Big Iron Conundrums
Published. May 24, 2013
Tradeoffs between power and performance are far less obvious inside data centers than in the mobile market....
New Processor Core Options Try Some ARM Wrestling
Published. May 13, 2013
When designing a system on a chip (SoC) that employs one or more embedded processor cores, the choice of available processors continues to expand. At last month’s Design West conference in San Jose, Calif., designers were presented with many processor options. Leading the pack, ARM, with its broad array of cores offers a wide range of [...]...
Getting Ready for DAC
Published. May 20, 2013
DAC is in Austin this year, and I’ll be headed over from College Station to check out the latest and greatest in functional verification technology. I haven’t attended DAC since 2007 and I can’t wait to see how things have … Continue reading →...
Long Standards, Twinkie IP, Macro Trends, and Patent Trolls
Published. May 10, 2013
In Part II, IP Extreme’s Savage reveals why IP standards take so long while discussing brand values, macro trends, and changes wrought by patent trolls....
Intel vs GM: What’s In Store for Intel’s New CEO, President
Published. May 2, 2013
Today chip giant Intel announced outgoing CEO Paul Otellini’s replacement: he’s Brian Krzanich, former Intel COO and likely an Intel lifer. As Otellini bids goodbye at the annual stockholders’ meeting on May 16, Krzanich moves in as the company’s sixth … Continue reading →...
EUV and eBeam at SPIE ADV Litho 2013
Published. March 1, 2013
While the main manufacturing flows are still focusing on optical lithography, eBeam and EUV are still making progress on advancements waiting for their chance in the main flow of the fab line. EUV is still working on power and throughput. A challenge for the industry is the dual sided consolidation for the advanced node development. [...]...
Intel Xeon Phi Announcement (& me)
Published. February 6, 2013
1. No, I’m not dead. Not even sick. Been a long time since a post. More on this at the end. 2. So, Intel has finally announced a product ancestrally based on the long-ago Larrabee. The architecture became known as MIC (Many Integrated Cores), development vehicles were named after tiny towns (Knights Corner/Knights Ferry – one was to be the product, but I could never keep them straight), and the final product is to be known as the Xeon Phi. Why Phi? I don’t know. Maybe it’s the start...
My Summer Vacation
Published. September 28, 2010
Blogging has been something that slipped off my radar for the past year. Here’s a reboot to see if I can get this going again. I’ll start with where my brain has been the past 9 months. Once I have this out, the plan is to start blogging about my thoughts on industry happenings, needs, [...]...
Wizards of Electromagnetism
My Interview on EE Web
Published. December 8, 2011
Interview with me, Colin Warwick, at EE Web...
Nick MacKechnie-Stuck somewhere between family life and IT...
How Microsoft IT Implemented Disaster Recovery in the Datacenter
Published. April 25, 2012
Microsoft IT Showcase is pleased to announce the publication of How Microsoft IT Implemented Disaster Recovery in the Datacenter, which discusses DR consolidation and centralization within Microsoft, plus best practices for any large organization. Microsoft builds disaster recovery (DR) into its applications and systems. Recently, Microsoft Information Technology (Microsoft IT) improved DR planning by consolidating and centralizing its DR efforts. The new plan focuses on the critical processes...
Why Trust your Chip Success to an Afterthought?
Published. February 17, 2011
At a recent DesignCon, I attended the panel, “The Same Chip Killers Keep Delaying Your Schedules – What Are You Doing About It?” consisting of Ed Sperling (Moderator/System-Level Design), John Busco (NVIDIA), Ravi Damaraju (Juniper Networks), Ramon Macias (NetLogic Microsystems), Sunil Malkani (Broadcom), and Bernard Murphy (Atrenta Inc). I saw two common themes that I have [...]...
DSPBridge Open Source DSP Development On OMAP
Published. December 3, 2011
The DSPBridge project allows open-source developers to use the OMAP processor’s on-chip DSP with embedded Linux. The DSP support is configured as a device driver when compiling the kernel, for details see the DSPBridge Project WIKI page on OMAPpedia.org. Sample code is included that demonstrate common tasks. There are a few articles on DSPBridge for [...]...
Teardown Signals Transition from GaAs to CMOS Power Amplifiers In 3G Handsets
Published. November 30, 2012
Although, working CMOS based 3G RF power amplifiers (PAs) were demonstrated several years ago, the transition from 2G to 3G handsets has not been that easy for CMOS. Concerns over performance have severely limited its progression in the 3G space. … Continue reading →...
