Invensas DBI Technology Now Available at SMIC

Leading semiconductor foundry ready to manufacture Invensas wafer bonding and 3D interconnect technology for image sensor solutions

Semiconductor Manufacturing International Corporation (“SMIC”) (NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and Invensas, a wholly owned subsidiary of Xperi Corporation (“Xperi”) (NASDAQ: XPER), today announced the establishment of Invensas’ Direct Bond Interconnect (DBI®) technology at SMIC’s Avezzano facility. This capability enables SMIC to support the growing demand for high performance, hybrid stacked backside illuminated (BSI) image sensors, as well as other semiconductor devices, in a wide range of end applications including smartphones and automobiles. SMIC and Invensas previously signed a Development License in March 2017.

“By working closely with the Invensas team, we have been able to quickly bring in the DBI manufacturing process and are now prepared to offer DBI for image sensors, MEMS sensor hubs, Power Management IC, and beyond to our customers at 200mm,” said Roberto Bez, vice president of technology development at LFoundry, SMIC’s subsidiary in Avezzano, Italy.

“Invensas’ DBI technology enables SMIC to manufacture the high performance image sensors required in mobile, automotive, and consumer electronics applications,” said Sunny Hui, senior vice president of marketing at SMIC. “With this technology in place, SMIC is prepared to further expand this capability into volume manufacturing around the globe, both at 200mm and 300mm.”

“SMIC’s talented manufacturing team has done an excellent job integrating our DBI process into their high-volume manufacturing environment,” said Craig Mitchell, president of Invensas. “We are thrilled to announce that SMIC is ready to engage commercial customers and support the demand for high volume production of BSI image sensors with DBI. We look forward to continuing to work together to expand this technology platform into other products and applications.”

DBI technology is a low temperature hybrid wafer bonding solution that allows wafers to be bonded with scalable fine pitch 3D electrical interconnect without requiring bond pressure. DBI 3D interconnect can eliminate the need for through-silicon vias (TSVs) and reduce die size and cost while enabling pixel level interconnect for future generations of image sensors.

DTS, Xperi and their respective logos are trademarks or registered trademarks of affiliated companies of Xperi Corporation in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

Contact Information

Semiconductor Manufacturing International Corporation

No. 18 Zhangjiang Road
Pudong New Area, Shanghai, 201203
People’s Republic of China

tele: +86 (21) 3861 0000
fax: +86 (21) 5080 2868

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