IEC 61850 is an Ethernet-based protocol standard used mainly in substations for data communication. Substations use a number of controllers for a variety of purposes, including protection, measurement, detection, alarms, and monitoring.
At the Consumer Electronics Show (CES) on January 7, 2010, Intel® announced 27 new processors in its Core® i3, Core® i5 and Core® i7 families. Significantly for the embedded industry, twelve of these were targeted specifically at embedded applications.
SDR (Software Defined Radio) has revolutionized electronic systems for a variety of applications including communications, data acquisition and signal processing.
This handbook shows how DDCs (Digital Downconverters) and DUCs (Digital Upconverters), the fundamental building blocks of SDR, can replace conventional analog receiver designs, offering significant benefits in performance, density and cost.
POWER stands for Performance Optimization with Enhanced RISC. Power architecture is synonymous with performance. Introduced by IBM in 1991, POWER1 was a superscalar design that implemented register renaming andout-of-order execution.
The Power ISA evolved out of IBM’s POWER and later PowerPC architectures. The first version of the Power ISA – v2.03, taken largely from PowerPC v2.02 and PowerPC Book E v1.9, was released in 2006.
With the advent of high-speed serial fabrics, the VME Parallel Bus proved insufficient for the needs of higherperformance embedded systems. VPX, also known as VITA 46, is the follow-on to the VME Specification for the next generation of high-speed interconnects for harsh environments.
Demo of ShapeAccelArray™ (SAA), a new monitoring technology that allows engineers to visualize movement in the ground or in solid structures, simply by connecting to the Internet.
The VoiceGP module is a development platform for speech synthesis and voice recognition applications, based on Sensory RSC-4128 mixed signal processor.
Its small size of 42 x 72 mm and the two connectors at the edges with 2.54mm pin spacing, make it suitable for prototype boards and breadboard friendly.
The engine beneath the hood of the new IBM POWER7 systems, this processor chip has eight cores with four threads per core for a total of 32 threads per chip! Use of IBM's embedded DRAM technology enabled 32 megabytes of L3 cache memory giving the chip massive bandwidth and the system exceptional power efficiency.
Clarence Peckham of RadiSys gives an overview of the markets and applications that are a focus for RadiSys. Hear why ATCA is the ideal platform for high performance, COTS-based solutions and how COM Express is the best choice for mobile or hand-held applications.
Staff Reliability Engineer, Rob Dixon, explains how every single RadiSys product is tested beyond its operating specifications to ensure long-term reliability and functionality in extreme conditions.
Anthony Ambrose discusses how RadiSys' market leadership in communications and embedded computing is addressing the emerging needs of the mil/aero market by providing COTS-based solutions that come with a demonstrated track record of reliability and long-life.