Archive for July, 2018

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ProTek Devices Intros AEC-Qualified ESD Diode for Automotive Circuit Protection

Monday, July 30th, 2018

The PAM3CAN is Designed to Protect Two Automotive CAN Bus Lines from ESD and EFT Strikes

TEMPE, Ariz. – July 30, 2018 – ProTek Devices today introduced a new circuit protection diode suited for automotive applications, such as Controller Area Network (CAN) bus lines. The new PAM3CAN diode is qualified by the Automotive Electronics Council (AEC).

The PAM3CAN is designed to protect two automotive CAN bus lines from the damaging effects of electrostatic discharge (ESD) and other electrical fast transients (EFT). In addition to being AEC-qualified, the new ESD diode is compatible with several IEC standards. These include 61000-4-2 (ESD): level 4; 61000-4-4 (EFT): 40A, 5/50ns; and with 61000-4-5 (surge): 2.1A, 8/20 micro seconds. The diode offers 150 watts of peak pulse power per line (typical = 8/20 micro seconds). ESD protection is 15 kilovolts. The rated stand-off voltage is 24V.

Operating and storage temperatures for the diode are -55 to 150 degrees Celsius. The PAM3CAN also boasts a low clamping voltage, low capacitance, and low leakage current. It is RoHS and REACH compliant.

Mechanical, Packaging and Availability Information

The PAM3CAN ESD circuit protection diode is now available and is provided in a molded JEDEC SOT-23 package with an approximate weight of only 8 milligrams. Other key mechanical characteristics include lead-free pure-tine plating (annealed) and a solder reflow temperature of (pure-tin – Sn, 100) 260 to 270 degrees Celsius. It has a flammability rating of UL 94V-0. It is delivered on 8mm tape and reel, per EIA standard 481, in minimum quantities of 3,000. Pricing information and purchasing details can be had by contacting any authorized worldwide distributor, representative, or directly with ProTek Devices. These sales sources are available throughout North America, Europe, Asia, South America, and more. Full contact information for all regions can be found at the company website.

About ProTek Devices

In business more than 25 years, ProTek Devices™ is a privately held semiconductor company. It offers a comprehensive product line of circuit protection devices. This includes overvoltage protection components and overcurrent protection components. Its transient voltage suppressors (TVS array), avalanche breakdown diodes, steering diode TVS arrays, PPTC devices, and electronic SMD chip fuses are widely used. Household brands and many other companies use ProTek Devices’ products to protect investments made in electronics designs and investments customers make in their products. Circuit protection is provided against lightning; electrostatic discharge (ESD); nuclear electromagnetic pulses (NEMP); inductive switching; and electromagnetic interference / radio frequency interference (EMI / RFI). ProTek Devices is based in Tempe, Ariz. It sells its components through a worldwide network of distributors and representatives across the US, Europe, Asia, Latin America, and more. Additional information is available at http://www.protekdevices.com.

Contact Information

Protek Devices

2929 South Fair Lane
Tempe, AZ, 85282

toll-free: 602-431-8101
http://www.protekdevices.com/

Cepton Technologies Furthers the Advancement of Autonomous Driving With Its MMTTM LiDAR Technology

Friday, July 27th, 2018

SAN JOSE, Calif. – July 27, 2018 – Cepton Technologies, Inc., a provider of 3D LiDAR solutions for automotive, industrial, and mapping applications, today announced it will provide Koito Manufacturing Co., Ltd. (TYO:7276), a leading global tier-one supplier of exterior automotive lighting, with its miniaturized LiDAR solution for autonomous driving.

The compact design of Cepton’s high performance LiDAR sensors enables direct integration into a vehicle’s lighting system to take advantage of the latest autonomous driving technology without impacting its sleek design. With its innovative Micro-Motion Technology (MMTTM) platform, Cepton’s LiDAR sensors enable vehicles to recognize and track objects from all four corners for a true 3D image of its surrounding environment.

Cepton’s MMTTM LiDAR sensors feature advanced technology free of mechanical rotation and frictional wear, producing high-resolution imaging of a vehicle’s surroundings to detect objects at a distance of up to 300 meters away. Cepton is continuing to innovate and evolve its low-power and high-resolution LiDAR technology for integration into automotive lighting systems.

As the No.1 tier-one automotive lighting supplier, Koito is looking for a variety of sensors to meet the growing demand for autonomous vehicles. Koito is interested in the potential of the miniaturized LiDAR solution developed by Cepton, and with the customized LiDAR shipment, Koito is pursuing verification of its functionality, performance and reliability.

