Fan-In Wafer-Level Packaging Market Will Grow Due to the High Demand for Miniaturized Electronics Until 2020, Says Technavio
The global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%, according toTechnavio.
The increasing number of fabs globally has pushed the demand for IC packaging solutions. The vendors are setting up new fabs in different countries to produce memory devices like dynamic random access memory (DRAM) and not AND (NAND). The transition of semiconductor industry such as miniaturized semiconductor electronics, because of emerging technology such as the Internet of Things (IoT), is also driving the global fan-in WLP market.
The surging demand for compact electronic devices in sectors such as telecommunications, automotive, industrial manufacturing, and healthcare has generated the need for miniaturized semiconductor ICs. With the emergence of products such as 3D ICs and MEMS devices, the electronic equipment is becoming compact and user-friendly, which involves changes in IC designing such as finer patterning.
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