Silex Technology Introduces its Latest 802.11ac SDIO Wi-Fi System-in-Package (SiP)



Silex Technology America, Inc. introduced a embedded Wi-Fi solution, the SX-SDPAC SDIO System-in-Package (SiP). This dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready” SiP is based on the latest Qualcomm Atheros QCA9377 System-on-Chip (SoC). It offers cost effective, small form factor, and low power Wi-Fi+BT connectivity solution for our customers.

With the release of the SX-SDPAC SiP, Silex expands its 802.11ac SDIO portfolio by offering increased choice and flexibility to our customers to choose the right form factor Wi-Fi solution for their needs. This SiP is ideal for high-volume customers who want to achieve the lowest bill of material (BOM) cost and the smallest footprint.

It can be mounted directly on the device PCBA, which minimizes cost by eliminating extra materials and labor associated with a radio module or card. It’s small size, light weight and low power consumption makes it a viable option not only for handheld devices but also for a wide variety of applications such headsets, speakers, displays and many other Internet of Things (IoT) applications.

“Today a vast majority of Wi-Fi users consume multimedia content ranging from high-resolution images for patient care to instructional videos in the classroom, or wireless display technologies in corporate conference rooms,” said Babar Hashim, Senior Product Manager at Silex. “SX-SDPAC’s compact single-stream design lowers cost while delivering dramatic speed, power and performance improvements, empowering users to effortlessly stream HD-quality videos and watch rich multimedia anywhere they have Wi-Fi coverage.”

SX-SDPAC Features
• Based on the QCA9377 Chipset
• 802.11 a/b/g/n/ac Wave 2 MU-MIMO
• SDIO 3.0 WLAN Host Interface
• Bluetooth 4.2 BR/EDR/LE Smart Ready
• Commercial Temperature, -20°C ~ +70°C
• Optional Antenna Diversity Support
• Internal 48 MHz XTAL
• Single-Ended Integrated RF Front-End Design
• Minimal Host Utilization (11ac speeds) via Offloading
• Smallest Size Package 6.9 mm x 6.9 mm x 1.082 mm

Contact Information

Silex Microsystems AB

P.O. Box 595
Bruttovägen , Järfälla, 1 SE-175 26
Sweden

http://www.silexmicrosystems.com/

Share and Enjoy:
  • Digg
  • Sphinn
  • del.icio.us
  • Facebook
  • Mixx
  • Google
  • TwitThis