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Toshiba Adds Dual-Sided Cooling to Power MOSFETs for Motor Control, Power Supplies

Toshiba America Electronic Components, Inc. (TAEC) has extended its range of high-efficiency U-MOS IX-H MOSFETs. The 60V TPW1R306PL is an N-channel device in a DSOP Advance surface mount device (SMD) package that offers dual-sided cooling. The enhanced thermal dissipation provided by dual-sided cooling can help to reduce device count and save space in applications with high component density, including: DC-DC converters, secondary-side circuits of AC-DC power supplies and motor drives in cordless home appliances and power tools.

The TPW1R306PL has an ultra-low typical on-resistance (@VGS =10V) of just 0.95mΩ and is offered in a very small form factor of 5×6mm. Maximum drain current and power dissipation are 100A and 170W, respectively. Additionally, the TPW1R306PL’s top-of-package thermal resistance rating (Rth (ch-c) of 0.88k/W) is very low.

Toshiba’s U-MOS IX-H process enables an exceptional performance trade-off between RDS(ON) and output capacitance/output charge, making typical QOSS just 77.5nC (@VDS=30V, f=1MHz). This allows designers to further improve system performance and efficiency by raising switching speeds and reducing switching losses.

Contact Information

Toshiba America Electronic Components

2590 Orchard Parkway
San Jose, CA 95131, CA, 95131
USA

www.toshiba.com/taec

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