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Global Semiconductor Assembly Equipment Market Driven by the Increasing Adoption of Advanced Packaging Techniques: Technavio

According to the latest market study released by Technavio, the global semiconductor assembly equipment market is projected to grow to USD 5.04 billion by 2021, at a CAGR of nearly 4% over the forecast period.

Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. The high demand for polymer adhesive wafer bonding equipment due to the increasing adoption of advanced packaging techniques is a key factor driving the growth of the semiconductor assembly equipment market.

Based on equipment type, the report categorizes the global semiconductor assembly equipment market into the following segments:
Die bonding equipment
Inspection and dicing equipment
Packaging equipment
Wire bonding equipment
Plating equipment

The top three revenue-generating equipment segments in the global semiconductor assembly equipment market are discussed below:

Die bonding equipment
“Die bonding equipment dominated the semiconductor assembly equipment market, and is expected to be worth USD 1.26 billion by the end of 2017,” says Chetan Mohan, a lead analyst at Technavio for semiconductor equipment research.

The growing demand for semiconductor devices and components will ensure a continuous requirement for die bonding equipment in the market. The growth in the applications of semiconductor chips in industries such as energy, power, medical, green cars, automobile, and robotics will impact the market segment.

Inspection and dicing equipment
The global semiconductor assembly equipment market by inspection and dicing equipment is expected to grow at a moderate rate over the forecast period, driven by the need to produce reliable and efficient products. To ensure high-quality products, semiconductor device manufacturers must ensure the high quality of the base products, flawless processing techniques, and defect-free equipment. The analysis of bare substrates and inspection of intermediate products are crucial and necessary steps in the manufacturing process, which create the need for semiconductor inspection systems.

Packaging equipment
“The packaging equipment segment is expected to grow faster than the other segment of the semiconductor assembly equipment market, driven by high capital investments from leading chip manufacturers, such as SK Hynix, Samsung, and SMIC,” says Chetan.
The growing demand for compact ICs from the consumer electronics market, particularly from the mobile phone and PC markets, is expected to drive the semiconductor assembly equipment by the packaging segment on a decent growth trajectory during the forecast period. The expected size reductions in the market will draw in more investments towards R&D of new and advanced packaging technologies.
The top vendors highlighted by Technavio’s research analysts in this report are:
• ASM Pacific Technology
• Kulicke & Soffa Industries
• Palomar Technologies
• Tokyo Electron
• Tokyo Seimitsu

Contact Information

technavio

110 E. Schiller, #208
Elmhurst, IL,
U.S.A.

tele: 1 630 333 9501
fax: 1 630 333 9501
americas@technavio.com

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