congatec’s new line of Intel-based Thin Mini-ITX boards



congatec, Inc., a leading technology company for embedded computer modules, single board computers and EDM services, is expanding its successful product range with new industrial Thin Mini-ITX motherboards. The conga-IC87 is based on 4th generation Intel® Core™ single-chip processors (codenamed Haswell) and the conga-IA3 is based on the new Intel® Atom™ E3800 series (codenamed Bay Trail).

The flat design of Thin Mini-ITX – measuring 25mm in height with I/O-Shield – enables flat housings, such as those required for panel PCs. With the launch of the conga-IC87 and the conga-IA3, congatec has risen to the challenge of supporting customers who need high quality SBCs with long term availability and common embedded requirements such as BIOS modifications, boot screen implementation, and compatibility for special displays and operating systems. The new Thin Mini-ITX form factor combines the advantages of congatec’s extensive experience in integrating high-quality computer modules, with the cost advantages of high-volume SBC production.

The Core i-series processors found on the conga-IC87 support AES-NI hardware encryption and AVX2 accelerated vector multiplications. The i5 and i7 processors additionally support Turbo Boost Technology 2.0 clock speed acceleration, AMT9.5 management functions and Trusted Execution Technology (TXT). While the Intel® Celeron™ HD Gen7 graphics only supports standard features, the powerful HD4400 (i3, i5) and HD5000 (i7) graphics enable demanding graphics processing up to frequencies of 1000 MHz (Celeron, i3) and 1100 MHz (i5, i7). All processors support up to three independent displays with up to 3840 x 2160 pixel resolution at 60 Hz by DisplayPort and 4096 x 2304 at 24 Hz, as well as 1920 x 1200 pixel at 60 Hz by HDMI, or full 4K resolution with 3840 x 2160 pixels for the Core i-series. The hardware supports or directly accelerates DirectX 11.1, OpenGL 3.2, OpenCL 1.2 plus high-performance, flexible hardware decoding to decode multiple high-resolution full HD videos in parallel. Two DisplayPort connections (DP++) are located on the back of the board; in compliance with the Thin Mini-ITX specification, an additional DisplayPort (eDP) and 2×24 Bit LVDS can be realized via an internal DISP connector.

The two SODIMM sockets can be equipped with up to 16 GB SODIMM DDR3L memory. Four USB 3.0 SuperSpeed ports (backward compatible with USB 2.0) are directly available on the I/O shield, four more USB 2.0 ports can be connected via an internal interface. A total of two 5 Gb/s PCI Express 2.0 lanes can be used as 1x mPCIe Half Size, 1x PCIe Full Size (shared with PCIe x1 and mSATA) and 1x PCIe x1 (shared with mSATA/mPCIe). Four SATA interfaces with up to 6 Gb/s (one of them also available as mSATA), plus a mini PCIe and SIM card slot allow quick and flexible system extensions. Two Intel I210 Gigabit Ethernet controllers each provide one Gigabit Ethernet LAN access via the two RJ45 sockets. ACPI 5.0, I2C bus and LPC bus allow easy integration of legacy I/O interfaces. An optional security module (TPM), real-time clock (RTC), Intel high-definition audio and a universal power source with 12 to 19 volts (optional 6 to 24 volts) complete the feature set.

The Atom™-based conga-IA3’s two SODIMM sockets can be equipped with up to 8 GB of onboard DDR3L memory. For semi-embedded applications Intel® Celeron™ versions are available that offer even higher performance. The integrated Intel® Gen7 graphics supports DirectX 11, OpenGL 3.2, OpenCL 1.2 plus high-performance, flexible hardware decoding to decode multiple high-resolution full HD videos in parallel. The processor natively supports up to 2,560 x 1,600 pixel resolution with DisplayPort and 1,920 x 1,200 pixels with HDMI, and it is possible to connect up to two independent display interfaces. A DisplayPort (DP ++) and a VGA port are provided on the back of the board; an additional embedded DisplayPort (eDP) and 2×24 Bit LVDS can be realized via an internal DISP connector.

Native USB 3.0 support ensures fast data transmission with low power consumption. A total of three USB 3.0 SuperSpeed ports (two of them USB 2.0 backwards compatible) and four additional USB 2.0 ports are available. Two 5 Gb/s PCI Express 2.0 lanes can be used as 1x mPCIe Half Size, 1x PCIe Full Size (shared with PCIe x1 and mSATA) and 1x PCIe x1 (shared with mSATA/mPCIe). Two SATA 3.0 interfaces with up to 6 Gb/s (one of them also available as mSATA) allow quick and flexible system extensions. Two Intel I211 Gigabit Ethernet controllers each provide one Gigabit Ethernet LAN access via the two RJ45 sockets. ACPI 5.0, I2C bus and LPC bus allow easy integration of legacy I/O interfaces. An optional security module (TPM), real-time clock (RTC), Intel high-definition audio and a universal power source with 12 to 24 volts complete the feature set.

Contact Information

congatec, Inc.

6262 Ferris Square
San Diego, CA, 92121
USA

tele: 858-457-2600 x 304
fax: 1 858-457-2602
www.congatec.us

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