynamic Tilt Sensor Module

Tuesday, June 26th, 2018

New Dynamic Inclination, 3D acceleration and 3D rate sensor for Off Road and Construction Equipment, Automotive Advanced Drive Assist Systems, Robotics, Wind Turbine Towers, etc.

The new Affordable, Rugged and Compact ACEINNA Dynamic Tilt Module Sensor Keeps Vehicles on Track

 

Andover, Massachusetts- June 26, 2018

ACEINNA (pronounced “A See Nah”), today announced the availability of its new MEMS based, MTLT305D Dynamic Tilt Sensor Module. It combines accelerometers, gyroscopes and a temperature sensor with advanced calibration and correction algorithms to provide accurate 3D acceleration, 3D rate and Pitch and Roll measurement in dynamic, moving vehicle applications.

The MTLT305D uses advanced sensor fusion (Extended Kalman Filtering) and calibration algorithms to achieve 0.5 degree tilt and <10 milli-g acceleration accuracy in a wide variety of dynamic conditions. It is calibrated to accurately operate over a wide temperature range of -40C to +85C. The completely sealed compact module (65 x 66 x 27 mm) with integrated connector is perfect for rugged construction, off road and agriculture applications. It offers high reliability, MTBF > 50k hours and is ITAR- Free

It includes CAN J1939 and RS232 interfaces for network connectivity. The miniature plastic housing is durable under hazardous environments (IP68 and IP69K ratings). It includes an Ampseal 16, 6 position connector and supports a wide 4.9 V to 32 V supply input range (qualified for use in both 12 V and 24 V vehicle platforms).

“This new Dynamic Tilt Sensor Module provides the best performance for the price in the industry,” says Mike Horton, CTO of ACEINNA. “Not only is the MTLT extremely compact compared to competing modules, it is extremely rugged, well qualified and inexpensive.”

Easy to integrate, the MTLT305D supports industry standard SAE J1939 messaging over the CAN bus, and the included ACEINNA NAV-VIEW software provides a simple to use graphical interface to display, record, playback, and analyze all the MTLT305D parameters over the RS232 port. NAV-VIEW can also be used to set a wide range of user-configurable fields in the MTLT305D to optimize the system performance for various dynamic applications.

The new MTLT305D is available for purchase directly from the ACEINNA site as well as from our network of worldwide distribution partners.

For additional technical details, the MTLT305D data sheet is available at https://www.aceinna.com/inertial-systems/MTLT305D

About ACEINNA

ACEINNA Inc., headquartered in Andover, Massachusetts, provides leading edge MEMS-based sensing solutions that help our customers improve the reliability, cost, features, and performance of their end products and equipment. The company has manufacturing facilities in Wuxi, China, and R&D facilities in San Jose CA, Andover MA, and Chicago IL.

Contact Information

ACEINNA

One Tech Drive Andover, MA
Suite 325
Andover, MA, 01810
United States

tele: 978-965-3200
fax: 978-965-3200
info@aceinna.com
https://www.aceinna.com

Electra Meccanica Continues Global Compliance Testing for All-Electric SOLO

Monday, June 25th, 2018

After achieving U.S. Federal Certification, the SOLO Continues Dynamic Laboratory Safety Testing for Compliance Around the World

Electra Meccanica Vehicles Corp. (OTCQB: ECCTF), a cutting-edge designer and manufacturer of electric vehicles, today announced that their single-passenger, all-electric SOLO continues to go through dynamic laboratory safety testing in order to meet global safety standards. The Company received its Federal Certification in the U.S. earlier this year, and is now moving forward with ongoing testing for compliance in countries around the world.

The global compliance testing is a multi-faceted series of tests, performed in several facilities, assessing the car’s structural and functional integrity over numerous categories. Electra Meccanica has partnered with the most state-of-the-art organizations and facilities to ensure that the SOLO passes the most stringent safety requirements.

“Verifying the inherent safety features of the SOLO in laboratory conditions is a long, but rewarding journey for our company,” stated Jerry Kroll, Chairman and CEO of Electra Meccanica. “Going through this process allows the Company to gain knowledge and expertise in compliance that will allow us to improve upcoming vehicles in our product pipeline, including the Tofino, our all-electric sports car.”

The SOLO is priced at $15,500 USD, and interested consumers can place a fully-refundable $250 deposit by visiting EMVauto.com. A publicly held company, Electra Meccanica began trading on the OTCQB exchange and announced its application filing for NASDAQ Capital Markets listing last October.