Don’t get tied up in knots with your cables!
Published. September 28, 2011
It always seems like it’s the little things that often cause the most problems with your embedded system. The more I work with electronic systems, the more respect and care I have developed for cables and interconnect systems. This goes … Continue reading →...
EECatalog Tech Videos
Zilog’s participation in the global electronics industry’s leading gathering for the design engineering community was a great success. With Zilog’s cutting edge product demonstrations, DESIGN West was the ideal venue to showcase their world-class products. Take a look at Steve Darrough, Zilog’s VP of Sales & Marketing, being interviewed about Zilog’s dynamic demonstrations.
Business Development Manager, Kevin Belnap demonstrates the latest platforms for digital audio. These platforms are perfect for those developing Smartphone / Portable Music Player docks or audio mixing solutions.
An introduction to B&B Electronics' newest, easy to use wireless Ethernet bridge. The GhostBridge creates a transparent, secure, high-speed (up to 150Mbps), point-to-point link between two remote devices or networks. The GhostBridge is sold in pre-configured pairs with PoE pass-through Ethernet ports to connect local devices like IP cameras. It is ready to go right out of the box, and requires no further configuration or software setup.
This 5 minute tour introduces the new features in ARM DS-5 version 5.14 including ARM big.LITTLE processing support, improved compiler, multi-core debugger and trace synchronization, power and temperature monitoring and much more...
EnerChip smart solid state batteries are made using semiconductor process on silicon wafers. EnerChips can be used in bare die form and co-packaged with other integrated circuits in a single package. This Embedded Energy configuration means energy storage can be integrated into devices where legacy batteries and super capacitors cannot be used.
http://mchp.us/HBJCgN This video demonstrates Microchip's MTS2916A stepper motor driver that is managed by a PIC microcontroller for driving one bipolar stepper motor or two brushed DC motors.
http://mchp.us/11p6PO1 Introducing the MCP19111 - Microchip's first Digitally-Enhanced Power Analog Product
Featured White Papers
Xilinx Zynq™-7000 All Programmable SoCs enable extensive system level differentiation, integration, and flexibility through hardware, software, and I/O programmability. Design smarter systems with tightly coupled software based control and analytics with real time hardware based processing and optimized system interfaces — with vastly lower BOM costs, lower NRE costs, lower design risk, and much faster time to market. Learn the nine reasons why Xilinx Zynq-7000 SoCs are a generation ahead of alternatives and the smartest solution.
DO-178C is the how-to manual for complying with Title 14 Code of Federal Regulations (14 CFR), which outlines the software development requirements for FAA approval. This paper focuses on specific processes, such as verification and validation activities, traceability, testing methods, and test environments described in DO-178C.
As tablets and smart phones become more ubiquitous in the corporate and M2M business world, connecting to older technologies – especially serial ports -- has become a bit more complicated. This article will describe the ways in which embedded AP modules can solve the problem by creating small, self-sustaining Wi-Fi network around your equipment. This doesn’t change the way the your existing devices are used, it just makes them easily accessible to tablets and phones.
Steady improvements in wireless technology are allowing more and more devices to establish wireless connectivity with the same reliability that has already been achieved with cable communications. Better still, it is becoming possible to make these kinds of connections in increasingly difficult environments and with legacy equipment. This article will describe some of the techniques you can use to make those connections seamless.
If you’re not designing Wi-Fi (802.11) into your systems already, you’ll be doing so very soon. Wi-Fi is rapidly establishing itself as the standard wireless connection for industrial devices. But there no need to start from scratch. This article will describe some of the ways in which vendors can serve as your 802.11 firmware and hardware development partners, and how they can save you time, money and trouble while doing so.
Unique Solid State Rechargeable Batteries are being used by Medical, Industrial Control, Consumer Electronics, Appliance and Smart Energy companies to power their new innovative electronic product designs. These batteries have capabilities that are superior to legacy energy storage devices such as coin cell batteries and supercapacitors. This white paper identifies the product requirements and technical specifications that are addressed by Cymbet EnerChip smart rechargeable solid state batteries.
New Threats Demand New Strategies
The network is the door to your organization for both legitimate users and and would-be attackers. For years, IT professionals have built barriers to prevent any unauthorized entry that could compromise the organization's netw