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StratEdge Expands CMC Base Laminate Packages to Include High-Power GaN Transistors & MMIC Devices

StratEdge Corporation, a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces the expansion of its LL family of high-power laminate copper-moly-copper (CMC) base packages to include both gallium nitride (GaN) transistor and MMIC device packages and package assembly services. The packages can now accommodate large MMICs, with die attach areas as high as 5.92 X 12.14mm. They operate at frequencies from DC to as high as 63 GHz for applications in communications, radar, automotive, aerospace, defense, and those requiring high power millimeter-wave signals.

The LL family of CMC-base packages dissipate heat from high-power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). Both leaded and leadless versions of these packages are available. Standard transistor packages are 0.8 in. (20.32mm) long x 0.23 in. (5.84mm) wide with 2 leads and a raised lid with an epoxy seal.

Packages are either flangeless, with a fully hermetic seal and a flat ceramic lid, or flange packages, with a bolt hole on each end so the package can be bolted to the printed circuit board. These laminate power packages are built with a base material ratio of 1:3:1 CMC, which provides a good thermal match for alumina-based materials and a GaN chip.

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