About Electra Meccanica Vehicles Corp.:

Electra Meccanica is a designer and manufacturer of electric vehicles. The Company builds the innovative, all-electric SOLO, a single passenger vehicle developed to revolutionize the way people commute, as well as the Tofino, an elegant high-performance two seater electric roadster sports car. Both vehicles are tuned for the ultimate driving experience while making your commute more efficient, cost-effective and environmentally friendly.

Intermeccanica, a subsidiary of Electra Meccanica, has successfully been building high-end specialty cars for 59 years. The Electra Meccanica family is delivering next generation affordable electric vehicles to the masses.

For more information, visit www.electrameccanica.com.

Global Demand and Supply for Automotive Display Systems Expected to Maintain Healthy Growth in 2018, IHS Markit Says

Monday, June 18th, 2018

LONDON–(BUSINESS WIRE)–The global demand for automotive display systems is expected to continue a strong growth path in 2018, according to recent analysis from business information provider IHS Markit (Nasdaq: INFO).

According to the latest Automotive Display Systems Forecasts , OEM production of the three primary automotive display systems — instrument cluster, center stack and head-up display systems — is expected to reach 118.5 million units globally by the end of 2018, representing a 9 percent growth in volume over 2017. While the volume is growing significantly, the value of the market is growing even faster. In 2018, IHS Markit estimates just these three display systems to bring in $13.5 billion in tier-one supplier revenue, representing a 17 percent growth over 2017.

“In the quest for differentiation, automakers are using displays to transform vehicle interiors into a futuristic digital user experience with more pixels in front of consumers than ever before,” said Brian Rhodes, automotive user experience analyst at IHS Markit. “While high resolution, large displays previously were reserved for luxury applications only, declining average selling prices and increasing consumer demand and production volumes are enabling mass-market car brands to standardize displays that were optional only a few years ago.”

Demand for more displays in automotive applications is strong, but a major enabler to this growth comes from the supply chain. Large global display panel manufacturers in Asia have recently invested heavily in automotive display panel production in order to continue sales growth as display markets in other areas have slowed, such as smartphones and tablet PCs.

According to the latest Automotive Display Market Tracker by IHS Markit, global shipments of automotive display panels are set to increase by 11 percent reaching 164 million units in 2018, following an equally strong 9 percent growth in 2017, which had reached 148 million units.

These two IHS Markit forecasts are fundamentally linked, but also differ in that the shipment forecasts include additional volumes, applications and factors that the current OEM production-side forecasts do not.

“As vehicles adopt more technology, more new display use-cases become viable and new display applications are born,” said Hiroshi Hayase, senior director of small and medium displays at IHS Markit. “In addition to the strong growth in the primary display market, we also expect strong growth in display mirrors, rear seat entertainment and even in aftermarket systems as buyers clamor for more digital interfaces.”

As an example, global display shipments for rearview mirror applications are forecast to soar 52 percent in 2018 to 1.6 million units, beyond the 1.0-million-unit mark set just last year. While automakers are keenly aware of the growing demand in this sector, the aftermarket mirror manufacturers are responding quicker to the trend and represent a majority of today’s global production.

The IHS Markit Automotive Display Systems Forecasts provide customers with demand-side monthly updates to automotive instrument cluster, center stack display and head-up display system forecasts, tracked globally to the segment, OEM, brand, model, platform, and program. Coverage of tier-one suppliers and key technical characteristics like display system size, type, touch, orientation and more enabling a precise view of the volumes, technology and revenue market shares in the industry are also included. Meanwhile, the Automotive Display Market Tracker by IHS Markit contains supply-side quarterly updates of automotive display shipments and revenues by application, size, resolution and technology. It also provides supply chain information between tier-two display suppliers and the rest of the supply chain.

Contact Information

IHS Markit

4th floor Ropemaker Place
25 Ropemaker Street
London , EC2Y 9LY
United Kingdom

tele: +44 20 7260 2000
fax: +44 20 7260 2000
https://ihsmarkit.com/index.html

GCF Announces Certification for V2V and V2X Automotive Communications Technologies

Monday, June 18th, 2018

Faster enablement of connected vehicle ecosystem

The Global Certification Forum (GCF) has announced the inclusion of LTE-based vehicle-to-everything (V2X) and vehicle-to-vehicle (V2V) communications technologies within its certification programme. The specific technologies covered by this certification are based on “LTE sidelink” – an adaptation of core LTE standards as defined in 3GPP release 14, allowing for communication between two or more nearby devices. The new certification features will be available from Q3 2018, with GCF’s network of members looking to ensure the commercial availability of the test equipment necessary to support certification testing.