“We are excited to bring advanced LiDAR technology to vehicles to improve safety and reliability,” said Jun Pei, CEO and co-founder of Cepton. “With the verification of our LiDAR technology, we hope to advance the goals of Koito, a global leader within the automotive lighting industry producing over 20 percent of headlights globally and 60 percent of Japanese OEM vehicles.”

Used widely in industrial markets including aerospace and construction, LiDAR technology has the potential to reshape the entire transportation industry and consumers’ expectations about what a car can do. According to a market report1 by Yole Développement (Yole), the global automotive LiDAR market will “reach a market value of $5B by 2023 and $28B by 2032,” which represents a tremendous opportunity for Cepton to bring its cutting-edge technology to automakers worldwide.

Source1: LiDARs for Automotive and Industrial Applications 2018 report, Yole Développement, 2018

About Cepton Technologies, Inc.
Cepton Technologies, Inc. is a 3D sensing solutions provider shipping next-generation LiDAR products for the automotive, industrial and mapping markets. Founded in 2016 and led by LiDAR and advanced image industry veterans, Cepton has a leadership team that recognizes where the automotive industry and Internet of Things (IoT) market are headed and have deployed four advanced LiDAR solutions that are mapping the future. Cepton LiDAR technology delivers unrivaled detection range and resolution at low cost, to enable perception for the fast growing market for smart machines.

For more information, visit http://www.cepton.com/.

About Koito
Under the corporate message, “Lighting for Your Safety”, Koito Manufacturing Co., Ltd (Koito) has been marking a history of leadership in automotive lighting since its establishment in 1915. Today, the Koito Group consists of 32 companies located in 12 countries worldwide and provides products and services to customers all over the world, through the global network led by five major regions (Japan, North America, Europe, China, and Asia.) Its products, recognized for its high quality and advanced technology, are widely used by automotive makers worldwide. The company is responding to the future transformation of mobility through the development of next-generation lighting technologies and related equipment, control systems, and environmentally friendly products, materials, and production methods. For more information please visit www.koito.co.jp/english.

Contact Information

Cepton Technologies Inc.

103 Bonaventura Drive
San Jose, CA, 95134
USA

http://www.cepton.com/

CAN FD bit-time setting rules

Friday, July 27th, 2018

Nuremberg, 2018-07-27. The nonprofit CAN in Automation (CiA) association has released the CiA 601-3 bit-time setting recommendation. The document provides rules and background information about the setting of bit-times in CAN FD networks. CAN FD is the successor of Classical CAN. Most of the OEMs are migrating to CAN FD in the next couple of years. The CiA 601-3 document comes with a spreadsheet to check whether your selected bit-rates are possible.

CAN FD frames are transmitted with two speeds. The rules for the arbitration bit-rate are the same as for Classical CAN. In the dataphase, the nodes are not synchronized. Therefore, other rules apply such as phase margin for received and transmitted frames. The released document contains all the necessary formulas to calculate the limits. In addition, it proposes, how to measure them. CiA members can download the documents free-of-charge and non-members can purchase them from theCiA Office in Nuremberg (Germany).

Contact Information

CAN in Automation

Kontumazgarten 3
Nuremberg, DE-90429
Germany

tele: +49-911-928819-0
fax: +49-911-928819-0
headquarters(at)can-cia.org
CAN in Automation

Marvell Automotive Gigabit Ethernet Technology Receives Compliance Approval from Premier Japanese Automotive Industry Body

Tuesday, July 24th, 2018

88Q2112 1000BASE-T1 automotive Ethernet PHY surpasses stringent operational performance benchmarks set by JASPAR

 

Santa Clara, CALIF. (July 24, 2018) – Marvell Technology Group Ltd. (NASDAQ:MRVL) today confirmed that its 88Q2112 solution, the first IEEE® 802.3bp 1000BASE-T1 compliant automotive PHY to deliver 1 Gigabit/s data rates, has completed the conformance tests outlined by Japan Automotive Software Platform and Architecture (JASPAR) and passed 100%.

JASPAR was established in 2004 to facilitate the adoption of new automotive related technologies throughout Japan. The organization helps improve development efficiency and ensures reliability through standardization and sharing of sophisticated electronic automotive software and networks. It does this by providing common specification guidelines that can be referenced by the country’s automobile OEMs and their tier 1 partners.

Among its membership are globally recognized auto manufacturers such as Toyota, Nissan, Honda, Mazda, Suzuki, DENSO and Bosch.

JASPAR’s Next Generation High-Speed Networking Group had previously evaluated both the IEEE 802.3 based 100BASE-T1 and 100BASE-TX connectivity solutions that are offered by Marvell, and the group’s evaluation has now been extended to cover the company’s latest 1000BASE-T1 automotive technology. The 88Q2112 based development boards utilized for the evaluation were designed and assembled by engineers from DENSO and tested by multiple tier 1 and tier 2 auto manufacturers coordinating with the JASPAR organization.

