NXP Cortex-M0 Microcontrollers in High-Volume TSSOP and SO Packages Target 8/16-bit Applications



October 25, 2011 World’s first low-pin-count 32-bit ARM MCUs deliver unprecedented performance and value at $0.01 per MIPS

Eindhoven, Netherlands and San Jose, California, October 25, 2011 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the availability of new low-pin-count package options – SO20, TSSOP20, TSSOP28 and DIP28 – for its market-leading ARM® Cortex™-M0 LPC1100 family of microcontrollers. The new LPC111x devices are the world’s first 32-bit ARM microcontrollers in low-pin-count packages, and open the door for a broader range of applications previously closed to typical 32-bit MCUs due to package footprint or manufacturing constraints. Target applications include human interface devices (HID), consumer electronics, alarm systems, small appliances and simple motor control, among many others. Starting at $0.49, NXP’s low-pin-count devices deliver 50 MIPS of performance compared to the 1 to 5 MIPS performance typical of 8/16-bit MCUs, at a highly competitive price point enabled by NXP’s exceptional capacity in manufacturing high-volume commodity packages.

“Our Cortex-M0 family has grown to become the most complete offering for entry-level 32-bit MCUs, and today we extend it to an unprecedented $0.01-per-MIPS value for traditional 8/16-bit applications,” said Pierre-Yves Lesaicherre, senior vice president and general manager, microcontrollers and logic, NXP Semiconductors. “Shipping over three billion TSSOP and SO packages per year gives us the flexibility and scale to continuously drive towards lower price points and to introduce sub-40 cent 32-bit MCU solutions in 2012.”

With the world’s smallest 32-bit MCU, the LPC1102, available in a 2-mm x 2-mm Chip-Scale Package (CSP), NXP is at the forefront of innovation in microcontroller packaging and has the widest selection of package options for Cortex-M0 MCUs. The introduction of the new low-pin-count package options provide reduced footprint and system-cost benefit to customers throughout the product development cycle. SO and DIP packages provide ease of customer prototyping with the ability to hand-solder, simplifying hardware requirements for programming and debugging. TSSOP packages eliminate potential reflow process in high-volume production. These easy-to-use and highly reliable packages are popular among 8/16-bit customers and help minimize the number of manufacturing processes while improving yield to further reduce overall system costs. Existing LPC1100 customers can easily convert their designs to the LPC111x low-pin-count devices and reuse their software due to the identical Cortex-M0 instruction set. In addition, these low-pin-count packages are designed for easy PCB layout and scalability by sharing the same pin-out for VDD, VSS, GND, and XTAL.

The LPC1100 series can execute sophisticated algorithms at low power, meeting the ever-increasing demands of cost-sensitive applications that 8-bit microcontrollers struggle to achieve, such as interfacing with sensors and performing complex control tasks. For example, a 16-bit multiply operation performed by an 8-bit microcontroller requires 48 clock cycles at over 770 uA/MHz, while an LPC1100 device can complete the same task in 1 cycle at 130 uA/MHz.

Contact Information

NXP Semiconductors


www.nxp.com/microcontrollers

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