Rugged COM Express® Module with 3rd Generation Intel® Core™ i7 Processor for Small Form Factor Systems


The XPedite7450 is a rugged COM Express® module that complies with the PICMG COM Express Basic form factor (95mm x 125mm) and supports an enhanced Type 6 pinout. It is available with the quad-core Core i7-3612QE or dual-core Core i7-2655LE, Core i7-2610UE, Core i7-3555LE, or Core i7-3517UE processors. The XPedite7450 features up to 16 GB of DDR3-1333/DRR3-1600 ECC SDRAM, an integrated high-performance 3D graphics controller, five Gen2 PCI Express ports, four USB 2.0 high-speed ports, six SATA 3.0 Gb/s ports, and an Intel High Definition Audio port. BSPs for Linux, INTEGRITY, and VxWorks and Windows drivers are available.

Features & Benefits
Designed and tested for the harshest military, aerospace, and industrial environments, the XPedite7450 is a rugged, reliable COTS processor mezzanine solution with enhancements above and beyond commercial COM Express modules.

  • Incorporates the same design and manufacturing principles as all X-ES Level 5 rugged products
  • Designed and tested for operation from -40 to +85ºC
  • Replaces less rugged/reliable SO-DIMMs with soldered-down memory
  • Includes additional mounting holes for increased structural integrity
  • Provides extended shock and vibration capabilities for operation in harsh environments
  • Supports conduction-cooled and air-cooled applications with a single board design
  • Utilizes tin-lead manufacturing process to mitigate tin-whisker effects (RoHS-compliant process is also available)
  • Provides BIT support


Contact Information

Extreme Engineering Solutions, Inc.

3225 Deming Way, Suite 120
Middleton, WI, 53562

tele: 608-833-1155
fax: 608-827-6171

Share and Enjoy:
  • Digg
  • Sphinn
  • Facebook
  • Mixx
  • Google
  • TwitThis
Extension Media websites place cookies on your device to give you the best user experience. By using our websites, you agree to placement of these cookies and to our Privacy Policy. Please click here to accept.