News
November - 2018
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- Avnu Alliance Demonstrates New Conformance Test Reference Tool at SPS IPC Drives
 Avnu Alliance, an industry consortium enabling open, standards-based deterministic networking, will exhibit at SPS IPC Drives in the University Stuttgart ISW booth (Hall 6, Booth
- Pixus Announces Fully Redundant CompactPCI Chassis with Alarm Functionality
Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers 1U-4U CompactPCI enclosures with full hot-swappability and redundancy. The new Pixus enclosures
- Atrenne Announces Launch of The 717-SM Series ATR
Atrenne Computing Solutions, a Celestica company, announces the release of the 717-SM Series ATR. This new rugged electronic packaging design performs in the harshest military and
- EMAC Inc introduces the CutiPy™ Industrial IoT Microcontroller
Designed and Manufactured in the USA the CutiPy⢠Industrial IoT microcontroller was created to simplify connecting devices and machines to the multitude of systems found in an industrial
- DEV-IOT6U Industrial IoT ARM Development Kit
Designed and manufactured in the USA, the DEV-IOT6U is an easy to use Industrial IoT ARM development kit. This simple to deploy Internet of Things dev kit is based on the EMAC SoM-iMX6U;
- congatec launches i.MX 8X on SMARC 2.0 and Qseven modules
The new benchmark for 2 - 4 watt applications  congatec â a leading vendor of standardized and customized embedded computer boards and modules â is presenting new versions of
- Volkswagen, Mobileye and Champion Motors to Invest in Israel and Deploy First Autonomous EV Ride-Hailing Service
The Volkswagen Group, Mobileye, an Intel Company, and Champion Motors announced plans to deploy Israel's first self-driving ride hailing service â or Mobility-as-a-Service (MaaS)
- XPand6215 Small Form Factor (SFF) System from X-ES Features 10 Gb/s Optical Links for High-Bandwidth Embedded Computing
Verona, WI â November 14, 2018 - The latest 3U VPX embedded system from Extreme Engineering Solutions (X-ES) sets a new standard for high-bandwidth data acquisition and signal processing
- The micro-machined ultrasonic transducers market is taking off. Why now?
Ultrasound has a very old history. The ecosystem is mature and there are numerous applications and technologies. As part of this ultrasound industry, the semiconductor technologies
- Renesas Electronics' Extreme Low-Power SOTB™ Process Technology Eliminates the Need for Batteries to Power IoT Devices
Ground-Breaking Energy Harvesting Embedded Controller Operates on Current Levels Not Possible with Conventional Technology Renesas Electronics Corporation (TSE:6723), a premier supplier
- Bosch provides customized IoT and Industry 4.0 solutions
Bosch Mondeville and Bosch Connected Devices and Solutions collaborate to meet a wide variety of customer requirements Bosch Connected Devices and Solutions provides IoT sensor
- 2018, a new year for RF FE module market
OUTLINES: 2018 is a new year for RF Front-End Module suppliers, and a turning point for some smartphone-making OEMs. How is 5G enabling new business opportunities despite
- Bosch MEMS sensors now enable faster airbag deployment
New high-G acceleration sensors increase driver and passenger safety MEMS sensors improve driver and passenger safety in motor vehicles Accurate signal detection with faster
- Moxa and Trend Micro Announce Letter of Intent for Joint Venture to Tackle Security Needs in Industrial IoT Environments
Moxa Inc., a leader in industrial communications and networking, and Trend Micro Incorporated, a global leader in cybersecurity solutions, today announced they have executed a letter of intent relating to the formation of a joint-venture corporation-TXOne Networks-which will focus on the security needs present in the Industrial Internet of Things (IIoT) environments, including smart manufacturing, smart city, smart energy and more.