Wireless standards such as those covered by 3GPP release 14 are critical to enabling the connected vehicle ecosystem, and compliance to these standards is essential in a multi-vendor environment. From later this year, GCF will support manufacturers of relevant V2V and V2X communications technologies in gaining certification against 3GPP release 14 standards, enabling them to demonstrate compliance of their products.

“The addition of V2V and V2X to GCF certification marks a milestone as we build on core telecoms technologies and move to support key industry verticals such as automotive as they integrate mobile technologies into their products,” said Lars Nielsen, General Manager, GCF. “It perfectly aligns with our overall strategy which is to fully service and enable the emerging 5G ecosystem.”

The automotive industry is the largest segment of the rapidly growing IoT market, where mainstream adoption of “connected things” is predicted to be globally accepted by 2020. Innovation in connected and autonomous vehicles is creating new demands on automotive communications technologies, to enable vehicles to communicate with the internet, other vehicles, the road infrastructure, other road users and pedestrians. Automotive device manufacturers are creating a multitude of solutions to this challenge, and in this fast-moving market, compliance with the latest relevant wireless standards is essential to facilitate successful adoption of the technologies.

3GPP is a global cooperation of independent standardization committees, (ARIB, ATIS, CCSA, ETSI, TSDSI, TTA, TTC) that define specifications for wireless standards, and GCF is a market representation partner of 3GPP.  Specifications are prioritised and grouped into releases, based on the sequence in which new functionality will be deployed in wireless networks. “LTE sidelink” – an adaptation of the core LTE standards – was defined by 3GPP in release 12 allowing for communication between two or more nearby devices, using E-UTRA technology but not traversing any network node, i.e. the so-called out-of-network coverage scenario. V2V and V2X use cases utilise its release 14 version. The functionality can also be used in conjunction with conventional LTE connections to mobile networks to open-up a wide variety of innovative connected car services. It can be provided on any LTE band with the 5.9 GHz band allocated for intelligent transport system (ITS) services.

For more information on GCF see: http://www.globalcertificationforum.org

About GCF 

GCF, founded in 1999, brings together technical experts from over 300 of the world’s leading manufacturers, operators and testing organisations to define the certification requirements for the mobile industry. A number of agreement groups implement GCF’s technical work. The work on V2V and V2X certification was conducted by one of these working groups (CAG), led by Qualcomm and with active participation from the following GCF members – Vodafone, Deutsche Telekom, Sierra Wireless, Samsung, Ericsson, Keysight, Sprint.

 

 

Renesas Electronics Updates Model-Based Development Environment to Significantly Ease Software Development Burdens for Multicore Automotive Control Microcontrollers

Thursday, June 14th, 2018

RH850 Model-Based Development Environment Supports Development of Systems With Multirate Control (Multiple Control Periods)

 

MILPITAS, Calif., June 14, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced an update to its “Embedded Target for RH850 Multicore” model-based development environment for multicore microcontrollers (MCUs) for automotive control applications. The update supports development of systems with multirate control (multiple control periods), which is now common in systems such as engine and body control systems. This model-based development environment has become practical even in software development scenarios for multicore MCUs, and can reduce the increasingly complex software development burdens especially in control system development of self-driving cars.

Renesas’ earlier RH850 multicore model-based development environment automatically allocated software to the multiple cores and although verifying performance was possible, in complex systems that included multirate control, it was necessary to implement everything manually, including the RTOS and device drivers. Now, to meet the ever-increasing requirements for engine and vehicle performance, and at the same time shorten product development time, by making this development environment support multirate control, it is possible to directly generate the multicore software code from the multirate control model. This has made it possible to evaluate the execution performance in simulation. Not only does this allow execution performance to be estimated from the earliest stages of software development, this also makes it easy to feed back the verification results into the model itself. This enables the completeness of the system development to be improved early on in the process, and the burden of developing the ever-larger scale, and increasingly complex, software systems can be significantly reduced. Renesas is accelerating the practical utility of model-based development environments in software development for multicore processors and is leading the evolution of green electric vehicles as proposed in the Renesas autonomy™ concept.