A comprehensive series of tests were conducted including, electromagnetic compatibility (EMC) emissions and immunity tests, bulk current injection (BCI) testing for RF immunity and extreme temperature testing with gigabit compatible harnesses. In addition, electrostatic discharge (ESD), transient noise, ground differential stress, clock skew, signal line short-to-power and short-to-ground testing were also performed. The Marvell 88Q2112 solution passed all tests by a considerable margin.

“88Q2112 is the first automotive Gigabit Ethernet solution in the market and we are excited to have successfully exceeded JASPAR’s conformance testing. This represents a major milestone for our automotive connectivity technology,” said Tim Lau, senior director of Automotive Product Marketing at Marvell. “We look forward to a continued partnership with JASPAR to ensure closer collaboration in testing market changing solutions from Marvell.”

“Clearly, future in-vehicle network infrastructure will need to rely on high speed Ethernet technology, as car manufacturers expect greater functionality and more advanced safety-critical features to be incorporated,” said Hideki Goto, chairman of JASPAR’s Next Generation High-Speed Network Working Group and group manager at Toyota. “Marvell is making a real contribution towards this ongoing progression, thereby helping to accelerate the migration away from older and slower networking protocols.”

“The core objective of JASPAR is to create an environment in which those serving the Japanese automotive sector can work together to further drive automotive innovation. Numerous JASPAR members have been involved in this test project and we are very pleased with the results that have been achieved,” said Takashi Matsumoto, a member of Next Generation High-Speed Network Working Group at Nissan. “With the testing now complete, JASPAR plans to release a new standard that specifies circuit configuration and information on signal line impedance, AC coupling and termination resistance, EMC, ESD and crystals, later this year. This will be used as a reference for implementing 1000BASE-T1 technology to the Japanese OEMs and tier 1s.”

For further information on the Marvell 88Q2112 PHY, please visit: www.marvell.com/automotive/ethernet/88q2112/

Contact Information

Marvell Launches First CISPR 25 Qualified Automotive EMC Lab in North America

Tuesday, July 24th, 2018

First silicon vendor in North America to open a CISPR 25 qualified automotive electromagnetic compatibility lab to further drive the innovation and development of industry-leading automotive connectivity solutions

 

Santa Clara, Calif. (July 24, 2018) – Marvell Technology Group Ltd. (NASDAQ:MRVL) today announced the grand opening of its automotive electromagnetic compatibility (EMC) lab in North America. The state-of-the-art EMC testing facility is CISPR 25 qualified and provides Marvell with an in-house capability to perform a wide range of emission, immunity and ESD testing. With this new facility, Marvell’s automotive Ethernet products can be designed into system solutions that meet the demanding EMC challenges faced by automotive manufacturers and help shorten the time-to-market. Having a state-of-the-art EMC lab also enhances Marvell’s development of its next generation of automotive qualified products and is a testament to Marvell’s long term commitment to the automotive industry.

To deliver improved levels of user experience, safety and security, automotive makers are employing several electronic control units (ECUs) that operate at higher frequencies which pose many new EMC challenges. These ECUs are more frequently being bombarded by multiple sources of electromagnetic interference EMI and noise, ranging from 150 kilohertz to over 10 gigahertz from both internal ECUs and external sources. Preventing these electromagnetic interferences, enables the mission critical functions of the car to operate reliably. Furthermore, limiting the electromagnetic interference in the car ensures that the infotainment systems including streamed audio and video run seamlessly and without interruption.

The coexistence of an increasing number of ECUs within the car as well as interference from surrounding vehicles have driven automotive silicon vendors to meet very stringent EMC and ESD requirements outlined in the IEC/ISO and AEC-Q100 standards. Marvell’s new EMC lab provides the testing capability needed to ensure its products and solutions meet these EMC requirements, including IEC CISPR 25, IEC 62132, IEC61967, IEC 61000, ISO11452, ISO 10605, ISO7637 and other OEM specific EMC requirements.

“Marvell is committed to developing innovative connectivity solutions for the automotive market. The Marvell automotive EMC lab is a clear example of how we help our customers achieve success. With this unique facility, we are able to support our automotive customers to solve their toughest EMC challenges more effectively and efficiently,” said Will Chu, vice president and general manager of the Automotive Business Unit, Marvell.

“The automotive megatrends of vehicle electrification, assisted and autonomous driving and the advanced connectivity solutions create an increasingly challenging EMC and ESD environment that have to be solved. Automotive silicon vendors are now being asked to develop capabilities and shoulder more of the responsibility in developing practical recommendations that overcome these challenges,” said Ian Riches, director, Global Automotive Practice, Strategy Analytics. “The opening of the Marvell EMC lab is an important milestone for the automotive industry and will provide Marvell with an edge with this unique facility.”

