AXIOMTEK Initiative EPIC Embedded Board with Intel® Core™2 Extreme and Intel® Core™ 2 Duo processors + Mobile Intel® GM45 Express Chipset – EP850

AXIOMTEK Co., Ltd.

Adopting a new generation of Intel® Core™ 2 microarchitecture and Mobile Intel® GM45 Express chipset, EP850 provides more powerful computing capabilities and greater graphics performance for the most demanding needs of today.

AXIOMTEK, an Associate Member of the Intel® Embedded and Communications Alliance (ECA), a community of communications and embedded developers and solution providers, is pleased to launch a high performance EPIC embedded platform, EP850, which now supports Intel® processors on 45nm process technology in addition to 65nm processors. The EP850 EPIC single board computer supports Socket P for superior Intel® Core™2 Extreme and Intel®, Core™2 Duo and processors with a 667/800/1066 MHz front side bus and features the Mobile Intel GM45 Express chipset and Intel® I/O Controller Hub 9M that makes a platform of extreme lowpower embedded solution and enhanced graphics interfaces for media market. With quad-core Intel® processor technology, the EP850 provides the excellent performance to handle multitasking and to run multiple applications simultaneously. This EPIC platform is specially suited for the solutions which need more effective computing, management & security, and excellent graphics performance, such as digital video recorder (DVR), digital security surveillance, gaming machine, entertainment, visual inspection instruments and video server.

High Performance Intel® Core™ 2 Duo Processor – based EPIC Platform — EP850 (AXIOMTEK)

Powered by latest Mobile Intel GM45 Express chipset and with super compact standard form factor (165 x 115 mm), the EP850 can deliver precise solution, greatest graphics performance, network remote control and management and Intel® Matrix Storage Technology. When combined with Intel Core™2 Extreme and Core™2 Duo processors, this impressive embedded platform helps users deploy exceptionally responsive, highperformance embedded and industrial solutions. A built-in display port based on micro-packet protocol allows easy expansion of the standard and delivers on the promise of digital displays.

Onboard one dual-channel DDR3 SO-DIMM socket has a maximum memory capacity of 4GB. The integrated graphics engine built into the chipset delivers powerful graphics performance and richer visual color, and EP850 has a maximum video memory of up to 256MB, which is shared by the system memory (CRT resolution 2048 x 1536, LVDS resolution 1920 x 1200); its 3-D enhancements enable greater flexibility and scalability. This EPIC SBC supports 32-bit and 64-bit operating systems like Microsoft® Windows® XP, Vista® and embedded OS like Linux. Besides, CompactFlash™ socket for SSD (via SATA-to-parallel ATA IDE controller to support CompactFlash™) is also available for Windows® Vista® ReadyBoost function.

This board features Trusted Platform Module (TPM) 1.2 which is particularly designed to enhance platform security above-and-beyond the capabilities of today’s software. Defined by the Trusted Computing Group’s public specification, the TPM provides hardware-based protection for the encryption and digital signature keys that secure user’s data’s confidentiality. To meet a wide range of application needs, the board has integrated two SATA ports with transfer rate up to 3 GB/s and provides one PCI-104 slot typically required in applications needed a large number of peripheral cards are installed as well as +12V only power support.

Available with two Gigabit Ethernet ports thru PCIe interface, the EP850 provides perfect network connectivity for network environments. Moreover, it comes with rich I/O features include two mainstream SATA-II connectors, six high-speed USB 2.0 ports, two PS/2 (keyboard and mouse) ports, and two COM ports (RS-232), and CompactFlash™ type II socket. Other features include digital I/O, hardware monitoring and Watchdog Timer (1~255 seconds) which monitoring system for user.

The EP850 is RoHS compliance and will be available in Q3, 2008. For more product information and embedded boards, please visit global website www. axiomtek.com or contact our sales representative at info@axiomtek.com.

