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EECatalog Tech Videos

EdgeCloud Small Cell Technology

EdgeCloud Small Cell Technology

Intel Architecture-based Cloud-RAN

Intel Architecture-based Cloud-RAN

Wireless Communications Cloud

Wireless Communications Cloud

8-bit PIC gives much more, for much, much less

Extreme Low Power XLP 16-bit Development Board

Demo of eXtreme Low Power (XLP) MCUs

XLP 16-Bit Energy Harvesting Development Kit (Microchip Technology)

embeddedcodesource.com

Swissbit Production Overview

The World's Lowest Power in Sleep MCU: nanoWatt XLP from Microchip

Tying the home to the Smart Grid

Nabto offers development help for their worldwide firewall

Parasoft approaches comprehensive testing for embedded software

Automating embedded software testing with Electric Cloud

Microchip's Save More 8-bit Presentation

Introducing: AMD Accelerated Processors for Embedded Applications

A New Era for Lattice

AAEON Digital Signage

Power Line Communication for Building and Home Control, CES 2012.flv

Screaming circuits finds silver lining in economic downturn

Microstick for PIC24F 3V K-Series

Transitioning to IPv6

Transitioning to IPv6

Android™ Accessory Development with chipKIT™ MAX32

Epson Graphics Demo using Microchip Graphics Library

Smart Energy Meters & Monitors Demonstration

8-bit Wireless Development Kit

Windows Embedded 7 Quick Start Demo on an EBX Atom™ SBC

CX5010, CX5020 | Fanless Embedded PC in a compact design

CX5010, CX5020 | Fanless Embedded PC in a compact design

Embedded Migration

ARM DS-5 Debugger Linux kernel debug example with DSTREAM and BeagleBoard setup

Industry Research

  • Interactive Displays Produced Measurable ROI and Sales Uplift for the Same Products Compared to Stores without Digital Signage

    BrightSign, LLC®, a trusted name in the digital signage industry, announced today that the North American Retail Hardware Association (NRHA) has published the results of research

  • Three Chinese Cellphone Suppliers Join the Top 10 According to Forward Concepts

    New Cellular & Tablet Chip study claimed to be the most comprehensive available Forward Concepts has announced the publication of its newest in-depth annual study of the worldwide

Calendar of Events

  • Energy Harvesting & Storage Europe

    Berlin, Germany May 15-16, 2012

  • Screenmedia Expo 2012

    London, England May 16-17, 2012

  • RTECC - Real-Time & Embedded Computing Conference

    Mahwah, NJ May 17th, 2012

  • ELECTRIC POWER

    Baltimore, MD May 15-17, 2012

  • AnDevCon III

    San Francisco, CA May 14-17, 2012

  • 19th Reconfigurable Architectures Workshop

    Shanghai, China May 21-22, 2012

  • LTE World Summit 2012

    CCIB, Barcelona, Spain May 23-24, 2012

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EECatalog Tech Videos

  • EdgeCloud Small Cell Technology

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  • Intel Architecture-based Cloud-RAN

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  • Wireless Communications Cloud

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  • 8-bit PIC gives much more, for much, much less

    Editor Chris. A. Ciufo gets the low-down from the DESIGN West conference.
    At the recent DESIGN West conference in San Jose (formerly known as "ESC"), Microchip unleashed a new C-compiler strategy for its entire line-up, and a new low-cost 8-bit PIC MCU called the PIC16F178X. I got a chance to chat briefly with Greg Brown, Product Marketing Manager for the MCU8 division of Microchip. Click on the video to hear this on-target 3-minute interview.

    Check out our 3-minute video interview with the product's Marketing Manager to learn more.

  • Extreme Low Power XLP 16-bit Development Board

    http://www.microchip.com/xlp This video shows you all the features available on Microchips XLP 16-bit Development Board for extreme low power application design. The board supports development on PIC24F16KA102, PIC24FJ64GA102 and PIC24FJ64GB002 families of 16-bit PIC® MCUs featuring nanoWatt XLP technology.

