Wireless Technologies Showcased at 3GSM



AUSTIN, Texas–(BUSINESS WIRE)–Attendees at 3GSM World Congress this year will have the opportunity to see one of the broadest displays of 3G and related wireless technologies at the Freescale Semiconductor booth. More than 20 Freescale and partner demos will showcase the company’s array of integrated platform solutions for mobile communications and entertainment.

“Our focus this year at 3GSM is to demonstrate the technological advances we have made in 3G,” said Sandeep Chennakeshu, senior vice president and general manager, Freescale’s Wireless and Mobile Systems Group. “From infrastructure to handset, Freescale provides state-of-the-art solutions to support multiple wireless applications.”

Freescale’s demonstrations at 3GSM World Congress, one of the largest exhibitions for the mobile industry, will showcase a variety of technologies, including MXC, the world’s first single core modem; applications processors for mobile multimedia and infotainment; RFCMOS 90nm ASICS for 2G and 3G handsets; and advanced RFIC technologies designed to support the rapidly changing infrastructure market.

3G handset solutions feature streaming video, audio at high data rates

High speed uplink packet access (HSUPA) and high speed downlink packet access (HSDPA) technology will be featured in the Freescale booth. This technology, developed in collaboration with Motorola, is designed to operate at up to 5.6 Mbps for HSUPA and 7.2 Mbps for HSDPA and uses an actual handset, not an engineering test box. Another demonstration will showcase a 3G handset conducting a simultaneous voice and data call (multicall capability) over a live HSDPA network.

Redistributed chip packaging (RCP), Freescale’s advanced semiconductor packaging technology, will also be on display. RCP is a revolutionary proprietary technology that could replace ball grid array and flip chip as preferred packaging technology for highly miniaturized devices, such as smartphones and multimedia players.

RF technology solutions for reduced test time for handset manufacturers

Also planned to be showcased in the Freescale booth will be the RFX300-30 3G subsystem and RFX275-30 2.75G subsystem. Key benefits of these advanced devices include high integration to reduce eBOM and a design to simplify layer-one programming, reduce test time and increase yield.

High Power, Dual Stage RFIC technology breakthroughs

Freescale will showcase an innovative high power product line of RF Integrated Circuits (RFICs) designed to deliver unprecedented levels of high gain at the 100W power level for wireless base stations serving GSM, EDGE, CDMA, WCDMA and TD-SCDMA networks. Also anticipated to be featured is the latest product line in LDMOS RF power devices for all three bands of WiMAX communication standards.

WiMAX innovation and marketplace momentum

As the WiMAX standard gains momentum around the world, communications processors from Freescale Semiconductor are driving the rapid deployment of cost effective WiMAX customer premises equipment (CPE) products and base station installations. At 3GSM, Freescale intends to announce a significant WiMAX design win and demonstrate how its industry-leading processors based on Power Architecture technology are advancing the state of the art for WiMAX technology.

Freescale’s mobile multimedia and infotainment solutions drive new user experiences

On display will be Freescale popular i.MX family of multimedia applications processors as it powers many advanced mobile multimedia and infotainment experiences:

  • NVIDIA’s GoForce 5500 offering console-class 3D games on a handheld device.
  • The Nero Mobile media center which enables users to browse, play and organize content such as photos, video and music.
  • Global Locate’s A-GPS reference design using the Hammerhead assisted GPS chip, the world’s first single-die, single-chip solution.
  • RV Tech’s ipM100 GSM/Wi-Fi Smartphone platform, a phone, personal entertainment center and a business tool all in one device.
  • Intrinsyc’s Soleus, the world’s first feature phone software platform based on the Windows CE operating system
  • Trinity Convergence’s VeriCall Edge embedded voice + video over IP software platform which provides a turnkey solution for both wired and mobile devices.

About Freescale Semiconductor

Freescale Semiconductor, Inc. is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale is one of the world’s largest semiconductor companies with 2006 sales of $6.4 billion (USD). www.freescale.com

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