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Micralyne and Microplex Partner to Deliver Metal “Through Silicon Via” Wafers

Micralyne Inc., a manufacturer of MicroElectroMechanical Systems (MEMS) and a supplier of sensors, announced a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Vias (TSV). The joint development of this technology leverages the specific expertise of each company to enable a flexible and cost effective Metal TSV solution for sensor and semiconductor applications. The companies engaged in the development of the TSV offering in 2016, with full volume production capability starting July 2017.

The companies agreed to work jointly to deliver standalone TSV wafers as well as integrated TSV solutions with metal layers for interposer and redistribution layers. Micralyne will also offer multilayer Wafer Level Packaging (WLP) with metal TSV technologies for ball grid array sensors.

Minimum via hole diameters as small as 40um, and 70um pitches are currently being fabricated. The diameter to depth ratio of the via holes can exceed 20:1 providing a flexible and robust wafer thickness. Conductive via fills are available in Gold, Silver. and Copper metals. Optimized via processing and unique formulations assures effective performance in high frequency device applications while maintaining the purity of the base silicon microstructures.

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