“Having developed multiple CISPR 25 EMC labs for the automotive industry, we were very excited to engage with Marvell as the first semiconductor vendor who invested in such an advanced engineering facility. We were equally impressed by Marvell’s deep understanding of the latest technologies, tools and methods to solve the toughest EMC problems,” said Kirk Grummer, CEO and president, AP Americas, Inc. and provider of the anechoic CISPR 25 chamber.

About Marvell

Marvell first revolutionized the digital storage industry by moving information at speeds never thought possible. Today, that same breakthrough innovation remains at the heart of the company’ s storage, processing, networking, security and connectivity solutions. With leading intellectual property and deep system-level knowledge, Marvell’s semiconductor solutions continue to transform the enterprise, cloud, automotive, industrial and consumer markets. To learn more, visit: www.marvell.com

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Dial Down the Noise: Mouser Now Shipping Analog Devices and Coilcraft Solutions That Limit EMI in Automotive and Industrial Designs

Tuesday, July 24th, 2018

July 24, 2018 – Mouser Electronics, Inc. announces a new solutions page from Analog Devices and Coilcraft, developed to help designers address electromagnetic interference (EMI) concerns in automotive and industrial applications. The new page hosts a variety of reference material and paired electronic components to aid designers in achieving lower EMI using a combination of Analog Devices’ Silent Switcher® 2 LT8640S/LT8643S/LT8650S synchronous step-down regulators and Coilcraft’s power inductors.

Featuring Analog Devices’ second-generation Silent Switcher architecture designed to minimize EMI emissions, Analog Devices’ Silent Switcher 2 LT8640S, LT8643S, and LT8650S synchronous step-down regulators deliver high efficiency at high switching frequencies using a combination of bypass capacitors, a ground plane, copper pillars, and other components to optimize all the fast current loops. The 42 V, 6 A regulators offer a 2.5 µA quiescent current and up to 96 percent efficiency at 1 MHz, and provide fast, clean, and low-overshoot switching edges that enable high-efficiency operation and step-down ratios even at high switching frequencies.

When paired with the LT8640S, LT8643S, LT8650S regulators, Coilcraft’s power inductors can further reduce EMI in harsh and noisy environments. The Coilcraft XFL5030 series shielded power inductor features an exceptionally low DC resistance of only 2.15 milliohms. With excellent current handling up to 11.5 A, soft saturation, and a composite construction to minimize audible noise, the XFL5030 devices are ideal for high-frequency applications. The Coilcraft XEL6030 series high-current shielded power inductors offer exceptionally low DC resistance and ultra-low AC losses for high switching frequencies of 2 to 5 MHz. They provide excellent current handling with soft saturation characteristics to withstand high current spikes and deliver an inductance range from 0.15 µH – 3.3 µH. Both the XFL5030 and the XEL6030 series of devices meet the AEC-Q200 Grade 1 automotive specification and are RoHS-compliant and halogen-free.

For a detailed look at the technology behind the EMI-limiting solutions, Mouser offers a free white paper, “How to Dial Down the Noise: Limiting EMI.” In the white paper, Mouser’s Senior Technical Content Specialist, Paul Golata, illustrates how the Analog Devices and Coilcraft products can work together to deliver a low-EMI solution needed for today’s demanding applications.

To learn more about the solutions from Analog Devices and Coilcraft and to download the white paper, visit eng.info.mouser.com/adi-coilcraft-low-emi.

With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

 

 

About Mouser Electronics

Mouser Electronics, a Berkshire Hathaway company, is an award-winning, authorized semiconductor and electronic component distributor focused on rapid New Product Introductions from its manufacturing partners for electronic design engineers and buyers. The global distributor’s website, Mouser.com, is available in multiple languages and currencies and features more than 5 million products from over 700 manufacturers. Mouser offers 23 support locations around the world to provide best-in-class customer service and ships globally to over 600,000 customers in more than 220 countries/territories from its 750,000 sq. ft. state-of-the-art facility south of Dallas, Texas. For more information, visit www.mouser.com.

 

About Analog Devices, Inc.

Analog Devices is the leading global high-performance analog technology company dedicated to solving the toughest engineering challenges. We enable our customers to interpret the world around us by intelligently bridging the physical and digital with unmatched technologies that sense, measure, power, connect and interpret. Visit http://www.analog.com.

 

About Coilcraft

Coilcraft is a leading global supplier of magnetic components including high performance RF chip inductors, power magnetics and filters. In addition to a large selection of standard components, Coilcraft also designs and builds custom magnetics to fit a customer’s exact electrical requirements. Coilcraft is considered a preferred supplier because of its reputation for quality, reliable delivery, and engineering support, and for the superior performance of its products.

