NXP Expands Transistor Portfolio in Ultra-Small DFN1006 Package

Industry’s Broadest Portfolio in Space-Saving 1-mm x 0.6-mm Package Includes 60 Bipolar Transistors and 12 Small-Signal MOSFETs, Available Immediately

EINDHOVEN, THE NETHERLANDS and HAMBURG, GERMANY–(Marketwire) – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the expansion of its transistor portfolio in the ultra-small discrete flat no-leads package DFN1006B-3 (SOT883B). NXP now offers 60 bipolar transistors (BJT) and 12 small-signal single N- and P-channel Trench MOSFETs in the 1-mm x 0.6-mm x 0.37-mm DFN plastic SMD package — the industry’s largest portfolio in the smallest transistor package (DFN1006) available today.

The expanded portfolio includes a wide range of general purpose and switching transistors, such as the industry standard types BC847 and BC857, as well as PMBT3904 and PMBT3906. It also features a broad choice of 42 resistor equipped transistors (RETs), which cover all standard resistor combinations.

In addition, NXP offers highly efficient BJTs and MOSFETs that contribute to lower power consumption and longer battery life for all mobile applications. The low saturation voltage transistor PBSS2515MB can handle peak currents of up to 1 A, while featuring an ultra-low saturation voltage of 150 mV. NXP’s 20-60 V MOSFETs such as the PMZB290UN feature extremely low on-resistance down to 250 mΩ, which reduces conduction losses.

These products are ideal for diverse power conversion and switching functionalities in small, thin and battery-driven electronic devices such as smartphones, MP3 players, tablets and eReaders. They are also well suited for non-mobile but similarly space-constrained applications, such as LED TV sets and automotive dashboards.

The new DFN1006B-3 portfolio offers the same high electrical and thermal performance as equivalent devices in much larger packages such as SOT23, SOT323 or SOT416, allowing a 1:1 replacement. This saves valuable space on the PCB, as the 1006 mm (0402 inch) sized leadless package has only one-tenth the footprint and less than half the height of SOT23.

“In the race to miniaturize power switching applications, DFN1006 gives engineers a head start and has tremendous potential to replace SOT23 as the new standard,” said Joachim Stange, product marketing manager, bipolar small-signal transistors, NXP Semiconductors. “By offering the industry’s broadest portfolio in DFN1006, along with the ability to deliver very large quantities, we are ready to support our customers for a smooth transition to this ultra-small transistor package.”


About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP’s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP’s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers’ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP’s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP’s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

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NXP Semiconductors


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