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Altek to Unveil its State-of-the-art 3D-Depth Sensing Chip at CES 2018

Altek Corporation (3059.TW), a machine vision and AI(Artificial Intelligence) solution provider from Taiwan
with advance depth algorithm and chip design technologies will unveil its latest 3D- Depth Sensing Chip
AL6100 at CES 2018.


“Our first generation real-time depth chip AL3200 launched in 2016 has achieved a remarkable success in
millions of smartphone and portable devices worldwide. We are now excited to announce the next generation
AL6100 depth chip, together with active IR(infrared) light will further enhance our real-time depth quality and
computing to support a wide range of applications such as smartphone, surveillance, autonomous vehicle,
smart home assistant, drone, sweeping robot, etc,” said Jason Lin, Senior Vice President of Altek
Corporation, adding that the 3D-Depth Sensing Chip will be for mass production shipping by the end of
March.

At CES, Altek will showcase the AL6100 chip with application in smartphone, surveillance camera, and
VR/AR camera. With regards to surveillance camera, deep learning technology focusing on human
recognition under various environments and lighting conditions will be demonstrated. This enables the
surveillance camera to act as an edge device in the network to free up bandwidth and to protect individual
privacy. For VR/AR, the real-time depth information provided by AL6100 allows applications to have a more
accurate perception of its surrounding environment and the posture and gesture of people in proximity.

Exhibition Date?January 9-12, 2018
Place?MP 25960, South Hall 2, Ground Level, Las Vegas Convention and World Trade Center (LVCC)

 

 

 

 

 

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