North American Semiconductor Equipment Industry Posts March 2014 Book-to-Bill Ratio of 1.06

North America-based manufacturers of semiconductor equipment posted $1.28 billion in orders worldwide in March 2014 (three-month average basis) and a book-to-bill ratio of 1.06, according

Global Chip Revenue Rises in 2013, Reversing Loss from Earlier Year; Memory and Wireless Lead the Way

Worldwide semiconductor revenue rose a solid 5.0 percent last year, with memory chips the star performers, according to the latest research from IHS Technology (NYSE: IHS). Total

Avnet, Inc. Reports Third Quarter Fiscal Year 2014 Results

Continued Progress at Electronics Marketing Drives Year-Over-Year Growth in Revenue and EPS Avnet, Inc. (NYSE:AVT) today announced results for the third quarter fiscal year 2014

February Semiconductor Sales Up 11.4 Percent Compared to Last Year

Worldwide Semiconductor Revenue Grew 5 Percent in 2013, According to Final Results by Gartner

North American Semiconductor Equipment Industry Posts February 2014 Book-to-Bill Ratio of 1.00

After a Strong December, LCD Panel Market to Moderate in Q1

Add-in board-market down in Q2, AMD gains market share

Interactive Displays Produced Measurable ROI and Sales Uplift for the Same Products Compared to Stores without Digital Signage

GE AXIS Middleware for Mixed Architecture Signal Processing

Our AXIS software provides libraries for signal processing and inter-processor communications along with graphical tools to facilitate system visualization and rapid prototyping.

Expert-Integrated COM Design-in Services , Advantech(EN)

Advantech Expert-Integrated COM Design-in Services

MSC C6B-8S Type 6 COM Express Module

The MSC C6B-8S module is based on Intel's 4th generation of Core™ processors which bring a significant gain in computing and graphics performance compared to their predecessors. Various Core-i3, i5, i7 and Celeron processors are supported by this design. Next to an extensive set of interfaces and features, the MSC C6B-8S offers turbo boost capabilities for CPU and graphics controller, accelerated video encoding/decoding and hardware-based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI and DVI. USB 3.0 interfaces support the fasted peripheral devices currently available.

Rip Van Winkle Bluetooth Low Energy Wakes Up, Then Sleeps Again

Bluetooth Low Energy (LE, or BLE, or Smart) is all about sending and receiving data just like any other Bluetooth device, but doing so using much less power. It's ideally suited for M2M applications where a device wakes up, transmits or receives data, then goes back to sleep. The Bluetooth SIG specifies myriad application profiles from healthcare ("Blood Pressure Profile") to Sports and Fitness. At the recent DESIGN West 2013 conference, editor-in-chief Chris A. Ciufo got the lowdown on Laird's new BL600 Bluetooth LE Smart modules.

Extension Media Interview with Microchip's Joe Drzewiecki

Editor Chris Ciufo spent time with Microchip software manager Joe Drzewiecki at the Spring DESIGN West show (formerly known as ESC). Microchip launched their new MPLAB X compiler strategy that now goes across all Microchip MCUs. It also adds a new license strategy, optimizations that compile 35 percent faster on 32-bit devices (or save 35 percent on code size). There's also a "totally free" version of the MPLAB X compiler. Check out the 3 minute video.

Axiomtek Introducing OPS860 Digital Signage Module at DSE 2012

During the Digital Signage Expo 2012, Axiomtek revealed the OPS860, a digital signage player module based on Intel's Open Pluggable Specification. The OPS860 allows users to plug in the module to any OPS compliant display to create an All-in-One Digital Signage Solution. No more messy cables and wires. Just plug in and go!

Introducing: AMD Accelerated Processors for Embedded Applications

Learn how the AMD Accelerated Processing Units (APU) combine high performance serial and parallel processing cores to enable breakthroughs in visual computing, security, performance-per-watt and device form factor.

COM Express ™ module for demanding data processing and imaging applications

For demanding digital signage and retail applications, MSC Technologies offers the MSC C6B-8S module family based on 4th generation Intel® Core™ processors with extremely high computing power, graphics, and video performance. The platform is based on quad-core and dual-core Intel® Core™ processors and the Intel® 8-Series platform controller hub QM87.

Free MythBuster – Extended Temperature Embedded Computers

The “extended temperature” designation theoretically assures that an embedded computer will perform reliably in extreme temperature environments. But how do you know for sure? Are there commercial grade components being used on the board? Is the board 100% tested? Download this MythBuster paper to learn how to find a truly reliable solution for your embedded computing needs.

Kontron announces next-generation digital signage kit to help streamline development and deployment of intelligent signage systems

Streamline intelligent digital signage development with the DSEK-12 evaluation kit from Kontron. The next-generation DSEK-12 is a powerful resource for retail, transportation and medical companies that are looking to implement digital signage as an influential new vehicle to interact with customers and gain valuable consumer information in real time. Download the DSEK-12 whitepaper to learn how designers can easily use this advanced, cost-effective, pre-validated and future-proof solution that features the latest display and graphics technologies.

Improved Graphics Performance Changes the Cost Equation in Digital Signage

The quality and flexibility of digital signage is a function of the graphics processing capability of the media players that drive the displays. To deliver a high level of graphics performance, media players tend to incorporate discrete graphics processing units, although some players use the graphics engine on the CPU platform. Discover how 3rd Generation Intel® Core™ processors provide retailers improved graphics performance and anonymous video analytics to deliver audience messaging at lower cost and watt.

The PSP Model in RF CMOS Design

This white paper explains the technology behind Penn State Philips (PSP) transistor models and how they relate to actual device behavior.