ARM Tips Strategy to Crack Server Market
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Guide to EDA tools, semiconductor technologies and services
Q: Should I put some sort of circuit between my sensor and an analog-to-digital converter?
A: Yes. You probably need some signal conditioning. The explanation below goes on for a bit, but stay with it and you'll understand what you need and why you need it.
USB-IF Worldwide Developers Days introduced developers to the new USB 3.1 specification. This white paper digs deep into 10G USB 3.1 to clarify the evolutionary and revolutionary changes in the specification.
Chip-package co-design is important for several reasons. Designing a large high power die, e.g. a System-on-Chip (SoC) without considering how to get the heat out is likely to lead
Today, the ability to track the orientation or position of a device is a common feature in many portable and wearable products. Computing the orientation is a non-trivial task that converts inputs from multiple motion sensors into accurate position information. This computation is called sensor fusion and it eliminates inaccuracies from noisy sensor inputs. This paper shows how using DesignWare® ARC® Processor EXtension (APEX) technology improves cycle count and energy consumption for a power-efficient implementation of a 9D fusion algorithm on an IP subsystem.
Many aspects of a PCB’s performance are determined during detailed design. Thermal issues with the PCB design are largely ‘locked in’ during the component (i.e. chip package)
Recently, physics-based reliability prediction has related electronic assembly failure rates to the rate and magnitude of temperature change over an operational cycle, both of which are influenced by steady-state operating temperature. Whether the intention is to increase reliability, or improve performance, accurate prediction of component temperatures helps meet design goals.
A natural focus when designing electronics products are, well the electronics. The electronics itself however, needs to work within some kind of enclosure, and must be designed with the enclosure in mind. Cooling is a system issue, which is why we advocate a top-down approach, starting at the enclosure level.
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Embedded editor Chris A. Ciufo chats with Ian Drew, CMO, ARM. In part 2, the guys discuss: ARM's mbed/mbed OS and Cortex-M7; the easy path to the IoT is made easy by ARM's new mbed
Embedded editor Chris Ciufo chats with Ian Drew, CMO, ARM. ARM's move into 64-bit servers with HP's recent “Moonshot” announcement; how the IoT grows from the enterprise and handsets; and ARM partners' complete infrastructure for servers.
Cristian Amitroaie, CEO of Amiq, talks with John Blyler about Specador, a automated HTML documentation tool for chip design and verification engineers. This tool generates meaningful documentation even from poorly documented source code, as it actually compiles the code and can generate cross-link class inheritance trees, design hierarchies, and diagrams. The need for this functionality lead to an interesting discussion about the software programming process and why programmers rarely document their own work.
Intellitech's CEO CJ Clark explains why the latest JTAG update brings much needed capabilities to IP providers and IC developers alike.
Motion sensing applications with mm wave technology at Imec is the topic of this interview between Liesbet Van der Perre, Imec Program Director of Wireless Communication, and John Blyler, VP and CCO at Extension Media.
Wally Rhines, Chairman and CEO of Mentor Graphics, talks about Moore's Law in light of the Learning Curve; 28nm as the golden node; critical need for IoT innovations; and why systems engineering often fails.
In our third interview at the Design Automation Conference in Austin, Texas, John Blyler of Chip Design Magazine talks with Dennis Bibeau of Infotech about the importance of collaboration across all disciplines in achieving innovative chip design.