Contact Information

Mouser Electronics


toll-free: (800) 346-6873
http://www.mouser.com

“…the capability to store the entire trained model of the neural network…” Q&A with Sylvain Dubois, Crossbar

Tuesday, July 17th, 2018

Autonomous driving is just one of the applications hungry for processing at the edge, giving embedded memory growing strategic importance.

Editor’s Note: “The boundary between data and compute is really blurring now,” contends Sylvain Dubois. The vice president of strategic marketing and business development at ReRAM technology company Crossbar also explains why putting data and computing on the same chip is making more and more sense. I spoke with Dubois in May, shortly before Crossbar unveiled its collaboration with Microsemi. Microsemi products manufactured at the 1x nm process node will integrate Crossbar’s embedded ReRAM technology.

Crossbar ReRAM is enabling a new range of energy-efficient computing architectures compared to legacy SRAM or DRAM-based architectures.

EECatalog: Across AI, networking, computing, we’re seeing an increasing demand for embedded nonvolatile memory [NVM].

Sylvain Dubois, Crossbar: Yes, embedded memory is of strategic importance for CMOS foundries, and if you go to all of the top foundries’ Technology Symposiums such as TSMC, Global Foundries, UMC, Samsung, SMIC, they are all looking for ways to have access to embedded NVM (Non Volatile Memory) technologies: Flash all the way to 40 nm and then MRAM and ReRAM for 2x nm and 1x nm.

EECatalog: How is what Crossbar and Microsemi will be doing—integrating embedded ReRAM at 1x nm—going to make a difference for OEMs and developers?  Can you describe how a use case would change?

Dubois, Crossbar: A typical use case would involve bringing more computing power to the edge. More processing done locally, this includes wearables and hand-held devices, surveillance cameras and autonomous driving for example. And that brings up the whole topic of AI [Artificial Intelligence] inference at the edge, where you are not necessarily training the AI algorithms in the field but instead using the trained model so that the devices at the edge can recognize a face, a traffic sign. Crossbar’s ReRAM technology will make a difference with any pattern recognition task such as object or face detection. It’s what we demonstrated at the Embedded Vision Summit, showing how you can bring embedded ReRAM and neural networks together in a one-chip solution to make very low energy computing devices.

Today, what people are doing is trying to store the AI inference model, the weights and features of the neural network in the internal SRAM buffers on the chip. Because SRAM is not a dense memory; it won’t be big enough and the models will be partially stored in external DRAM banks that are very expensive and also very power hungry. Both SRAM and DRAM are volatile memory, meaning that they lose their content when powered down. This requires an additional layer of flash memory required to store the model when power is off.

But now with embedded ReRAM you have the capability to store the entire trained model of the neural network directly on chip. ReRAM retains its content for 10 years even when not powered, this eliminates the need for an external flash memory back-up and enables new use-models where the end-device can be frequently powered down and up to extend the battery life.

What we have designed is a specific memory array—a very wide memory array—with some amount of in-memory computing—pattern recognition, distance computation logic blocks. At the Embedded Vision Summit, we implemented a facial recognition demo showing a classification of a new face across a huge database of other faces in only once iteration.

EECatalog:  How did the demonstration turn out?

Dubois, Crossbar: It was very well received as this classification task or comparison of one input across a huge database of objects usually takes a lot of time and power. The value proposition here is that the comparison of one input across a huge database will be extremely deterministic, it always takes the same amount of time whatever the size of the database from very few pictures to 100,000 pictures. The computation is done in only one iteration, few clock cycles.

EECatalog:  How does that use case look if it’s not being accomplished with ReRAM?

Dubois, Crossbar: Today, if you want to do the same use case with embedded SRAM and external or stacked DRAMs and GPUs, it will be done in a serial manner, where the larger the database is, the longer time it will take, because you have to compare against all these multiple pictures of objects stored in the memory.

We provide a very energy-efficient way—because ReRAM is on-chip and non-volatile —to perform classification of objects, patterns, with fast and deterministic latencies, consuming less energy than SRAM/DRAM memories.

And it’s also very secure. Privacy matters when the database includes not only your face but also your biometrics and vocal commands. You don’t want the whole conversation in your living room to be processed in the cloud and potentially hackable by malware. Biometrics identification, speech recognition and classification of objects from surveillance cameras are typical use cases for energy-efficient computing and memory on the same chip.

EECatalog:  One of the big picture issues here ability to anticipate that next advanced process node and scale to it.

Dubois, Crossbar: Yes, it is important to pick a memory technology that scales because most of these AI chips or advanced SoCs, or microcontrollers, are currently designed at 22nm, 14nm, 12nm or even below 7 nm.

