News
June - 2017
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- Intel Demonstrates Future of High-Performance Computing and Artificial Intelligence Capabilities
As new digital economies continue to rise across industries from biomedicine research to autonomous driving, generating a plethora of data, there is a great demand for high-performance computing (HPC) to advance systems for scalability and agility to support optimal data use in compute, storage, memory, network and security. At the 2017 International Supercomputing Conference (ISC 17), Intel demonstrated that to manage these diverse workloads efficiently, HPC systems will need to evolve to enable new levels of performance, scalability, memory bandwidth and I/O capabilities.
- MagnaChip to Offer 0.13 micron BCD Process Technology with High-Density Embedded Flash
MagnaChip Semiconductor Corp. now offers 0.13 micron BCD process technology integrated with high-density embedded Flash that offers 40V power LDMOS and delivers 64K Bytes flash memory.
- The Portwell CMVL-1U12B Software-Defined Distributed Storage Platform Wins Best of Show Award in the Cloud Platform Category at Interop® Tokyo 2017
American Portwell Technology, Inc. (http://www.portwell.com), a wholly owned subsidiary of Portwell, Inc., a world-leading innovator in the Industrial PC (IPC) market and an Associate
- Artesyn Accelerates Carrier-Grade Open Compute Applications with NVIDIA Tesla P4-Enabled Sled for CG-OpenRack-19
Artesyn Embedded Technologies today announced a new hyperscale media acceleration server sled based on the CG-OpenRack-19 architecture, which is inspired by rack-scale architectures.
- Open architecture IoT or the democratisation of digital data flows
IoT Solutions World Congress has established themselves as the main showcase for demonstrating actual Industrial IoT and accelerating open standards.
- MB991 Micro ATX Motherboard Designed with 7th/6th Gen Intel® Core™ Processors
IBASE, a world leading provider of industrial motherboards and embedded computing solutions announced the new MB991 Micro ATX motherboard designed based on the Intel® Q170 chipset
- Keysight Technologies’ Triple-Output Power Supplies Reduce Power Issues, Enable Engineers to Simulate Power Problems Early in Design Cycle
Simultaneously displays all three color-coded channels on a 4.3â color LCD, provides output stability under extreme, dynamic load conditions
- Intel Showcases Extraordinary PC Gaming and VR Experiences at E3
Intel Announces $1 Million Intel Grand Slam for Esports - Intel Inks Landmark Esports Partnership with ESL, Reveals New VR Esports Tournaments, Announces Pre-Orders for Intel® Coreâ¢
- Cypress Enables USB-C Proliferation in Notebook and Desktop PCs with Market's First Two-port USB-C Controller with Thunderbolt 3 Support
Programmable, Highly-integrated EZ-PD CCG5 Controller Allows Designers to Easily Add Thunderbolt Alternate Mode and USB Power Delivery 3.0 to USB-C Ports in the PC Ecosystem
May - 2017
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- Global Semiconductor Assembly Equipment Market Driven by the Increasing Adoption of Advanced Packaging Techniques: Technavio
-According to the latest market study released by Technavio, the global semiconductor assembly equipment market is projected to grow to USD 5.04 billion by 2021, at a CAGR of nearly 4% over the forecast period.
