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Orbotech Announces SPTS Technologies has Installed a 300mm MEMS Vapor HF Etch Release Solution at CEA-Leti

SPTS’ New Monarch 300 Vapor HF Etch Release Solution to Enable a New Family of NEMS and MEMS Technologies at Prominent European Research Institute

ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its industry-leading vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development. Installed in 2015[1] at CEA-Leti’ state-of-the-art facility in Grenoble, France, the Monarch300 joins the 200 and 300mm etch, CVD and PVD systems previously supplied by SPTS and which are already operational in CEA-Leti’s MEMS and packaging lines.

“The co-integration of MEMS and CMOS has the potential to create a new family of sensors with improved performance,” said Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech. “The Monarch 300 uses our patented Primaxx vapor HF etch technology and is capable of processing thirteen 300mm wafers simultaneously. NEMS and MEMS are at the core of CEA-Leti’s activities, and we are pleased to be able to supply this highly valued partner with additional capability to support its 300mm MEMS program.”

Marie-Noëlle Semeria, CEO of Leti and President of the Nanoelec RTI board, commented: “MEMS devices co-integrated with CMOS help Leti achieve a long-standing goal of enabling smaller and more powerful sensors and actuators, without exceeding power budgets.”

“After characterizing the performance of a number of competing vapor HF etch methodologies, we selected SPTS’ Primaxx reduced-pressure, dry technology because it extends our existing process capability significantly and offers enhanced compatibility with materials of interest. Leti intends to lead the way in developing MEMS devices on 300mm formats, and to achieve this we are partnering with industry leaders such as SPTS, who have the specialist process knowledge needed to transfer our 300mm MEMS developments to high-volume production,” added Fabrice Geiger, Head of the Silicon Technologies Division of CEA-Leti.

SPTS and CEA-Leti entered into a two-year agreement that will encompass full performance characterization and process optimization of both the 200mm and 300mm vapor HF process modules. This collaboration will further extend the long-standing relationship between these partners who already collaborate on the development and optimization of a range of etch and deposition processes for next-generation 3D high-aspect-ratio through-silicon-via (TSV) solutions.

About Leti (France)

As one of three advanced-research institutes within the CEA Technological Research Division, CEA Tech-Leti serves as a bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. It is committed to creating innovation and transferring it to industry. Backed by its portfolio of 2,800 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched 54 startups. Its 8,500m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. With a staff of more than 1,800, Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Follow us on www.leti.fr and @CEA_Leti.s

Contact: Agency, +33 6 74 93 23 47

sldampoux@mahoneylyle.com

About Orbotech Ltd.

Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/.

About SPTS Technologies

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, and Allentown, Pennsylvania, , the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com


[1] Revenues from this deal have already been recognized in previously reported quarters.

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