  • Demo of eXtreme Low Power (XLP) MCUs

    Today's applications must consume little power, and in extreme cases, last for up to 15-20 years, while running from a single battery. To enable applications like these, products with Microchip's nanoWatt XLP Technology offer the industry's lowest currents for Run and Sleep, where extreme low power applications spend 90%-99% of their time.

  • XLP 16-Bit Energy Harvesting Development Kit (Microchip Technology)

    Solar Energy Harvesting using PIC® MCUs with XLP Technology

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Featured White Papers

  • OpenVPX System Bandwidth: A comparison of 10Gb Ethernet Performance, Serial Rapid IO, and InfiniBand

    This paper compares the bandwidth available to two common types of dataflow for systems based on the VITA 65 CEN16 central switched topology, using three different fabrics – Serial RapidIO (SRIO), 10 Gigabit Ethernet (10GbE), and Double Data Rate InfiniBand (DDR IB).

  • Xilinx Next Generation 28nm FPGA Technology Overview

    Xilinx has chosen 28 nm high-metal gate (HKMG) high performance, low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. This white paper describes the challenges the semiconductor industry faces in addressing market requirements and describes how these can be solved with the right 28 nm process technology. The breakthrough combination of a high performance, low-power process with architectural innovations makes new 28 nm FPGAs well suited for power sensitive applications, bandwidth-intensive, and ultra-high end applications.

  • Maximize System Performance Using Xilinx Based AXI4 Interconnects

    Key strategic design decisions made early in the development cycle often have far-reaching impact on the overall results achieved with the final design. Xilinx offers many product solutions with single and multiple on-chip processing elements, such as multiple MicroBlaze™ processors or ARM® Cortex™-A9 processors, DMA engines, communications, video, and DSP IP. Evaluation Kits and Targeted Design Platforms are available to serve both as sample system designs and as advanced FPGA development platforms for the underlying FPGA selection.

  • Xilinx 7 Series FPGAs: The Logical Advantage

    Configurable logic tiles are the fundamental building blocks of all programmable digital electronic systems. Ever since Xilinx invented the FPGA in the 1980s, configurable logic, in the form of look-up tables and registers, has been an essential component of digital electronics systems across all markets and applications. This white paper describes the features of the configurable logic block in the 28 nm Xilinx 7 series FPGAs, highlighting advantages over previous Xilinx FPGAs and the benefits that these changes bring to the digital design engineer.

  • Lowering Power at 28 nm with Xilinx 7 Series FPGAs

    This white paper describes several aspects of power related to the Xilinx® 28 nm 7 series FPGAs, including the TSMC 28 nm high-k metal gate (HKMG), high performance, low power (28 nm HPL or 28 HPL) process choice. The power benefits afforded by the 28 HPL process and its usefulness across Xilinx's full product offerings is described as well as the architectural innovations and features for power reduction across the dimensions of static power, dynamic power, and I/O power.

  • Getting Started with Artix-7 FPGAs

    Conceived and designed for high-volume markets, Artix-7 FPGAs deliver the lowest power consumption and lowest cost in the 7 series. The family shares the same building blocks as the Kintex-7 and Virtex-7 FPGA architecture on the same 28 nm High Performance, Low Power (HPL) process, but transistor-level design choices enable the Artix-7 family to offer much lower power consumption while still meeting the performance needs of the target applications.

  • LTE-Advanced Signal Generation and Measurement Using SystemVue

    LTE-Advanced is specified as part of Release 10 of the 3GPP specifications and is now approved for 4G IMT-Advanced. This application note introduces key LTE-Advanced techniques, as well as how to use the Agilent SystemVue W1918 LTE-Advanced library to generate various downlink (DL) orthogonal frequencydivision multiple access (OFDMA) and uplink (UL) clustered DFT-spread-OFDM (DFT-S-OFDM) signal sources with MIMO, and to measure closed-loop throughput.

    This application note also introduces LTE-Advanced enhancements to the MIMO channel models, which are available as simulation model set called the W1715 SystemVue MIMO channel builder. This optional model set facilitates simulation-based MIMO over-the-air (OTA) testing using real, observed antenna patterns and standard MIMO fading models, and overcomes a key challenge for 8-layer MIMO system analysis and verification.

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