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Toshiba Unveils NVMe SSDs Using 64-Layer, 3D Flash Memory

Toshiba America Electronic Components, Inc. (TAEC) launched the XG5 series, a new line of NVM Express (NVMe) SSDs integrating 64-layer, 3D flash memories, offering up to 1TB capacity in a compact M.2 form factor. Starting today, OEM customers will have access to limited quantities of qualification samples with shipments gradually increasing in the second half of 2017.
As the third generation of the popular Toshiba XG Series, XG5 SSDs feature the latest 3-bit-per-cell TLC (triple-level cell) BiCS FLASH and utilize PCI EXPRESS (PCIe) Gen3 x 4 lanes and NVMe Revision 1.2.1 to deliver extremely high performance up to 3000 MB/s of sequential read and 2100 MB/s of sequential write.

Compared to 6Gbit/s SATA storage, the XG5 Series is up to 5.4 times faster on sequential read performance and up to 3.8 times faster on sequential write performance with a maximum interface bandwidth of 32 GT/s. Additionally, XG5’s feature-set also features an SLC cache for excellent performance to accelerate burst type workloads, such as those experienced routinely on Windows-based PCs, as well as improved standby power consumption reduced by over 50% to less than 3mW, making these SSDs an excellent solution for high performance mobile computing.

Contact Information

Toshiba America Electronic Components

2590 Orchard Parkway
San Jose, CA 95131, CA, 95131
USA

www.toshiba.com/taec

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