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Wafer Level Packaging Market to Reach $7.8 Billion by 2022, Globally – Allied Market Research

A new report published by Allied Market Research, “Wafer Level Packaging Market, Opportunities and Forecast, 2014-2022,” the global wafer level packaging market is expected to garner $7.8 billion by 2022, growing at a CAGR of 21.5% from 2016 to 2022. In 2015, Asia-Pacific dominated the global market and contributed over half of the market share owing to improved electronics industry infrastructure and increasing demand of electronic products such as smartphones, handheld devices, PCs and laptops among others.
Wafer level packaging is growing with a notable rate owing to its competitive advantages over other conventional packaging technologies namely wire bonding and flip chip such as compact package footprints, increased functionality, improved thermal performance, and finer pitch interconnection to the printed circuit board. Wafer level packaging (WLP) can be categorized on the basis of integration type and packaging technology used in them.
Furthermore, trending Internet of Things (IoT), technological superiority over traditional packaging techniques, and impending need of circuit miniaturization in microelectronic devices are key factors expected to propel the growth of global WLP market. Thriving demand for small sizes, low costs, and high performance of packaging solutions in electronic devices is going to act as an opportunity for wafer level packaging market.
In integration type of wafer level packaging, fan-in wafer level packaging (Fan-in WLP) dominated the market in 2015. This was attributed to the small, lightweight, high performance semiconductor solution of Fan-in WLP. However, Fan-out WLP is estimated to witness the higher growth rate in the market owing to its advances such as smaller form factor and thinner packaging with higher input/output (I/O) count along with improved thermal and electrical performance. In addition, it is a compelling, cost-effective solution for space constrained mobile applications and other portable consumer and industrial devices.
In bumping technology, copper bumping held over 50% in the year 2015 due to its exclusive advantages of low cost, compatibility with bond pads and applications in technologies such as transceivers, embedded processors, application processors, power management, and SOCs among others. Moreover, tin-lead eutectic solder is expected to witness a highly negative growth rate due to government initiatives to ban toxic substances that have high impact on the market.
Electronics industry contributed over 47% of the overall WLP market in the year 2015. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed, and improvement in efficiency collectively fuel the replacement of conventional packaging with WLP in electronics industry, hence, making it dominant in the overall market. However, IT & telecommunication would be the fastest growing segment and is expected to register highest CAGR 25.2% during the forecast period. This is due to the increase in reach of telecommunication services in remote areas as well as introduction of new players in IT industry where WLP is used in large scale-inside servers, host systems, and data centers.
Asia-Pacific dominated the market in 2015 by accounting over 50% of the total market revenue and it is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities, high consumption, and production of electronic products where WLP is steadily replacing wire bond and ongoing R&D. Further, North America and Europe are the second and third leading regions in WLP market. These regions are expected to witness slow growth during the analysis period owing to mature electronics and IT & telecommunication industry.

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