News
February - 2019
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- DATE 2019 in Florence
DATE 2019 in Florence: Advance Programme available online at https://www.date-conference.com/programme  5 February 2019 We proudly present the Advance Programme of DATE
January - 2019
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- MorningCore Licenses Flex Logix’s Embedded Field-Programmable Gate Array on TSMC’s 12FFC Process
Another major company adopts EFLX eFPGA Mountain View, Calif., January 21, 2019 â Flex Logix Technologies, Inc., announced today that MorningCore Technology, a subsidiary
- Bosch launches smart ultra-low power IMU BMI270 optimized for wearables
Includes intuitive activity, context and gesture recognition Newest member of Boschâs next-generation BMI260 family of IMUs Optimized for wearable and hearable applications
- STMicroelectronics Drives AI to Edge and Node Embedded Devices with STM32 Neural-Network Developer Toolbox
v STM32Cube.AI extension of popular STM32CubeMX software tool generates optimized code to run neural networks on STM32 microcontrollers (MCUs) v STM32Cube.AI comes together with
- AAEON Partners with Gorilla Tech to Showcase High-Performance A.I. Computing at CES 2019
AAEON, the leading designers and manufacturers of IoT and A.I. edge computing platforms, and Gorilla Technology Group, the global leader specializing in video intelligence and IoT
December - 2018
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- BGA SMT Emulation Adapter Set Allows Affordable, Reliable Socketing of BGA1089 ICs
Users Can Reuse their BGA1089 ICs with Easy to Use BGA Adapter Set Ironwood Electronics is introducing SF-BGA1089C-B-42F and LS-BGA1089C-41 BGA SMT adapter set, a low cost and reliable
- MIPI Alliance Releases I3C Basic Interface Specification for Widespread Implementation in Mobile and Beyond
Released under royalty-free terms, MIPI I3C Basic provides a streamlined upgrade path from the ubiquitous I2C, with the most commonly needed developer capabilities for smartphones,
- Industry’s First RISC-V SoC FPGA Architecture Brings Real-Time to Linux, Giving Developers the Freedom to Innovate in Low-Power, Secure and Reliable Designs
Demonstrations at RISC-V Summit Dec. 4-5 to Show Size, Power and Performance Benefits of Integrating PolarFire SoCâs Hard CPU Subsystem with Programmable Logic RISC-V Summit, SANTA
- Removable Lid Spring Pin Socket for DDR
Socket your BGA96 using Extreme Temperature Socket with Superior Electrical Performance Ironwood Electronics recently introduced a new BGA socket addressing high performance
- Achronix Announces Immediate Availability of Speedcore Gen4 eFPGA IP for AI/ML and Networking Hardware Acceleration Applications
Speedcore Gen4 embedded FPGAs deliver 60% faster performance, 50% lower power, 65% smaller die size compared to previous Speedcore eFPGA generation New Machine Learning Processor
- Hyperstone to exhibit at Embedded Expo 2018
Meet Hyperstone on Booth 1A53 to learn about its industry leading NAND Flash controllers for industrially robust storage solutions. Flash controller design company, Hyperstone, has
- Arm Neoverse: The modern cloud to edge infrastructure foundation for a world of a trillion intelligent devices
Delivering the world-class performance, security, and scalability required to support the diverse compute requirements of the next-generation infrastructure from hyperscale to edge
- IEEE Publishes Standard for Network-Based Coexistence Methods
IEEE 802.19.1⢠standard includes geolocation-capable devices, improves spectrum sharing IEEE, the world's largest technical professional organization dedicated to advancing
- Intel, Arduino and myDevices join the rapidly expanding Arm Pelion IoT Platform ecosystem
News Highlights Collaboration with Intel and launch of Mbed Linux OS furthers Pelion IoT Platform capability of managing any device and linking to any cloud Pelion IoT Platform
- Premier Farnell Announces Global Franchise with Embedded Security Solutions Developer, Zymbit
New franchise adds hardware security modules for Raspberry Pi used in critical Internet of Things applications Chicago, November 28, 2018: Premier Farnell announces a new global
- Advance Programme available online
The DATE conference will take place from 25 to 29 March 2019 at the Firenze Fiera in Florence, Italy. It combines the worldâs favorite electronic systems design and test conference
- Infineon delivers hardened security of IoT cloud localization services and AWS IoT Greengrass Hardware Security Integration
At AWS re:Invent 2018 this week, Infineon Technologies (FSE: IFX / OTCQX: IFNNY) announced the availability of hardened security solutions for Amazon Web Services (AWS) Internet of
November - 2018
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- IEDM 2018 Coming Up!
