New White Papers
ADLINK Announces Compact COM Express® Type 6 Module Featuring High Performance and Ultra-Low Power Consumption
Mobile 4th generation Intel® Core™ processor with built-in GT3 graphics core provides outstanding graphics performance and multiple display outputs ADLINK Technology Inc., a global
Analog cameras represent over 80 percent of the surveillance and low-cost recorder market, yet analog...
The good news is that large amounts of IP go into the design of smart-card chips and RFID tags. The bad...
From the ultra-small 3D transistors described in papers at this month’s International Electron Devices...
While the main manufacturing flows are still focusing on optical lithography, eBeam and EUV are still...
Blog Post: Innovation in at the Driver’s Seat – Part I / (TI E2E Community)
C.P. Ravikumar, Texas Instruments The video “TI is driving the future of Automotive technology” is an inspiration to many technophiles. It is amazing to find so many applications of electronics to make driving a safer and a fun experience. The humble car key is likely to be replaced with finger print...
As DVCon expands, we at Mentor Graphics have grown our sponsored sessions as well. Would you expect less? In DVCon’s recent past, it was a tradition for the North American SystemC User Group (NASCUG) to sponsor a day of activity before the official start of the conference. When OSCI merged with Accellera, the day...
A App for windows phone 8 / (Consumerization: BYOD)
Hi,I want to create a digital clock app for windows phone in c# and i don't know how to start and resources are required can anyone help me for this.Thank you in advance....
EEVblog #587 – Tektronix MDO3000 Mixed Domain Oscilloscope Teardown / (Electronics Engineering Video Blog Podcast)
What’s inside Tektronix’s new MDO3000 Mixed Domain Oscilloscope? Dave does a teardown and looks at the circuitry and how they can get such a cheap 3GHz RF spectrum analyser to work. MDO4000 Teardown: http://www.youtube.com/watch?v=J9_JxRiuS5A Datasheets: HMC624 Digital RF Attenuator HMC311 InGaP HBT GAIN BLOCK...
The Key to Accelerating Signage Deployment
MLC flash-based SSDs that incorporate wear-leveling and power-protection schemes present superior performance storage for POS applications at a competitive price point.
Smart antennas provide the capability to co-locate the antenna and black-box functionality for better performance and lower cost.
Intel released the Open Pluggable Specification (OPS) to eliminate communication/integration problems between a host computer and its displays, with the goal of easing integration challenges.
The demand for faster response time, combined with consumers’ bottomless appetite for storage and higher resolution video, drives the need for faster wired interfaces like 10G USB and Thunderbolt 2.
New technologies, including Android, Power-over-Ethernet and HTML 5 are driving exciting new opportunities for digital signage applications.
In interactive digital signage, natural user interface (NUI) interactions provide a much more engaging user experience.
Trends from military and consumer environments are driving product enhancements in viewing capabilities and user interface for industrial displays in a wide variety of applications.
The highly efficient architecture of FRAM-based MCUs simplify secure system design without compromising data integrity or reliability, all while lowering power consumption. Security
As challenges such as security and multicore processing are addressed, Android and Embedded Linux find their way into new markets, moving from traditional smartphone applications to medical, automotive, mil/aero and M2M of every flavor.