SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor
Sonics, Inc., the world’s foremost supplier of onchip network (NoC) and power management technologies and services, today announced that Nexell has implemented the flagship SonicsGN® NoC as the integration fabric in its recently introduced NXP5540 application processor. Nexell, founded in 2009, is a Korean-based developer of systems-on-chip (SoC), semiconductor IP, and application processors. The NXP5540 is manufactured in Samsung’s 28nm low-power Gate First High-k Metal Gate (HKMG) foundry process technology. Nexell also used SonicsStudio® as its SoC integration environment to drive design and verification within the Samsung EDA tool and manufacturing flows.
“The NXP5540 is a significant SoC design achievement enabled by the high performance communication capabilities of SonicsGN and the ease-of-use of our development environment,” said Grant Pierce, CEO of Sonics. “Nexell is well-respected for its video IP and SoC design expertise. We are pleased they used our IP and tools to successfully integrate this application processor.”
“We used Sonics’ NoC for its high performance, configurability, and ease of integration,” said Tae Won Kang (Neo Kang), CEO of Nexell. “In the NXP5540, we created an advanced application processor with finite engineering resources. Using a proven NoC solution from Sonics allowed our development team to focus its attention on our own value-added IP and optimization of the chip architecture for performance, power, security, and silicon area. Sonics’ technical and field application engineering support were also outstanding and there for us every step of the way.”
About Sonics, Inc.
Sonics, Inc. (San Jose, Calif.) is the trusted leader in on-chip network (NoC) and powermanagement technologies used by the world’s top semiconductor and electronics product companies, including Broadcom®, Intel®, Marvell®, MediaTek, and Microchip®.
Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Based on the ICE-Grain™ Power Architecture, Sonics’ ICE-G1™ is the industry’s first complete Energy Processing Unit (EPU), which enables rapid development of SoC power management subsystems. Sonics is also a catalyst for ongoing discussions about design methodology change via the Agile IC Methodology LinkedIn group. Sonics holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit sonicsinc.com, and follow us on Twitter (@sonicsinc) and LinkedIn.