Renesas will provide the “Embedded Target for RH850 Multicore” updated model-based development environment starting in the fall of 2018. In preparation for that release, Renesas will be presenting a demonstration of this development environment on Tuesday, July 3, 2018, at the MathWorks Automotive Conference 2018, to be held at the Tokyo Conference Center Shinagawa.

“Model-based development is becoming increasingly common, and Renesas has now completed an environment that covers from control design through automatic code generation. At the same time, since multicore software is complex, it was difficult to handle such software in earlier model-based development environments,” said Hiroyuki Kondo, Vice President of Shared R&D Division 1, Automotive Solution Business Unit, Renesas Electronics Corporation. “Leveraging our extensive expertise in automotive control use cases, we were able to start working on practical application of this technology early on, and thus succeeded in creating this update. I am confident that our model-based development environment will bring dramatically improved efficiency in software development for multicore microcontrollers.”

Key features of the updated “Embedded Target for RH850 Multicore” model-based development environment

  • Support for multirate control significantly reduces the burden of multicore software development.

Control functions development requires multirate control, such as intake/exhaust period in engine control, the period of fuel injection and ignition, and the period with which the car’s status is verified. These are all different periods. By applying the technology that generates RH850 multicore code from the Simulink® control mode to multirate control, it has become possible to directly generate multicore code, even from models that include multiple periods, such as engine control. Renesas also provides as an option for the Integrated Development Environment CS+ for the RH850, a cycle precision simulator that can measure time with a precision on par with that of actual systems. By using this option, it is possible to estimate the execution performance of a model of the multicore MCU at the early stages of software development. This can significantly reduce the software development period.

  • Conforms to the de-facto standard JMAAB control modeling guidelines for automotive model-based development

The JMAAB (Japan MBD Automotive Advisory Board), an organization that promotes model-based development for automotive control systems, recommends several control models from the JMAAB Control Modeling Guidelines. Of those, Renesas is providing in this update the Simulink® Scheduler Block, which conforms to type (alpha), which provides a scheduler layer in the upper layer. This makes it possible to follow the multirate single-task method without an OS, express the core specifications and synchronization in the Simulink® model, and automatically generate multicore code for the RH850 to implement deterministic operations.

  • Overall operational verification of an ECU that integrates multiple systems is also possible

Along with advances in the degree of electronic control in today’s cars, integration is also progressing in the ECUs (electronic control units), which are comparatively small-scale systems. By supporting multirate control, making it easier to operate small-scale systems with different control periods with a multicore microcontroller, it is now possible to verify the operation of a whole ECU that integrates multiple systems.

The updated model-based development environment is planned to support Renesas’ RH850/P1H-C MCU that includes two cores by this fall, and also support for the RH850/E2x Series of MCUs that include up to six cores is in the planning. In addition, Renesas plans to deploy this development environment to the entire Renesas autonomy Platform, including the “R-Car” Family of SoCs. Renesas is also continuing to work to further improve the efficiency of model-based software development, including model-based parallelization tools from partner companies and strengthening of related multirate control support execution performance estimation including the operating system. Moving forward, Renesas plans to apply the model-based design expertise fostered in its automotive development efforts in the continually growing RX Family in the industrial area, which is seeing continued increases in both complexity and scale.

For more information about Renesas, follow Renesas Electronics America at @RenesasAmerica on Twitter and www.facebook.com/RenesasElectronics

Contact Information

Renesas Technology America, Inc.

450 Holger Way
San Jose, CA, 95134
USA

tele: 408.382.7500
www.renesas.com

 

MIPS I6500-F First High Performance 64 Bit Multi-Cluster CPU IP to Receive ISO 26262 and IEC 61508 Certification

Monday, June 11th, 2018

Scalable Multi-threaded, Multi-core, Multi-cluster IP core designed for safety critical systems in an autonomous age, raises the bar on Functional Safety

SANTA CLARA, Calif. – June 11, 2018 – MIPS, provider of the widely used MIPS processor archi-tecture and IP cores for licensing, today announced that its I6500-F CPU IP core, designed as a Safety Element out of Context (SEooC), is the first high performance 64 bit multi-cluster CPU IP to receive formal certification of compliance for ASIL B [D], based on ISO 26262: 1st edition 2011 (&DIS 2nd Edition 2018) and IEC 61508 SIL 2. The core was certified by Resiltech, a leader in certification of safety-related products for automotive and industrial applications.

