Octavo Systems LLC

OSD335x System-In-Package Family The Smallest AM335x Based Module

Sitara™ Processors: AM335x ARM® Cortex™- A8

The OSD335x Family of System-In-Package (SiP) devices from Octavo Systems are the fastest and most cost-effective way to develop and deploy Embedded Linux Systems based on the Texas Instruments Sitara™ AM335x processors.

At their core, the OSD335x devices have the powerful Sitara™ AM335x ARM® Cortex®-A8 processor running up to 1GHz. Along with the processor, the OSD335x Family integrates up to 1GB of DDR3, TPS65217C Power Management IC, TL5209 LDO, EEPROM (optional), and passive components into a single easy to use BGA package.

The devices in the OSD335x Family utilize System-In-Package technology to deliver a complete Embedded Linux system in a single IC package. This integration allows designers to quickly create the smallest possible footprint and get into production easier!

All the devices in the OSD335x Family provide full access to the AM335x including the PRUs. They are also compatible with all the existing development tools and platforms for the AM335x, including the popular BeagleBone® Black. There are also several development boards with an active community around the OSD335x devices to help through the development cycle.

FEATURES & BENEFITS

  • Smallest Footprint: Over 60% smaller than an equivalent design with discrete components.
  • Faster Design: Integrated DDR and Power Managements means no complicated DDR Routing or Power Sequencing.
  • Easier Production: Integration into a BGA package means standard handling on the production line.
  • Simplified Supply Chain: Over 100 components integrated into 1, including DDR3.
  • Available Design Resources: Compatible with existing AM335x development tools. Several open source community supported development boards.

 

TECHNICAL SPECS

  • Integrates AM335x Processor running up to 1GHz, up to 1GB DDR3, TPS6521C PMIC, TL5209 LDO, EEPROM (optional), passives into single BGA package.
  • Two (2) Package Options:
    • 21mmX21mm (0.83inX0.83in) 256 Ball BGA.
    • 27mmX27mm (1.06inX1.06in) 400 Ball BGA.
    • Both utilize a 1.27mm (50mil) ball pitch.
  •  Access to all AM335x peripherals including PRUs
  • Operating Case Temp: 0°C to 85°C and -40°C to 85°C
  • Power:
    • In: AC Adapter, USB, Single Cell (1S) Li-Ion/Li-Po Battery
    • Out: 1.8V, 3.3V and Sys

AVAILABILITY
Available now from our distribution partners, Digi-Key and Mouser.

APPLICATION AREAS
Audio, Automotive, Broadband, Communications & Telecom, Computers & Peripherals, Industrial, Medical, Military, Security, Video, Wireless.

 

Contact Information

Octavo Systems LLC

506 W 14th Street
Austin, TX, 78701
USA

tele: (512)861-3400
fax: (512)861-3400
info@octavosystems.com
octavosystems.com

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