This is Part 1 of a multi-part blog series of previews of the upcoming IEDM 2018 conference. On December 1stâ 5ththe good and the great of the electron device world will
- Arm goes higher up the stack for device-to-data IoT security
News highlights: Arm is building the industryâs broadest IoT security offering with secure device IP and the Pelion IoT Platform guided by PSA design principles Arm celebrates
- Bosch provides customized IoT and Industry 4.0 solutions
Bosch Mondeville and Bosch Connected Devices and Solutions collaborate to meet a wide variety of customer requirements Bosch Connected Devices and Solutions provides IoT sensor
- Via Partners With Lucid To Develop Industry-Leading Via Edge Ai 3D Developer Kit Powered By Qualcomm Apq8096sg Embedded Processor
Integrated AI Software And Hardware Solution Will Accelerate Depth Sensing Capabilities Of Devices For A Wide Range Of Security And Retail Camera, Robotics, And Autonomous Vehicle Applications VIA
- Artificial Intelligence Market in Asia Pacific to Grow from $6 Billion in 2017 to $136 Billion by 2025
Traditionally, the Asia Pacific (APAC) region has lagged North America and Europe in terms of technology adoption. However, according to a new report from Tractica, artificial intelligence
- Volkswagen, Mobileye and Champion Motors to Invest in Israel and Deploy First Autonomous EV Ride-Hailing Service
The Volkswagen Group, Mobileye, an Intel Company, and Champion Motors announced plans to deploy Israel's first self-driving ride hailing service â or Mobility-as-a-Service (MaaS)
- Accelerate Development of Remote IoT Nodes with the Industry’s Lowest-power LoRa System-in-Package Family
With industry-leading low power consumption, the SAM R34/35 devices enable long-range wireless connectivity while extending system battery life MUNICH, Germany, November 13, 2018
- Renesas Electronics' Extreme Low-Power SOTB™ Process Technology Eliminates the Need for Batteries to Power IoT Devices
Ground-Breaking Energy Harvesting Embedded Controller Operates on Current Levels Not Possible with Conventional Technology Renesas Electronics Corporation (TSE:6723), a premier supplier
- Intel and Arm Share IoT Vision to Securely Connect ‘Any Device to Any Cloud’
Uniting IoT Device Ecosystems and Enabling Dynamic Singular Provisioning Model The Internet of Things (IoT) is transitioning from first proof-of-concept deployments
- Clamshell Production Test Socket for BGA1089
Socket and Test your 35x35mm BGA device using extreme temperature socket Ironwood Electronics recently introduced a new Stamped spring pin socket [2] addressing high performance requirements
- Entegris Expands State-of-the-Art Clean Manufacturing Facility in Malaysia
30% increase in total manufacturing capacity of advanced technology FOUPs to meet customer demands for the next decade  Entegris Inc. (Nasdaq: ENTG), a leader in specialty chemicals
- Highlighting Embedded Systems meeting Hyperscale and High-Performance Computing and Model-Based Design of Intelligent Systems
Out of a total of 834 paper submissions received, a large share (38%) is coming from authors in Europe, 28% of submissions are from the Americas, 33% from Asia, and 1% from the rest
- Full-Bridge 600V/3.5A System-in-Package from STMicroelectronics Delivers Space Savings with Flexibility and Safety
STMicroelectronicsâ PWD5F60 high-density power driver is the second in a new series of power-driver systems-in-package addressing high-voltage brushed DC and single-phase brushless motor applications.
