• JB’s Circuit

    JB’s Circuit

    EDA Tool Reduces Chip Test Time With Same Die Size
    Published. February 4, 2016

    Cadence combines physically-aware scan logic with elastic decompression in new test solution. What does that really mean?...

  • Chris A. Ciufo on All Things Embedded

    Chris A. Ciufo on All Things Embedded

    From ARM TechCon: Two Companies Proclaim IoT “Firsts” in mbed Zone
    Published. November 13, 2015

    UPDATE: Blog updated 14 Dec 2015 to correct typos in ARM nomenclature. C2 Showcased at ARM’s mbed Zone, Silicon Labs and Zebra Technologies show off two IoT “Firsts”. ARM’s mbed Zone—a huge dedicated section on the ARM TechCon 2015 exhibit … Continue reading →...

  • Iconic Embedded

    Iconic Embedded

    Who is Taking Cybersecurity Seriously, and why You Should be Worried
    Published. May 25, 2015

    By Alan Grau, Icon Labs On a daily basis, I have the opportunity to interact with a wide range of companies and people involved in embedded device development and cybersecurity for embedded devices.  I was recently struck by the difference in attitudes regarding cybersecurity at three diverse companies.  Each company representative had a very different [...]...

  • The Internet of Things

    The Internet of Things

    Making the 8051 Secure from Hacking in the Smart Home Internet of Things
    Published. April 24, 2015

    By Jonah McLeod, Silicon Valley Blogger Jauher Zaidi, Chairman and Chief Innovation Officer of Palmchip Corp. based in Temecula, Calif. is bullish on the 8-bit 8051 CPU core for applications in the smart home Internet of Things (IoT). This is a market that Park Associates predicts will grow from 25 million units this year to [...]...

  • The Canonical Hamiltonian

    The Canonical Hamiltonian

    Part II: The Ecstasy and the Agony of UVM Abstraction and Encapsulation Featuring the AMIQ APB VIP
    Published. April 23, 2015

    Part II of our tour through UVM reusability through TLM ports and the factory in the AMIQ APB VIP. by Hamilton Carter – Senior Editor Tuning the Receiver Part I didn’t answer how, (or indeed if), the monitor’s messages make their way over to the write_item_from_mon method in the coverage collector.   Remember, the method is [...]...

  • Chipnastics


    EDA Community Honors Lucio Lanza with Phil Kaufman Award
    Published. November 14, 2014

    Over the many years I have spent as an editor, there are a few people that stand out for their creativity and impact on the semiconductor industry. One such person, Dr. Lucio Lanza, more than qualifies as one of those standouts. He was just honored by the Electronic Design Automation community with the 2014 Phil [...]...

  • EmbeddedPC


    Don’t get tied up in knots with your cables!
    Published. September 28, 2011

    It always seems like it’s the little things that often cause the most problems with your embedded system.  The more I work with electronic systems, the more respect and care I have developed for cables and interconnect systems.  This goes … Continue reading →...

  • The Perils of Parallel

    The Perils of Parallel

    Intel Xeon Phi Announcement (& me)
    Published. November 24, 2013

    1. No, I’m not dead. Not even sick. Been a long time since a post. More on this at the end.2. So, Intel has finally announced a product ancestrally based on the long-ago Larrabee. The architecture became known as MIC (Many Integrated Cores), development vehicles were named after tiny towns (Knights Corner/Knights Ferry – one was to be the product, but I could never keep them straight), and the final product is to be known as the Xeon Phi.Why Phi? I don’t know. Maybe it’s the start of a convention...

  • Pallab's Place

    Pallab's Place

    EUV and eBeam at SPIE ADV Litho 2013
    Published. March 1, 2013

    While the main manufacturing flows are still focusing on optical lithography, eBeam and EUV are still making progress on advancements waiting for their chance in the main flow of the fab line. EUV is still working on power and throughput. A challenge for the industry is the dual sided consolidation for the advanced node development. [...]...

  • Domeika’s Dilemma

    Domeika’s Dilemma

    My Summer Vacation
    Published. September 28, 2010

    Blogging has been something that slipped off my radar for the past year. Here’s a reboot to see if I can get this going again. I’ll start with where my brain has been the past 9 months. Once I have this out, the plan is to start blogging about my thoughts on industry happenings, needs, [...]...

  • Wizards of Electromagnetism

    Wizards of Electromagnetism

    My Interview on EE Web
    Published. December 8, 2011

    Interview with me, Colin Warwick, at EE Web...

  • Hardware/Firmware Interfacings

    Hardware/Firmware Interfacings

    Why Trust your Chip Success to an Afterthought?
    Published. February 17, 2011

    At a recent DesignCon, I attended the panel, “The Same Chip Killers Keep Delaying Your Schedules – What Are You Doing About It?” consisting of Ed Sperling (Moderator/System-Level Design), John Busco (NVIDIA), Ravi Damaraju (Juniper Networks), Ramon Macias (NetLogic Microsystems), Sunil Malkani (Broadcom), and Bernard Murphy (Atrenta Inc). I saw two common themes that I have [...]...

  • Discourse on Embedded Signal Processing

    Discourse on Embedded Signal Processing

    DSPBridge Open Source DSP Development On OMAP
    Published. December 3, 2011

    The DSPBridge project allows open-source developers to use the OMAP processor’s on-chip DSP with embedded Linux. The DSP support is configured as a device driver when compiling the kernel, for details see the DSPBridge Project WIKI page on  Sample code is included that demonstrate common tasks.  There are a few articles on DSPBridge for [...]...

  • RF/Microwave Tracker

    RF/Microwave Tracker

    Teardown Signals Transition from GaAs to CMOS Power Amplifiers In 3G Handsets
    Published. November 30, 2012

    Although, working CMOS based 3G RF power amplifiers (PAs) were demonstrated several years ago, the transition from 2G to 3G handsets has not been that easy for CMOS. Concerns over performance have severely limited its progression in the 3G space. … Continue reading →...