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Samtec to Present Flyover QSFP28 Technical Paper and PCIe®-Over-FireFly™ Product Demonstration at DesignCon 2017

Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, will participate in the DesignCon 2017 conference and exhibition at the Santa Clara Convention Center, January 31 – February 2. Samtec’s Director of Signal Integrity Jim Nadolny will be presenting a 45-minute technical paper session covering “Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.” This white paper presentation will demonstrate how Samtec achieved at least four times lower trace insertion loss with FQSFP for 56+ Gbps applications by replacing typical PCB trace based QSFP with flyover twinax cables to connect the receiver circuit to the port.

FQSFPThe product demonstration will showcase a disaggregated computing platform with PCIe® Gen 3 fabric enabled by the patented FireFly™ mid-board technology. By using PCIe®-over-Fiber, storage and GPU can be located 100 meters away, demonstrating the opportunity for new HPC/Data Center architectures that benefit from the high-performance, low latency that the PCIe® protocol enables.

Samtec is an industry leader in Signal Integrity and micro solutions, and offers a broad line of electronic interconnects including IC-to-Board and IC Packaging, High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Flexible Stacking, and Micro/Rugged components and cables. This enables us to provide overall “Silicon-to-Silicon” system optimization from the bare die to an interface 100 meters away and all interconnect points in between.

Samtec’s flyover QSFP28 cable assembly (FQSFP Series) achieves 28 Gbps performance and is backward compatible with all QSFP assemblies. This direct attach system, with press-fit tails that provide low speed signals and power to the PCB, allows drivers to be remotely located for design flexibility and greater control over thermal cooling. Signal integrity is optimized by flying critical data over lossy PCB via Samtec’s ultra-low skew pair twinax cable with inherently lower attenuation. Re-timers are not required reducing cost and power consumption.

ExaMAX® high-speed backplane system (EBTM/EBTF-RA Series) enables 28 Gbps performance on a 2.00 mm column pitch with a roadmap to 56 Gbps. This rugged system has the industry’s lowest mating force with excellent normal force, a 2.4 mm contact wipe and two points of contact for high reliability. Among other industry specifications, ExaMAX® exceeds OIF CEI-28G-LR for 28 Gbps standards and meets the Telcordia GR-1217 CORE specification. The roadmap for ExaMAX® products includes cable, direct mate orthogonal, mid-plane orthogonal and coplanar.

Edge Rate® HD – Samtec’s new 0.635 mm pitch, high-speed, multi-row strip – packages the same reliable contact system and ease of processing found in the SEARAY™ family in an even smaller and higher-density strip design. With both the four-row (5 mm wide) and two-row (2.5 mm wide; in development) versions capable of supporting 28+ Gbps applications, as well as multiple next-generation protocols, Edge Rate® HD (EDM6/EDF6 Series) is the future of high-speed strips at Samtec, and in the industry.

Samtec’s x4 duplex 28 Gbps FireFly™ optical engine (ECUO Series) brings its industry-leading density to the 100 Gbps Datacom/Telecom and HPC markets. Designed with thermal optimization in mind, options are available for both forced air and cold plate cooling scenarios. The integral dual-band CDR was designed to work with the latest Ethernet and InfiniBand™ protocol specifications. This x4 duplex architecture, while offering an extremely small footprint on the board, makes FireFly™ ideal for communications within a rack, or between racks.

Visit Samtec at Booth 717 or www.samtec.com/designcon for more information on Samtec’s “Silicon-to-Silicon” system optimization capabilities and support.


About DesignCon

DesignCon, produced by UBM Canon, is the world’s premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry’s leading experts and solutions providers. More information is available at: www.designcon.com/santaclara/.

About Samtec, Inc.

Founded in 1976, Samtec is a privately held, $625MM global manufacturer of a broad line of electronic interconnect solutions, including IC-to-Board and IC Packaging, High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 33 locations in 18 different countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit http://www.samtec.com.

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