Crossbar ReRAM cells are programmed with a very low voltage across two electrodes causing the metal ions of the top electrode to move and thereby creating an extremely short narrow filament (3 or 4 nm). Growth of this metallic wire forms a conductive path, enabling a very low-resistance state. The ON current that is going through the filament determines the logic 1 state. When you want to have a logic 0 state, we just reverse the electric field so that the metal ions are pulled back to the top electrode, creating a high-resistance state, almost an open circuit.

Based on the metal filament physics that we grow and remove, the difference between ON and OFF current is extremely high, more than 1000X difference, providing great read margins and reliability to the ReRAM technology at the most advanced process nodes. As the filament is just 3 nm, going below 10 nm is something definitely possible with Crossbar ReRAM technology.

The ReRAM cell is so small that it can fit in between the metal routing layers of standard CMOS wafers. This is the reason why we can have a breakthrough architecture with millions of connection points between the logic and the memory compared to maximum thousands of connections with stacked DRAMs. It is a truly monolithic integration of embedded ReRAM and logic in the same silicon.

EECatalog:  Anything to add before we wrap up?

Dubois, Crossbar: The boundary between data and compute is really blurring now. Algorithms trained with lots of data and devices are now self-sufficient to perform object identification and pattern recognition with a minimum power budget. Crossbar ReRAM is enabling a new range of energy-efficient computing architectures compared to legacy SRAM or DRAM-based architectures. Crossbar is working with multiple partners to create innovative architectures where data and processing are integrated on same silicon chip.

For edge computing in hand-held mobile devices or home appliances, or cloud computing in data centers, people are starting to realize that they can cut their energy bill quite drastically by putting the data and the computing in the same chip. Most of the system companies are now expanding their strategies towards vertical integration of their business all the way to the chip manufacturing as it makes a lot of sense for a great differentiation.

WIN Enterprises Announces PL-81880 Fanless In-vehicle Computer

Tuesday, July 17th, 2018

Bringing IoT to the Road

 

July 17, 2018, WIN Enterprises, Inc., a leading designer and manufacturer of embedded x86 motherboards and appliances for OEMs, announces the PL-81880 in-vehicle computer for fanless Cloud-based Fleet Management.

From an IoT perspective, a vehicle is similar to an industrial manufacturing facility. It has sensors and actuators much like you would find on a manufacturing line and, likewise, a huge amount of data is generated by these devices. This data can be routed and consolidated into the PL-81880, serving as an IoT gateway. Using wireless communications, data is sent to servers in the Cloud for analyses and decision making by the company. Like an IIoT system helping to manage multiple facilities, in-vehicle computers can be used to manage fleets of vehicles.

FEATURES

  • DMP Vortex86 DX3-9126 CPU Onboard (SOC)
  • DDR3L 1333 2GB Memory IC onboard
  • Bluetooth OBD2 Module (Optional)
  • 1x VGA output and optional 1x LVDS 1 channel 18/24-bit output
  • 1x RJ-45 10/100M Fast Ethernet
  • 2x USB 2.0
  • 2x COM Port for RS232 TX & RX
  • 1x J1939/J1708 CAN BUS port
  • Onboard optional U-blox NEO-M8N GPS chip
  • G-sensor onboard
  • 1x external CFast socket or 1x M.2 Socket
  • 4GB eMMC Flash onboard(Optional)
  • 3 in (5V or 12V TTL selectable) & 3 out (12V TTL ,
  • Max. 100m A) GPIO
  • +9 – 36DC Wide-range Power Input

Depending on the software implemented on the PL-81880, both informatics and business data can be tracked.

About WIN Enterprises

WIN will modify its products based on its customers’ more specific needs. We aare an ISO 9001 certified product development company that designs and manufactures customized x86-based embedded systems and motherboards. Founded in 1991, WIN Enterprises develops reference designs for the leading microprocessor companies, as well as customized set-top boxes, rack-mounted appliances, and other electronic products for OEM customers. WIN Enterprises enables cost-effective design, manufacturing, and fulfillment services for corporations around the world. For more information, contact WIN Enterprises at +1 (978) 688-2000 or email sales@win-ent.

Contact Information

Win Enterprises, Inc.


http://www.win-ent.com/

Design Code Separately and Integrate Seamlessly with Dual-core dsPIC Digital Signal Controller

Sunday, July 15th, 2018

dsPIC33CH family optimized for high-performance and time-critical, real-world embedded control

CHANDLER, Ariz., June 25, 2018 — System developers designing high-end embedded control applications can benefit from a new Digital Signal Controller (DSC) with two dsPIC® DSC cores in a single chip, now available from Microchip Technology Inc. (NASDAQ: MCHP). The dsPIC33CH has one core that is designed to function as a master while the other is designed as a slave. The slave core is useful for executing dedicated, time-critical control code while the master core is busy running the user interface, system monitoring and communications functions, customized for the end application. The dsPIC33CH is designed specifically to facilitate independent code development for each core by separate design teams and allows seamless integration when they are brought together in one chip. For more information visit: www.microchip.com/dsPIC33CH.