“The I6500-F has been successfully assessed to be compliant to the latest ISO 26262 [including DIS ISO 26262, 2nd edition] and IEC 61508 safety standard and the MIPS team has followed the safety requirements, not only to address quantitative requirements for random failures for ASIL B [D], but also to achieve compliance regarding the systematic failure requirements. The safety compliance and the resulting safety cases will be of great value to the component vendors,” said Dr. Francesco Rossi, Automotive Safety Solutions Manager, Resiltech s.r.l

“Unlike ‘ASIL B/D ready’ solutions, the MIPS I6500-F has been developed as a SEooC, based on ASIL B [D] decomposition, for items targeting ASIL D automotive applications and delivers both safety and performance, an essential combination for extremely high system efficiency, scalable computing and compute-intensive tasks,” said David Lau, MIPS’ Vice President of Engineering. “The I6500-F is one of a new class of MIPS CPUs designed to ‘FortifAI’ next-generation intelligent applications. This ASIL B (D) SEooCs certification helps our customers significantly de-risk and accelerate certification at the SoC level.”

The MIPS I6500-F addresses the critical FuSa requirements for a wide range of automotive Human Machine Interface and ADAS/autonomous vehicle applications. These include speech and gesture recognition, eye tracking, driver monitoring, virtual assistance, and natural language interfaces, as well as camera-based machine vision, radar-based detection units, driver condition evaluation, and sensor fusion ECUs.

The MIPS I6500-F comes with a complete safety package, including all the required safety cases, quantitative safety analysis based on FMEDA, and safety analysis report summarizing the FMEDA analysis results and functional safety audit for addressing requirements for systematic failures.

“The I6500-F core from MIPS has helped us to reach new levels of performance, opening our platform and meeting our un-compromised functional safety goals,” said Elchanan Rushinek, Vice President, Engineering at Mobileye. “This certification underscores not only MIPS’ leading commitment to Functional Safety, but also to its partners and customers who rely on MIPS technology in highly intelligent and autonomous applications. We are continuing our collaboration with MIPS on FuSa compliance on our open platform.”

About MIPS
MIPS is a leading provider of processor architectures and IP cores that drive some of the world’s most popular products. With the streamlined MIPS RISC architecture and CPU cores, customers can build highly efficient, scalable, and trusted products across a wide range of performance points – from the IoT edge to high-end networking equipment, and everything in between. MIPS leads the industry with Multi-Threading capabilities for optimal application performance and efficiency. Originally founded in 1984 as MIPS Computer Systems Inc. by researchers from Stanford University, MIPS today is an independent company focused on processing innovations for a new generation of intelligent, connected devices. MIPS designs have shipped in billions of units across the globe and have even reached the outer edges of our solar system. The company is headquartered in Santa Clara, Calif., with offices worldwide. www.mips.com

Contact Information

MIPS Technologies

3201 Scott Blvd.
Santa Clara, CA, 95054
USA

tele: 408 530 5000

www.mips.com

Analog Devices’ Isolated Power Converters Support Class B System EMI Levels

Tuesday, June 5th, 2018

NORWOOD, Mass.–(BUSINESS WIRE)–Analog Devices, Inc. (ADI) today announced its latest generation of reinforced isolated power converters, setting a new benchmark for low component-level radiated emissions allowing systems to meet EN 55022/CISPR 22 Class B Electromagnetic Interference (EMI) standard requirements. The ADuM5020/6020 and ADuM5028/6028 series eliminate the need for costly EMI mitigation techniques at the application level and simplify the EMI certification process reducing design cost and time.

View the ADuM5020 and ADuM6020 product pages, download datasheets, and order samples: http://www.analog.com/ADuM5020 or http://www.analog.com/ADuM6020
View the ADuM5028 and ADuM6028 product pages, download datasheets, and order samples: http://www.analog.com/ADuM5028 or http://www.analog.com/ADuM6028

Watch a video about the new isolated power converters:
http://www.analog.com/en/education/education-library/videos/5789157078001.html

Emerging safety-critical applications, such as Electric Vehicle and Hybrid Electric Vehicle (EV/HEV) automotive battery monitoring and industrial programmable logic controllers (PLC), require compact and dense isolated designs that deliver size and weight savings, strict emissions compliance, and reliable protection from high voltages for people and equipment. Use of these devices can achieve emissions targets on a two layer PCB, which reduces the solution size by as much as 70%, and decreases the material cost by 30% compared to a four layer board. The new series of 500mW DC-DC power converters builds upon ADI’s iCoupler® and isoPower® chip-scale transformer technologies to support high temperature operation up to 125ºC and the smallest 8-lead form factor. The 16-lead ADuM5020/6020 and the 8-lead ADuM5028/6028 are the first devices in the series.