KEY FEATURES

Socket P for Intel® Core™2 Extreme, Intel® Core™2 Duo and Intel® Celeron® processors with a 667/800/1066 MHz front side bus
1x 204-pin DDR3 SO-DIMM slot support up to 4GB memory capacity
High performance integrated graphic controller
Display Port supported
Two Serial ATA ports support data transfer rate up to 3Gb/s
One PCI-104 for 32-bit PCI expansion
6 USB 2.0 ports, Dual Gigabit Ethernet and 2 COM ports
HD Audio

Share and Enjoy:

This entry was posted on Thursday, September 11th, 2008 at 3:55 pm and is filed under Article.

Calendar of Events

EECatalog Tech Videos

Swissbit Production Overview

Swissbit is a global leader in the design, development and manufacture of DRAM and Flash memory products for the Industrial and Original Equipment Manufacturer (OEM) markets. Swissbit produces high reliability / high-density DRAM memory modules and Flash based devices for use in both commercial and industrial environments.

AAEON Digital Signage

AAEON digital signage products represent the future of media delivery and live advertising. AAEON offers high end digital signage products that allow for the delivery of content that can be interactive and easily updated. With an infinite number of applications, the possibilities are endless.

Embedded Migration

Intel's Max Domeika talks about migration techniques for the embedded Atom processor.

Intel® Thinking Differently About Embedded Security

Intel Labs continues to make powerful new security capabilities available to the embedded industry.

The View From Intel

Max Domeika talks to Low-Power Engineering about the impact of power and how that is affecting everything from embedded to multicore software.

Intel's Dadi Perlmutter Keynote Highlights IDF 2010

In his day one keynote at the Intel Developer Forum, Intel Executive Vice President Dadi Perlmutter focused on the benefits consumers and businesses will derive from Intel's forthcoming second generation flagship product code-named Sandy Bridge.

IDF 2010 Intel CEO Keynote -- Ain't Seen Nothin' Yet

Intel CEO Paul Otellini kicked off IDF 2010 in San Francisco on September 13, 2010 with a keynote highlighting several trends that will drive future industry growth.

Featured White Papers

Applying “Sandy Bridge” to Embedded Applications

Market demand continues to grow for high-performance imaging, communications and security systems. Solutions need to contain scalable power-efficient processors with better integrated graphics capabilities than ever before. From imaging to communications to security to raw scalar throughput, the second generation Intel® Core™ processors (formerly codenamed Sandy Bridge) combining with C206, Q67 and QM67 chipsets offer either a simple, power-efficient upgrade or a massive architectural simplification.

Linking Early Mechatronic System Analysis to Physical Testing

Mechatronic system design creation and test development are often at opposite ends of a project's schedule. Benefits accrue in improved system quality and on-time delivery when design and test are pursued concurrently. This paper describes the technologies required to make concurrent design and test possible.

Best Practice Development Processes for Medical Device FPGAs

For FPGA developers working on designs for medical devices, one approach to dealing with regulatory uncertainty is to borrow heavily from design assurance processes in other safety-critical industries, such as avionics, where standards are well established. These well-established standards mandate a development flow that is controlled, auditable and perhaps most important, specific to the requirements of hardware engineering. While following such a flow will not guarantee smooth sailing though every regulatory approval process for FPGA devices bound for medical applications, it is consistent with basic regulatory intent - to demonstrate to auditors that complex devices meet their requirements and perform well under all foreseeable conditions.

Kontron’s 2nd generation of Intel® Core™ processor boards feature the 1st generation of cross-platform middleware

The highly integrated 2nd generation of Intel® Core™ processors will populate all major standard embedded form factors ranging from smallform- factor to high-performance designs.

A Primer on Obtaining IEC 61850-3 Certification for Embedded Computers

IEC 61850 is an Ethernet-based protocol standard used mainly in substations for data communication. Substations use a number of controllers for a variety of purposes, including protection, measurement, detection, alarms, and monitoring.