The dsPIC33CH family is optimized for high-performance digital power, motor control and other applications requiring sophisticated algorithms. This includes applications such as wireless power, server power supplies, drones and automotive sensors. For example, in a digital power supply, the slave core manages the math-intensive algorithms, while the master core independently manages the PMBus™ protocol stack and provides system monitoring functions, increasing overall system performance and responsiveness. Distributing the overall workload across two DSC cores in a single device enables higher power density through higher switching frequencies, leading to smaller components. The dsPIC33CH family was designed for live updating of the system, which is especially important for power supplies where firmware updates must be made with zero downtime.

In an automotive fan or pump, the slave core is dedicated to managing time-critical speed and torque control while the master manages the Controller Area Network Flexible Data rate (CAN-FD) communications, system monitoring and diagnostics. The two cores work seamlessly together, enabling advanced algorithms to improve efficiency and responsiveness. In addition, each of the new cores in the dsPIC33CH devices has been designed to provide more performance than current dsPIC DSC cores through: 1) more context-selected registers to improve interrupt responsiveness; 2) new instructions to accelerate Digital Signal Processor (DSP) performance; and 3) faster instruction execution.

“Customers tell us one of their biggest challenges is integrating software from multiple teams where one team is focused on the time-critical control code and another is working on the rest of the application,” said Joe Thomsen, vice president of Microchip’s MCU16 business unit. “We created this dual-core product to simplify that software integration and optimize the performance for math-intensive applications.”

The dsPIC33CH family delivers unprecedented integration in a small 5 x 5 mm package and includes features such as CAN-FD communications. To reduce system costs and board size, advanced peripherals are available to each core including high-speed ADCs, DACs with waveform generation, analog comparators, analog programmable gain amplifiers and high-resolution Pulse Width Modulation (PWM) hardware. Having two cores, with dedicated peripherals, allows the cores to be programmed to monitor each other for functional safety reasons, facilitating robust system design.

For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s website. To purchase products mentioned in this press release, go to Microchip’s full-service channel microchipDIRECT or contact one of Microchip’s authorized distribution partners.

Development Support

The dsPIC33CH is supported by Microchip’s MPLAB® development ecosystem including Microchip’s free, downloadable and award-winning MPLAB X Integrated Development Environment (IDE) and MPLAB Code Configurator.

The dsPIC33CH Curiosity Board (DM330028) is a cost-effective and flexible platform, enabling customers to rapidly create a feature-rich prototype. The dsPIC33CH Plug-in Module (PIM) for motor control platforms (MA330039) is available for Microchip’s MCLV-2 and MCHV-2/3 systems. The dsPIC33CH PIM for general purpose platforms (MA330040) is now available for the Explorer 16/32 development board (DM240001-2).

Pricing and Availability

The dsPIC33CH is available in eight package variants. The 28-pin dsPIC33CH64MP202 is priced at less than $2.00 each in high volume.Variants include packages from 28 to 80 pins and as small as 5 x 5 mm. Memory sizes range from 64 to 128 KB of Flash.

The dsPIC33CH Curiosity development board is available now for $34.99 each.

The dsPIC33CH PIM for motor control development boards is available now for $25.00 each.

The dsPIC33CH PIM for use with Explorer 16/32 boards is available now for $25.00 each.

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Microchip Technology Inc.

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Automotive is driving SiC adoption

Friday, July 13th, 2018

Extracted from: Power SiC 2018: Materials, Devices and Applications report, Yole Développement – Release date: July 2018 | Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics report, System Plus Consulting – Release date: June 2018.

LYON, France – July 5, 2018: The SiC power market is now on the road, asserts Yole Développement (Yole). Therefore, since 2017, the market research and strategy consulting company identified more than 20 strategic announcements, showing the dynamism of this market and attractiveness of the technology. Rohm, Bombardier, Cree, SDK, STMicroelectronics, Infineon Technologies, Littelfuse, Ascatron and more are part of the powerful ecosystem, presenting innovative products and revealing key partnerships and/or M&A .

Today, SiC transistors are clearly being adopted, penetrating smoothly into different applications. Yole’s analysts forecast a US$1.4 billion SiC power semiconductor market by 2023. According to the Power & Wireless team at Yole, this market is showing a 29% CAGR between 2017 and 2023.

