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Open-Silicon Wants Your Ideas for ASIC Designs

By Jeff Dorsch, Contributing Editor

The ASIC business is dead. That’s the conventional wisdom for some folks in the industry, at least. Just don’t tell it to Open-Silicon.

Founded in 2003, Open-Silicon has shipped more than 100 million application-specific integrated circuits in its history, according to Vasan Karighattam, the company’s vice president of engineering with responsibility for architecture, system-on-a-chip design and verification, system software, and post-silicon validation.

At the Design Automation Conference, Open-Silicon (booth 615) is exhibiting a number of boards designed for Internet of Things applications, using chips it has designed for customers. It also has a board featuring the Hybrid Memory Cube, the stacked-memory module.

“Bring us a spec, an idea,” Karighattam says. “We do all the RTL, the physical design, all the way to tape-out. We deliver a tested part.”

When it comes to passing the chip design off to a silicon foundry, “we are sort of foundry-agnostic,” he adds. Open-Silicon has working relationships with Taiwan Semiconductor Manufacturing, GlobalFoundries, and Semiconductor Manufacturing International, among others, Karighattam notes.

“We work with very mature processes and the latest,” Karighattam says. “We can recommend a process.” For IoT chips, processes ranging from 180 nanometers to 55nm are appropriate, he adds.

Open-Silicon also offers multiple packaging options to its customers, according to Karighattam.

“We are fully ready for a differentiating ASIC,” he concludes.

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