IBM Research – Almaden Vice President to Keynote at The ConFab 2019
The ConFab, Preeminent Semiconductor Manufacturing and Design Conference slated for May 14-17, Announces IBM VP and Lab Director will Deliver Address on Advanced Computing Technologies for AI
LAS VEGAS, NV –The ConFab – an exclusive conference and networking event targeted to semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies – is proud to announce its opening Keynote speaker, the distinguished Dr. Jeffrey J. Welser from IBM Research – Almaden. Being held at The Cosmopolitan of Las Vegas from May 14-17, Pete Singer, The ConFab Conference Chair and Editor in Chief of Solid State Technology, will welcome Dr. Welser to the stage on May 15.
In what promises to bring the audience valuable insights, Dr. Welser will continue on the theme established at The ConFab in 2018: Artificial Intelligence. AI, which represents a market opportunity $2 trillion on top of the existing $1.5-2B information technology industry, is seen as a huge game changer in the semiconductor industry. In addition to AI chips from traditional IC companies such as Intel, IBM and Qualcomm, more than 45 start-ups are working to develop new AI chips, with VC investments of more than $1.5B. Tech giants such as Google, Facebook, Microsoft, Amazon, Baidu and Alibaba are also developing AI chips. Dr. Welser will describe how making AI semiconductor
engines will require a wildly innovative range of new materials, equipment, and design methodologies. To get to the next level in performance/Watt, innovations being researched at the AI chip level – at IBM and elsewhere — include: low precision computing, analog computing and resistive computing.
“Dr. Welser has great insight into how AI will be used to analyze the vast amounts of unstructured data being generated today, the various approaches to AI, and the kinds of innovations that will be needed at the chip level,” said Pete Singer. “We did a deep dive into AI in 2018 with speakers from IBM, Google, Nvidia, HERE Technologies, Silicon Catalyst, TechInsights, Siemens and Qorvo, among others. We’re delighted that Dr. Welser will build upon that in 2019 with his kickoff keynote.”
As Vice President and Lab Director at IBM Research – Almaden, Dr. Welser oversees exploratory and applied research. Home of the relational database and the world’s first hard disk drive, Almaden today continues its legacy of advancing data technology and analytics for Cloud and AI systems and software, and is increasingly focused on advanced computing technologies for AI, neuromorphic devices and quantum computing. After joining IBM Research in 1995, Dr. Welser has worked on a broad range of technologies, including novel silicon devices, high performance CMOS and SOI device design, and next generation system components. He has directed teams in both development and research as well as running industrial, academic and government consortiums, including the SRI Nanoelectronics
Additional industry experts adding to The ConFab 2019 Agenda will be announced soon.
About The ConFab
The ConFab, now in its 15th year, is the premier semiconductor manufacturing and design conference and networking event that brings notable industry leaders together to connect and collaborate. For more information, visit www.theconfab.com. To inquire about participating, if you represent an equipment, material or service supplier, contact Kerry Hoffman, Director of Sales at email@example.com; contact Sally Bixby at firstname.lastname@example.org about attending as a guest.
About Extension Media
Extension Media is a privately held company operating more than 50 B2B magazines, engineers’ guides, newsletters, websites and conferences that focus on high-tech industry platforms and emerging technologies such as: chip design, semiconductor and electronics manufacturing, embedded systems, software, architectures and industry standards. Extension Media also produces industry leading events which include The ConFab, Internet of Things Developers Conference (IoT DevCon), Machine Learning Developers Conference (ML DevCon), and the IoT Device Security Summit in addition to publishing Solid State Technology and Solid-State.com, Chip Design, ChipDesignMag.com,
Embedded Systems Engineering, EECatalog.com, Embedded Intel® Solutions, and EmbeddedIntel.com.