Power SiC report, 2018 edition presents Yole’s deep understanding of SiC penetration in different applications including xEV, xEV charging infrastructure, PFC/power supply, PV, UPS, motor drives, wind and rail. In addition, it highlights the state-of-the-art SiC-based devices, modules, and power stacks. Yole’s analysts also describe the SiC power industrial landscape from materials to systems, and analyze of SiC power market dynamics. This report proposes a detailed quantification of the SiC power device market until 2023, in value and volume.

SiC adoption is accelerating: is the supply chain ready? Yole’s analysts reveal today their vision of the SiC industry.

SiC market is still being driven by diodes used in PFC and PV applications. However Yole expects that in five years from now the main SiC device market driver will be transistors, with an impressive 50% CAGR for 2017-2023.

This adoption is partially thanks to the improvement of the transistor performance and reliability compared to the first generation of products, which gives confidence to customers for implementation.


Do SiC Technologies cross the chasm? Results from an understanding as of 2018.  (Source: Power SiC 2018: Materials, Devices and Applications, Yole Developpement, July 2018)

Another key trend revealed by Yole’s analysts is the SiC adoption by automotive players, over the next 5-10 years. “Its implementation rate differs depending on where SiC is being used,” comments Dr. Hong Lin, Technology and Market Analyst, Compound Semiconductors at Yole“That could be in the main inverter, in OBC or in the DC/DC converter. By 2018, more than 20 automotive companies are already using SiC SBDs or SiC MOSFET transistors for OBC, which will lead to 44% CAGR through to 2023.” 


Yole expects SiC adoption in the main inverter by some pioneers, with an inspiring 108% market CAGR for 2017-2023. This will be possible because nearly all carmakers have projects to implement SiC in the main inverter in coming years. In particular, Chinese automotive players are strongly considering the adoption of SiC.

The recent SiC module developed by STMicroelectronics for Tesla and its Model 3 is a good example of this early adoption. The SiC-based inverter, analyzed by System Plus Consulting, Yole’s sister company is composed of 24 1-in-1 power modules. Each module contains two SiC MOSFETs with an innovative die attach solution and connected directly on the terminals with copper clips and thermally dissipated by copper baseplates. The thermal dissipation of the modules is performed thanks to a specifically designed pin-fin heatsink.
“SiC MOSFET is manufactured with the latest STMicroelectronics technology design,” explains Dr. Elena Barbarini, Head of Department Devices at System Plus Consulting.“This technical choice allows reduction of conduction losses and switching losses”. STMicroelectronics is strongly involved in the development of SiC-based modules for the automotive industry. During its recent Capital Markets Day, the leading player details its activities in this field (Source: Automotive & Discrete Group presentation – May 2018). STMicroelectronics is also commited in the development of innovative packaging solutions. . System Plus Consulting proposes today a complete teardown analysis including a detailed estimation of the production cost of the module and its package.

PV has also caught the attention of Yole’s analysts during recent months. China claimed almost the half of the world’s installations in the last year. However due to new governmental regulations, Yole sees a slow down of the PV market in short term and has lowered its expectation of SiC penetration for the segment.

In general, system manufacturers are interested in implementing cost effective systems which are reliable, without any technology choice, either silicon or SiC. “Today, even if it’s certified that SiC performs better than silicon, system manufacturers still get questions about long term reliability and the total cost of the SiC inverter”, comments Dr. Ana Villamor, Technology & Market Analyst, Power Electronics & Compound Semiconductors at Yole.

Full collection of compound semiconductors and power electronics reports on is available on i-micronews.com.

 


Do SiC Technologies cross the chasm? Results from an understanding as of 2018.  (Source: Yole Developpement)

Yole and System Plus Consulting teams will attend SEMICON Europa 2018 (Munich, Germany – November 13-16). During the leading trade show, Dr. Milan Rosina, Senior Technology & Market Analyst, Power Electronics & Batteries at Yole proposes a dedicated WBG presentation on November 15 at 2:30 PM.
SiC and GaN devices have demonstrated their large potential for power electronic applications. During the presentation “GaN and SiC power device: market overview” taken place during the Power Electronics Session, Dr. Rosina proposes an overview of the market, technology and the industrial supply chain. More information available on i-micronews.com, Conferences & Trade Shows section.

Acronyms:
SiC: Silicon Carbide
M&A: Mergers and acquisitions
CAGR : Compound Annual Growth Rate
PFC : Power Factor Correction
PV : photovoltaic
OBC : On-Board Charger
SBD : Schottky barrier diodes
MOSFET : Metal-Oxide Semiconductor Field-Effect Transistor

Contact Information

Yole Développement


http://www.yole.fr/

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