- COMPUTEX 2017: congatec announces the global availability of its personal integration support
Premium service for high-quality products are the key congatec â a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing
- X-ES Announces Rugged, Intel® Xeon® D Processor-Based COM Express® (Type 7) Mezzanine Module with Dual 10 Gigabit Ethernet & Onboard Storage
Extreme Engineering Solutions (X-ES) is pleased to introduce our first Enhanced COM Express® Basic (Type 7) mezzanine module, the XPedite7650, based on the Intel® Xeon® D-1500 family
- Lanner Joins Blue Orbit Ecosystem to Accelerate SDN and NFV Interoperability for Service Providers
Lanner, the global leading supplier in network communication platforms, today announced its participation in Ciena's Blue Orbit Ecosystem for next generation interoperable SDN and NFV
- Microprocessor and GPU Market Worth 83.69 Billion USD by 2022
The microprocessor and GPU Market is expected to be valued at USD 83.69 Billion by 2022, at a CAGR of 2.2% between 2017 and 2022, according to MarketsandMarkets. According to the new
- Micron Accelerates All-Flash Storage Speed, Performance and Value with New Flexible Petabyte-Scale Enterprise Data Center Solution
All-flash Ceph reference architecture for cloud and local storage runs on Red Hat Ceph storage platform with Micron NVMe solid state drives and Supermicro Ultra SuperServer systems
- New Rugged Networking System Provides Higher Performance in Edge Computing
NetSys-5303 from Elma provides more secure data communications across wireless channels
- Expand Intel Joule IoT Features with MikroElektronika’s New click Shields, Now at Mouser
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the
- Portwell Announces Application-Focused, “RS4U – Ready Solution for You”, Embedded Computer Series
American Portwell Technology, Inc., (http://www.portwell.com), a wholly owned subsidiary of Portwell, Inc., a world-leading innovator in the Industrial PC (IPC) and embedded computing
- Intel Launches Cloud-Inspired 3D NAND SSDs for Data Centers
Intel announced two 3D NAND solid state drives for data centers, the Intel SSD DC P4500 Series and Intel SSD DC P4600 Series, along with reinforcing its commitment to expanding 3D NAND supply.
- Global Semiconductor Sales in March Up 18.1 Percent Year-to-Year
Year-to-year growth is market's largest since October 2010
April - 2017
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- Crystal Group Holds Technology Summit for Global Sales Force
Crystal Group, a leading designer/manufacturer of rugged computer hardware held their annual Technology Summit for global sales partners on April 24 â 26 at the company's headquarters
- Intel Optane memory boosts speed for gaming, Web browsing
Intel Optane memory, announced in March, is available to purchase at a variety of computer component retailers. With the increased speed and responsiveness of Intel Optane memory
- Akitio® Unveils New Node Lite Thunderbolt™ 3 PCIe Box for Mac and Windows
AKITIO today unveiled their new Thunderbolt 3 PCIe box, the Node Lite. The new Node Lite is an upgraded version of their popular Thunder2 PCIe Box. The Node Lite features PCIe Gen 3,
- High Availability Network Appliance for Carrier-grade NFV Network
The concept of NFV is the total integration of essential hardware and software components to build the environment for VNF deployment. NFV requires high-volume, carrier-grade, and open-architecture
- ET970 COM Express CPU Module Powered by 7th Gen Intel® Core™ Processor (formerly Kaby Lake)
IBASE, a leading provider of embedded board and industrial computer solutions, today presents its latest COM Express module supporting the 7th generation of Intel® Core⢠SoC processors
- Cadence Launches the Pegasus Verification System, a Massively Parallel Physical Signoff Solution
Delivers up to 10X improved performance across hundreds of CPUs for full-chip DRC signoff , demonstrated near-linear scalability on up to 960 CPUs, reducing DRC signoff turnaround time from days to hours
- Intel Appoints Chief Strategy Officer
[caption id="attachment_13331" align="aligncenter" width="337" caption="Aicha S. Evans was appointed to the role of chief strategy officer at Intel Corporation on Wednesday, March 29,
- Networking Industry Leaders Join Forces to Expand New Open Source Community to Drive Development of the DPDK Project
Linux Foundation houses DPDK Project to support ecosystem growth
March - 2017
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- Siemens closes Mentor Graphics acquisition
Siemens expands software business by entering the Integrated Circuit design and embedded software segments, Emphasis placed on critical need for both Electronic Systems and IC development tools
- SECO’s broadrange of Intel®-based solutions
The increasing complexity of connected machines and the quick development of IoT infrastructures require enhanced processing power and exceptional efficiency, as well as the ability
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