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Telecom market research firm Infonetics Research released excerpts from its latest Small Cell Equipment market size and forecast report, which tracks 3G microcells, picocells, and metrocells
North America-based manufacturers of semiconductor equipment posted $1.28 billion in orders worldwide in March 2014 (three-month average basis) and a book-to-bill ratio of 1.06, according
Global Chip Revenue Rises in 2013, Reversing Loss from Earlier Year; Memory and Wireless Lead the Way
Worldwide semiconductor revenue rose a solid 5.0 percent last year, with memory chips the star performers, according to the latest research from IHS Technology (NYSE: IHS). Total
Featured White Papers
Xilinx has chosen 28 nm high-metal gate (HKMG) high performance, low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. This white paper describes the challenges the semiconductor industry faces in addressing market requirements and describes how these can be solved with the right 28 nm process technology. The breakthrough combination of a high performance, low-power process with architectural innovations makes new 28 nm FPGAs well suited for power sensitive applications, bandwidth-intensive, and ultra-high end applications.
Key strategic design decisions made early in the development cycle often have far-reaching impact on the overall results achieved with the final design. Xilinx offers many product solutions with single and multiple on-chip processing elements, such as multiple MicroBlaze™ processors or ARM® Cortex™-A9 processors, DMA engines, communications, video, and DSP IP. Evaluation Kits and Targeted Design Platforms are available to serve both as sample system designs and as advanced FPGA development platforms for the underlying FPGA selection.
EECatalog Tech Videos
Our AXIS software provides libraries for signal processing and inter-processor communications along with graphical tools to facilitate system visualization and rapid prototyping.
At DESIGN West 2012 (aka "ESC" San Jose), Senior Editor Chris A. Ciufo sat down with TI's Matt Kurtz, Manager, Wireless Connectivity Group. Matt's group's job is to add wireless capabilities to microcontrollers with "everything from ANT to ZigBee". Consider their SimpleLink initiative, which is comprised of chipsets, protocols, APIs and drivers that make easy the task of adding wireless to a TI microcontroller product. In this short video, Matt explains that TI's focus is one-stop-shopping and simplicity. Judging from market feedback, TI has met its goals.
The TMDX5535eZdsp is a small form factor, very low cost USB-powered DSP development kit which includes all the hardware and software needed to evaluate the C553x generation, which is the industry’s lowest-cost and lowest power 16-bit DSP.
Introducing the C66x Lite Evaluation Module, the cost-efficient development tool from Texas Instruments that enables developers to quickly get started working on designs for the C6670, C6672, C6674, and C6678 multicore DSPs based on the KeyStone architecture.
Machine Vision demosttration using OpenCV on Texas Instruments' C6-Integra(TM) platform.
Software graphical development for TI's C6000(TM) Digital Signal Processors using C6EZFlo
In this video, you will gain insight into TI’s Sitara™ family of high performance, ARM-based microprocessors (MPUs). The Sitara family further shows TI’s commitment to continued investment and innovation in the ARM architecture. The Sitara family includes high-performance and highly integrated ARM9™ and Cortex™-A8 cores with speed offerings ranging from 375 MHz (ARM9) to 1.5 GHz (Cortex-A8).