- EFCO Announces The First Industrial Embedded Vision System With Artificial Intelligence Monitoring and Predictive Maintenance Via the New Ekit Software Package
New Product Supports the Greatest Number of Cameras in a Compact Fanless System EFCO, a world-class supplier of industrial PC, Gaming and EMS solutions, today introduced Eagle
- SMART Modular Announces its 96GB Gen-Z Memory Module (ZMM)
Supports OEMs adopting the new Gen-Z high bandwidth, low latency interconnect protocol standard for handling big data SMART Modular Technologies, Inc., a subsidiary of SMART Global
- AAEON Releases Powerful, New DIN Rail Mount Box PC
AAEON, a leading developer of industrial computing solutions, releases the BOXER-6750, a DIN rail-mount-designed box PC with a rich I/O interface. The compact BOXER-6750 measures
- SMART Modular Launches nvNITRO NVMe Storage Accelerator Featuring MRAM Technology in New U.2 Form Factor
The nvNITRO⢠U.2 Storage Accelerator provides ultra-low latency to dramatically improve system performance SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings,
- New low-cost rugged Bay Trail single board computer
VersaLogic Corp., the embedded industry's most trusted computer company, has announced "SandCat"âa low-cost rugged new PC/104-Plus⢠Single Board Computer (SBC). Based on Intel's
- Axiomtek Introduces Industrial ATX Motherboard powered by 8th Generation Intel® Core™ with Optimum Connectivity and Great Performance - IMB523
Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency
- ROHM's New 1700V SiC Power Module
Achieves the highest level* of reliability in extreme environments   *ROHM November 2018 study ROHM today announced the development of a 1700V/250A rated SiC power module that
- Adesto’s EcoXiP Supports New JEDEC Standards to Pave the Way for a New Era of Smart Devices and Edge Processing
First Company to Ship Serial NOR Flash Devices Supporting New Specifications for Non-Volatile Memory Adesto Technologies (NASDAQ: IOTS), a leading provider of innovative application-specific
- Microchip Technology today announced two industry-first products at Electronica, including the SAM R34 LoRa System-in-Package (SiP) family and INICnet technology for automotive infotainment networking
The SAM R34 LoRa SiP offers industry-leading low power consumption, enabling long-range wireless connectivity while extending system battery life in remote IoT nodes. Additional features
- INICnet Technology Simplifies Automotive Infotainment Networking with Support for Ethernet, Audio and Video Over a Single Cable
With the addition of mobile services, cross-domain communication and autonomous driving applications to in-vehicle networking, infotainment systems require a more flexible solution for transporting packet, stream and control content.
- MultiTech Helps Customers Transition to LTE with Launch of Newest Cellular Modems
Multi-Tech Systems, Inc., a leading global manufacturer of M2M and IoT devices, today announced the availability of its new 4G-LTE Cat 4 MultiConnect® Cell 100 series cellular modems, certified and approved for use in North America and Europe.
- Accelerate Development of Remote IoT Nodes with the Industry’s Lowest-power LoRa System-in-Package Family
LoRa® (Long Range) technology is extending the reach of the Internet of Things (IoT) by combining long-range wireless connectivity with low-power performance.
- Tiny Coin-Shaped Development Kit from STMicroelectronics Delivers Sensor Fusion, Voice Capturing, and Bluetooth 5.0 Mesh Networking
BlueNRG-Tile is the core of a new all-in-one IoT-node development kit from STMicroelectronics.
- Avnet and Octonion Working to Deliver AI and Security at the Edge
Success in todayâs Internet of Things (IoT) marketplace requires unique combinations of hardware, software and security delivered in a timely manner to solve complex technical requirements.
- WDL Systems proudly distributes Innodisk’s 2.5” SATA SSD 3MR-P with MIL-STD-810-F/G compliance
2.5â SATA SSD 3MR-P from Innodisk is a SATA III 6.0Gb/s flash based disk which delivers excellent performance and reliability. Data security functions, including Quick Erase/ Security
- Micron Joins CERN openlab, Bringing New Machine Learning Capabilities to Advance Science and Research
Micron Technology, Inc., (Nasdaq: MU) an industry leader in innovative memory and storage solutions, today announced the company has joined CERN openlab, a unique public-private partnership, by signing a three-year agreement.