ADuM5020/6020 and ADuM5028/6028 Product Highlights:

  • Low radiated emissions below Class B EN 55022/CISPR 22 standard limits
  • Smallest package size – 8-lead SOIC
  • High temperature operation – 125°C
  • Safety and regulatory approvals (UL, CSA, VDE, CQC)

Pricing and Availability

About Analog Devices
Analog Devices is the leading global high-performance analog technology company dedicated to solving the toughest engineering challenges. We enable our customers to interpret the world around us by intelligently bridging the physical and digital with unmatched technologies that sense, measure, power, connect and interpret. Visit http://www.analog.com.

Contact Information

Analog Devices


http://www.analog.com/

u‑blox Accelerates V2X Active Traffic Safety

Tuesday, June 5th, 2018

UBX-P3 is industry’s smallest concurrent dual-channel V2X communication chip

Thalwil, Switzerland – June 5, 2018 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, today announced its UBX‑P3 chip for vehicle-to-everything (V2X) wireless communication based on the DSRC/802.11p standard (https://www.ublox.com/en/product/ubx-p3). The chip builds on the success of the u-blox THEO‑P1 and VERA-P1 V2X modules, and the company’s experience as a technology supplier to the existing V2X chip industry. Developed entirely in-house, the UBX-P3 takes u‑blox’s commitment to shaping the future of active safety and autonomous driving technologies to the level of industrialization.

Driven by demands for reducing traffic accidents and optimized traffic management, V2X technology leverages wireless communication for vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication, giving all vehicles on the road a shared real-time perception of their surroundings. In addition to increasing road safety, V2X technology improves traffic management and enables wide-ranging applications such as truck platooning as well as in areas including smart cities, mining, and agriculture.

UBX-P3 communicates via the IEEE 802.11p wireless standard, referred to as Dedicated Short Range Communications (DSRC) in the USA. The DSRC/802.11p technology is mature and available for immediate deployment of V2X systems. Many automotive tier-1 suppliers are developing DSRC/802.11p based solutions. Car and truck OEMs have either deployed or plan to deploy the solutions commercially in the near future.

Offered in a compact 9 x 11 millimeter form factor, the UBX-P3 supports various design options for flexible deployments in the vehicle and the road-side infrastructure. The UBX-P3 concurrently communicates on two channels, which means that safety and service messages can be processed continuously providing greater safety in traffic. Alternatively, it can be used to enable the chip to simultaneously communicate on the same channel using two antennas, thus providing vehicles full coverage with no blind spots.

As the market leader in automotive positioning solutions, u-blox has a two decades’ experience working with the automotive industry’s quality and supply requirements. UBX‑P3 is designed in accordance with these stringent demands and complements u-blox’s portfolio of automotive grade positioning, cellular communication, and short range radio technology.

“UBX-P3 is the fruit of our longstanding investment in the development of V2X. We are convinced that this innovative chip will contribute to accelerating the deployment of DSRC/802.11p technologies to make transportation safer, more efficient, and more sustainable,” says Herbert Blaser, Senior Director, Product Center Short Range Radio at u‑blox.

Samples will be available for lead customers in the course of 2018.

About u‑blox
u‑blox (SIX:UBXN) is a global provider of leading positioning and wireless communication technologies for the automotive, industrial, and consumer markets. Their solutions let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. With a broad portfolio of chips, modules, and a growing ecosystem of product supporting data services, u-blox is uniquely positioned to empower its customers to develop innovative solutions for the Internet of Things, quickly and cost-effectively. With headquarters in Thalwil, Switzerland, the company is globally present with offices in Europe, Asia, and the USA.

Contact Information


Extension Media websites place cookies on your device to give you the best user experience. By using our websites, you agree to placement of these cookies and to our Privacy Policy. Please click here to accept.