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EECatalog Tech Videos
Switch between DisplayPort and HDMI port using a single video switch while maintaining signal integrity over a cable length of 30 meters
In 2014, semiconductor units are expected to grow over 5% to reach a new record, and wafer demand growth is a direct result of these numbers. Every quarter, Semico releases our Quarterly
Automotive Industry Growth, Product Cadence Highlight Opportunities through 2025, According to IHS Automotive
The accelerated velocity of the global automotive industry is expected to continue in the near term and portfolio expansion into new body styles is driving higher volume per platform
Check out the latest in lead times, pricing trends, allocations, new product releases and end-of-life status on 18 broad product categories from Avnet’s line card of more than 300
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EECatalog Tech Videos
This video introduces Microchip's first feature-rich 3-phase BLDC motor gate driver with power module and provides detailed features. [youtube]http://www.youtube.com/watch?v=Gr-KNuUNHGQ[/youtube]
This video introduces Microchip's first feature-rich 3-phase BLDC motor gate driver with power module and provides detailed features. [youtube]http://www.youtube.com/watch?v=6261nIj9hZg[/youtube]
[youtube]http://www.youtube.com/watch?v=S5s9e93S2T8&list=PL1204684BD203E0DC[/youtube] [MNV170] Microchip Technology introduces Lighting Communications Development platform for
Overview of the signal generation capabilities of the PIC12F157X MCU family.
This training video introduces the Peripheral Pin Select (PPS) for Microchip 8-bit PIC MCU. The training steps you through how the PPS operates and then how to use the peripheral, including code examples.
Cristian Amitroaie, CEO of Amiq, talks with John Blyler about Specador, a automated HTML documentation tool for chip design and verification engineers. This tool generates meaningful documentation even from poorly documented source code, as it actually compiles the code and can generate cross-link class inheritance trees, design hierarchies, and diagrams. The need for this functionality lead to an interesting discussion about the software programming process and why programmers rarely document their own work.
At GE Intelligent Platforms, we understand that one of the greatest challenges involved in developing cutting edge defense systems is keeping advanced electronics cool.
Featured White Papers
Chip-package co-design is important for several reasons. Designing a large high power die, e.g. a System-on-Chip (SoC) without considering how to get the heat out is likely to lead
The latest advancements in electro-‐mechanical technologies, coupled with stringent compliance and compatibility requirements, allow for the development and deployment of high-‐performance
Developing backend systems for medical imaging Each advancement in medical imaging enables significant improvements in the quality and efficiency of diagnostics and therapy. The
Comprehensive display and computer-on-module system solutions In the highly competitive retail industry, innovative technologies can help improve the coordination of the supply
For high-performance small form factor processing in harsh conditions, Acromag offers the flexible COM Express® platform of products. See how simplifying your system design using this modular solution minimizes costs and development time. Extended operating temperatures and advanced thermal management make this rugged system ideal for defense and industrial applications.
Today, the ability to track the orientation or position of a device is a common feature in many portable and wearable products. Computing the orientation is a non-trivial task that converts inputs from multiple motion sensors into accurate position information. This computation is called sensor fusion and it eliminates inaccuracies from noisy sensor inputs. This paper shows how using DesignWare® ARC® Processor EXtension (APEX) technology improves cycle count and energy consumption for a power-efficient implementation of a 9D fusion algorithm on an IP subsystem.
Many aspects of a PCB’s performance are determined during detailed design. Thermal issues with the PCB design are largely ‘locked in’ during the component (i.e. chip package)