EDA Industry to Recognize Dr. Chenming Hu With the Phil Kaufman Award at DAC 2013

Honored for Major Contributions to Transistor Modeling Enabling the Generation of FinFET Based Design

Dr. Chenming Hu, TSMC Distinguished Professor of the Graduate School at the University of California, Berkeley, has been selected by the EDA Consortium (EDAC) and the IEEE Council of EDA (CEDA) as recipient of the 2013 Phil Kaufman Award for Distinguished Contributions to Electronic Design Automation (EDA). He will receive this award at the opening ceremony of the largest EDA event, the Design Automation Conference (DAC) on June 2, 2013, in Austin, Texas. Dr. Hu is being recognized for his contributions in device physics, device modeling, and device reliability through BSIM and BERT models that have transformed the semiconductor manufacturing and electronic design automation industries. Dr. Hu’s team invented the revolutionary 3D FinFET transistor structure that simultaneously achieves size and power reduction to enable continued scaling of the microelectronic chips.

In a career spanning four decades, Dr. Hu has advanced semiconductor technologies through nearly one thousand research publications, building industry leading companies, and training hundreds of graduate students. Dr. Hu received a bachelor degree from National Taiwan University, masters and PhD degrees from UC Berkeley. He served on the faculty of MIT and UC Berkeley as well as the chief technology officer for TSMC, the world’s largest semiconductor foundry. He founded Celestry Design Technologies, later acquired by Cadence Design Systems. He was elected to the US National Academy of Engineering in 1997, the Academia Sinica in 2004, and the Chinese Academy of Sciences in 2007. He received the IEEE Andrew S. Grove Award, the Don Pederson Award, the Jun-Ichi Nishizawa Medal for his contributions to MOSFET device, technology and circuit design, and UC Berkeley’s highest honor, the Berkeley Distinguished Teaching Award. Dr. Hu served as a board chairman of the nonprofit East Bay Chinese School and currently serves on the board of the nonprofit Friends of Children with Special Needs.

“The Award celebrates Chenming’s contributions to the EDA industry for the BSIM compact models widely used to design all types of integrated circuits, spanning logic, memory, analog and RF products. His technical contributions have profoundly affected directions in device technology as with the FinFET, all aspects of device reliability, and non-volatile memory technology. His graduates serve in senior leadership positions globally. With this award, the semiconductor industry collectively applauds Chenming’s monumental impact,” added this year’s award presenter Klaus Schuegraf, Group Vice President of EUV Product Development, Cymer, Inc.

Aart J. de Geus, Chairman and co-CEO of Synopsys, Inc. and EDAC Chairman of the Award Selection Committee said, “Recognizing Chenming Hu the very year in which the entire EDA, IP, and Semiconductor industry is unleashing the next decade of IC design through the 16/14nm FinFET generation is not a coincidence, but illustrates how a great contributor can impact an entire industry!”

“Professor Hu’s work and life stands as an example of tremendous contributions to science, technology, and society that would make Phil Kaufman proud. IEEE CEDA is a proud partner to EDAC in honoring such a luminary,” said Donatella Sciuto, president of CEDA.

About the Phil Kaufman Award

The Phil Kaufman Award honors individuals who have had demonstrable impact on the field of EDA through technology innovations, education/mentoring, business or industry leaderships. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. Last year’s recipient was C. L. (David) Liu, former president of the National Tsing Hua University for his algorithmic EDA contributions.

About the EDA Consortium

The EDA Consortium is the international association of companies that provide design tools and services that enable engineers to create the world’s electronic products used for communications, computer, space technology, medical, automotive, industrial equipment, and consumer electronics markets among others. For more information about the EDA Consortium, visit

About the IEEE Council on EDA (CEDA)

CEDA provides a focal point for EDA activities spread across six IEEE societies (Antennas and Propagation; Circuits and Systems; Computer; Electron Devices; Microwave Theory and Techniques; and Solid State Circuits). It sponsors more than 12 conferences, including Design Automation Conference (DAC), International Conference in CAD (ICCAD) and Design Automation and Test in Europe (DATE). CEDA publishes IEEE Transactions on CAD, IEEE Design and Test, and IEEE Embedded Systems Letters. CEDA is involved in recognizing leaders via the A. Richard Newton Award, Early Career Award and Phil Kaufmann Award. For more information, go to:

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